Patents by Inventor Yun-Bo Yang
Yun-Bo Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10338134Abstract: In an interface board for testing a multichip package, the multichip package includes a first type semiconductor chip and a second type semiconductor chip, the interface board includes a first surface facing the multichip package and a second surface facing a test apparatus, the first surface includes upper terminals that are electrically connected to terminals of the multichip package, the second surface includes lower terminals that are electrically connected to the test apparatus, and the upper terminals include a first upper terminal group for testing the first type semiconductor chip and a second upper terminal group for testing whether a crack defect exists in the second type semiconductor chip.Type: GrantFiled: October 25, 2016Date of Patent: July 2, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Min-Chul Jun, Yun-Bo Yang, Dong-Ho Lee, Tae-Hwan Oh, Dong-Han Yoon
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Publication number: 20170139004Abstract: In an interface board for testing a multichip package, the multichip package includes a first type semiconductor chip and a second type semiconductor chip, the interface board includes a first surface facing the multichip package and a second surface facing a test apparatus, the first surface includes upper terminals that are electrically connected to terminals of the multichip package, the second surface includes lower terminals that are electrically connected to the test apparatus, and the upper terminals include a first upper terminal group for testing the first type semiconductor chip and a second upper terminal group for testing whether a crack defect exists in the second type semiconductor chip.Type: ApplicationFiled: October 25, 2016Publication date: May 18, 2017Inventors: MIN-CHUL JUN, YUN-BO YANG, DONG-HO LEE, TAE-HWAN OH, DONG-HAN YOON
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Patent number: 9183950Abstract: A memory card includes a memory cell, a connector, a controller, and firmware. The memory cell can switch between a plurality of states. The connector can be connected to an external device and exchange signals including commands and data with the external device. The controller exchanges signals with the connector, analyzes a received signal, and accesses the memory cell to record, retrieve or modify data based on the analysis result. The firmware is located within the controller, controls the operation of the controller, and can be set to a test mode or a user mode. When the firmware receives a test command from the external device and the firmware is set to the test mode, the firmware performs a defect test on the memory cell and transmits the result of the defect test to the external device through the connector.Type: GrantFiled: May 28, 2014Date of Patent: November 10, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yun-Bo Yang, Young-Jae Jung, Kui-Hyun Ro, Sung-Eun Yun
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Publication number: 20150198658Abstract: A method for testing a plurality of semiconductor apparatuses, the method including mounting a plurality of semiconductor apparatuses on a first test board, wherein the plurality of semiconductor apparatuses include test circuits, loading test software into the test circuits, performing, by using the test circuits, self-tests on the plurality of semiconductor apparatuses based on the test software, and removing the plurality of semiconductor apparatuses, Which have completed the self-tests, from the first test board. Upon completion of the loading of the test software, the test software is loaded into test circuits of a plurality of semiconductor apparatuses on a second test board, while the self-tests are performed on the plurality of semiconductor apparatuses on the first test board.Type: ApplicationFiled: March 26, 2015Publication date: July 16, 2015Inventors: Eun-sik Kim, Kil-yeon Kim, Yun-bo Yang, Kui-hyun Ro, Heon-gwon Lee, Young-jae Jung
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Patent number: 9000789Abstract: A method for testing a plurality of semiconductor apparatuses, the method including mounting a plurality of semiconductor apparatuses on a first test board, wherein the plurality of semiconductor apparatuses include test circuits, loading test software into the test circuits, performing, by using the test circuits, self-tests on the plurality of semiconductor apparatuses based on the test software, and removing the plurality of semiconductor apparatuses, which have completed the self-tests, from the first test board. Upon completion of the loading of the test software, the test software is loaded into test circuits of a plurality of semiconductor apparatuses on a second test board, while the self-tests are performed on the plurality of semiconductor apparatuses on the first test board.Type: GrantFiled: September 22, 2011Date of Patent: April 7, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Eun-sik Kim, Kil-yeon Kim, Yun-bo Yang, Kui-hyun Ro, Heon-gwon Lee, Young-jae Jung
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Publication number: 20140281765Abstract: A memory card includes a memory cell, a connector, a controller, and firmware. The memory cell can switch between a plurality of states. The connector can be connected to an external device and exchange signals including commands and data with the external device. The controller exchanges signals with the connector, analyzes a received signal, and accesses the memory cell to record, retrieve or modify data based on the analysis result. The firmware is located within the controller, controls the operation of the controller, and can be set to a test mode or a user mode. When the firmware receives a test command from the external device and the firmware is set to the test mode, the firmware performs a defect test on the memory cell and transmits the result of the defect test to the external device through the connector.Type: ApplicationFiled: May 28, 2014Publication date: September 18, 2014Inventors: Yun-Bo Yang, Young-Jae Jung, Kui-Hyun Ro, Sung-Eun Yun
