Patents by Inventor Yun Chan NAM

Yun Chan NAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125845
    Abstract: Provided is a rubber socket having a structure with a built-in component. In the rubber socket with a built-in component, a connection sheet having components attached to an upper surface, a lower surface, or upper and lower surfaces of a conductive sheet composed of a conductive part and an insulating part is detachably coupled to the upper surface, the lower surface, or the upper and lower surfaces, and a guide sheet made of an inelastic insulating material is attached to an upper side, a lower side, or upper and lower sides of the connection sheet, and characteristics of a tester or a device to be tested may be tested using the components.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 18, 2024
    Applicant: TSE CO., LTD
    Inventors: Seon A. KIM, Yun Chan NAM
  • Publication number: 20240079835
    Abstract: A signal transmission connector including a frame base in which a first through hole and a second through hole are alternately formed and a frame including a frame top plate having a third through hole at each position corresponding to the first through hole and covering a top surface of the frame base. A frame bottom plate having a fourth through hole at each position corresponding to the first through hole and covering a bottom surface of the frame base and a conductive part disposed on a conductive part hole including a first through hole, a third through hole, and a fourth through hole and being in the form of a plurality of conductive particles in the elastic insulating material, wherein the frame is made of an inelastic insulating material. An air layer is formed in the second through hole sealed by the frame top plate and the frame bottom plate.
    Type: Application
    Filed: August 29, 2023
    Publication date: March 7, 2024
    Applicant: TSE CO., LTD
    Inventors: Dea Hyun ROH, Yun Chan NAM