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Patent number: 8769353Abstract: A memory card includes a memory cell, a connector, a controller, and firmware. The memory cell can switch between a plurality of states. The connector can be connected to an external device and exchange signals including commands and data with the external device. The controller exchanges signals with the connector, analyzes a received signal, and accesses the memory cell to record, retrieve or modify data based on the analysis result. The firmware is located within the controller, controls the operation of the controller, and can be set to a test mode or a user mode. When the firmware receives a test command from the external device and the firmware is set to the test mode, the firmware performs a defect test on the memory cell and transmits the result of the defect test to the external device through the connector.Type: GrantFiled: September 7, 2011Date of Patent: July 1, 2014Assignee: Samsung Electronics Co., Ltd.Inventors: Yun-Bo Yang, Young-Jae Jung, Kui-Hyun Ro, Sung-Eun Yun
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Publication number: 20120146673Abstract: A method for testing a plurality of semiconductor apparatuses, the method including mounting a plurality of semiconductor apparatuses on a first test board, wherein the plurality of semiconductor apparatuses include test circuits, loading test software into the test circuits, performing, by using the test circuits, self-tests on the plurality of semiconductor apparatuses based on the test software, and removing the plurality of semiconductor apparatuses, which have completed the self-tests, from the first test board. Upon completion of the loading of the test software, the test software is loaded into test circuits of a plurality of semiconductor apparatuses on a second test board, while the self-tests are performed on the plurality of semiconductor apparatuses on the first test board.Type: ApplicationFiled: September 22, 2011Publication date: June 14, 2012Inventors: Eun-Sik Kim, Kil-yeon Kim, Yun-bo Yang, Kui-hyun Ro, Heon-gwon Lee, Young-jae Jung
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Publication number: 20120117430Abstract: A memory card includes a memory cell, a connector, a controller, and firmware. The memory cell can switch between a plurality of states. The connector can be connected to an external device and exchange signals including commands and data with the external device. The controller exchanges signals with the connector, analyzes a received signal, and accesses the memory cell to record, retrieve or modify data based on the analysis result. The firmware is located within the controller, controls the operation of the controller, and can be set to a test mode or a user mode. When the firmware receives a test command from the external device and the firmware is set to the test mode, the firmware performs a defect test on the memory cell and transmits the result of the defect test to the external device through the connector.Type: ApplicationFiled: September 7, 2011Publication date: May 10, 2012Inventors: Yun-Bo YANG, Young-Jae JUNG, Kui-Hyun RO, Sung-Eun YUN
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Patent number: 7368933Abstract: A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chips, and storing the measured values of standby current in a database, by using a wafer tester; recognizing a wafer run number of each of semiconductor packages to be tested; downloading measured values of standby current of semiconductor chips corresponding to the recognized wafer run number from the database to a semiconductor package tester; extracting a boundary value defining predetermined upper values of the downloaded measured values of standby current, by using the semiconductor package tester; setting the boundary value as a standby current limit of a program for testing the semiconductor packages by use of the semiconductor package tester; and testing the semiconductor packages based on the standby current limit.Type: GrantFiled: January 18, 2006Date of Patent: May 6, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Moon-Bo Sim, Joo-Seok Kwak, Seong-Su Kim, Yun-Bo Yang, Sun-Ki Kim
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Publication number: 20060158205Abstract: A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number, collecting measured values of standby current of the semiconductor chips, and storing the measured values of standby current in a database, by using a wafer tester; recognizing a wafer run number of each of semiconductor packages to be tested; downloading measured values of standby current of semiconductor chips corresponding to the recognized wafer run number from the database to a semiconductor package tester; extracting a boundary value defining predetermined upper values of the downloaded measured values of standby current, by using the semiconductor package tester; setting the boundary value as a standby current limit of a program for testing the semiconductor packages by use of the semiconductor package tester; and testing the semiconductor packages based on the standby current limit.Type: ApplicationFiled: January 18, 2006Publication date: July 20, 2006Inventors: Moon-Bo Sim, Joo-Seok Kwak, Seong-Su Kim, Yun-Bo Yang, Sun-Ki Kim