Abstract: A system for treating tin smelting intermediate materials and method for treating the materials is disclosed. The system includes a fuming furnace, an electric settling furnace, a lean slag water quenching pool, a matte ladle, a pulverized coal injection system, a flue gas treatment system and a secondary air supply system; the fuming furnace is connected with the electric settling furnace, the pulverized coal injection system, the flue gas treatment system and the secondary air supply system respectively; the electric settling furnace is also connected with the slag-lean water quenching pool and the matte ladle respectively. The system and method disclosed by the disclosure can efficiently classify, separate and recover tin from other materials, solve the problems of difficult sales and transportation of complex tin-containing smelting intermediate materials and economic loss of discounted sales, and transform hazardous wastes into value-added valuable materials for comprehensive recovery.

Abstract: The present invention provides a time display method and apparatus, and an electronic device. The time display method is applied to the electronic device, including: displaying a time dial, where the time dial includes a target pointer; and adjusting a display mode of the target pointer according to a first parameter of the electronic device, where the display mode of the target pointer includes at least one of the following: a color of the target pointer, a color filling amount of the target pointer, and a display attribute of a target element associated with the target pointer; and in a case that the display mode of the target pointer includes the display attribute of the target element, in a process of adjusting the display attribute of the target element, controlling a position relationship between the target element and the target pointer to remain unchanged.

Abstract: This invention discloses an electronic device, including a first housing; a second housing, where the second housing is slidably connected to the first housing; a first elastic piece, where a first end of the first elastic piece is connected to the second housing; a flexible display screen, where a first end of the flexible display screen is connected to a second end of the first elastic piece, a second end of the flexible display screen is connected to the first housing, and the first housing can drive the second end of the flexible display screen to move; a rotating shaft, where the rotating shaft is rotatably disposed in the second housing, the flexible display screen is in rolling contact with the rotating shaft, and the first housing can drive the flexible display screen to move around the rotating shaft.

Abstract: The invention relates to a monitoring apparatus configured to monitor a processing status of a food item under processing in a food processor, the monitoring apparatus comprising a sensor operable to determine characteristic information related to the food item in the food processor, a controller configured to provide a control signal to the food processor to control an operation of the food processor when the determined characteristic 5 information or a rate of change of the determined characteristic information meets a predetermined criteria.

Abstract: Embodiments of the invention include a computer-implemented method for allocating computing resources. The computer-implemented method includes generating, using a processor, tracing data that results from data traffic processed through multiple data paths by the processor. The processor is used to analyze the tracing data to identify a predicted bottleneck path among the multiple data paths, wherein the predicted bottleneck path include a data path on which a data bottleneck is predicted to occur. The computer resources are allocated to the predicted bottleneck path before the predicted data bottleneck occurs.

Abstract: A real-time pose measurement method of a planar coding target for a vision system. The planar coding target includes a plurality of coding elements, a coding block, a coding template, a minimum identification unit pattern and a coding pattern. Each coding element has a unique coding value, and serial numbers of the coding elements are different from each other. The coding block includes four coding elements that are distributed in the same rectangle ABCD and do not overlap with each other. A center of the coding block is an intersection point O of two diagonals of the rectangle ABCD. A coding value of the coding block is associated with coding values of the four coding elements contained therein.

Abstract: A method includes encapsulating a device die in an encapsulating material, planarizing the device die and the encapsulating material, and forming a first plurality of conductive features electrically coupling to the device die. The step of forming the first plurality of conductive features includes a deposition-and-etching process, which includes depositing a blanket copper-containing layer, forming a patterned photo resist over the blanket copper-containing layer, and etching the blanket copper-containing layer to transfer patterns of the patterned photo resist into the blanket copper-containing layer.

Abstract: A method for manufacturing a tungsten trioxide/silicon nanocomposite structure includes steps as follows. A silicon substrate is provided, wherein a surface of the silicon substrate is formed with a plurality of microstructures. A tungsten trioxide precursor solution is provided, wherein the tungsten trioxide precursor solution is contacted with the silicon substrate. A hydrothermal synthesis step is conducted, wherein the tungsten trioxide precursor solution is reacted to form a plurality of tungsten trioxide particles on the plurality of microstructures, so as to obtain the tungsten trioxide/silicon nanocomposite structure.

Abstract: A method of forming a semiconductor device includes loading a first wafer and a second wafer into a wafer bonding system. A relative humidity within the wafer bonding system is measured a first time. After measuring the relative humidity, the relative humidity within the wafer bonding system may be adjusted to be within a desired range. When the relative humidity is within the desired range, the first wafer is bonded to the second wafer.

Abstract: The present disclosure provides a substrate bonding apparatus capable of temperature monitoring and temperature control. The substrate bonding apparatus comprises a fluid cooling module and a sensor module for detecting temperatures at multiple zones (e.g., two or more zones) within a substrate. The substrate bonding apparatus according to the present disclosure achieves temperature stabilization within the substrate. The substrate bonding apparatus further improves bonding process performance by reducing distortion residual, reducing bubbles on edges of the substrate, and reducing non-bonded area within the substrate.

Abstract: According to a network space search method, an expanded search space is partitioned into multiple network spaces. Each network space includes a plurality of network architectures and is characterized by a first range of network depths and a second range of network widths. The performance of the network spaces is evaluated by sampling respective network architectures with respect to a multi-objective loss function. The evaluated performance is indicated as a probability associated with each network space. The method then identifies a subset of the network spaces that has the highest probabilities, and selects a target network space from the subset based on model complexity.

Abstract: In an embodiment, a wafer bonding system includes a chamber, a gas inlet and a gas outlet configured to control a pressure of the chamber to be in a range from 1×10?2 mbar to 1520 torr, a first wafer chuck having a first surface to support a first wafer, and a second wafer chuck having a second surface to support a second wafer, the second surface being opposite the first surface, the second wafer chuck and the first wafer chuck being movable relative to each other, wherein the second surface that supports the second wafer is divided into zones, wherein a vacuum pressure of each zone is controlled independently of other zones.

Abstract: A method includes encapsulating a device in an encapsulating material, planarizing the encapsulating material and the device, and forming a conductive feature over the encapsulating material and the device. The formation of the conductive feature includes depositing a first conductive material to from a first seed layer, depositing a second conductive material different from the first conductive material over the first seed layer to form a second seed layer, plating a metal region over the second seed layer, performing a first etching on the second seed layer, performing a second etching on the first seed layer, and after the first seed layer is etched, performing a third etching on the second seed layer and the metal region.

Abstract: A package structure including IPD and method of forming the same are provided. The package structure includes a die, an encapsulant laterally encapsulating the die, a first RDL structure disposed on the encapsulant and the die, an IPD disposed on the first RDL structure and an underfill layer. The IPD includes a substrate, a first connector on a first side of the substrate and electrically connected to the first RDL structure, a guard structure on a second side of the substrate opposite to the first side and laterally surrounding a connector region, and a second connector disposed within the connector region and electrically connected to a conductive via embedded in the substrate. The underfill layer is disposed to at least fill a space between the first side of the IPD and the first RDL structure. The underfill layer is separated from the connector region by the guard structure.

Abstract: A method of fabricating a magnetically-controlled graphene-based micro-/nano-motor includes: (a) mixing FeCl3 crystal powder with deionized water to obtain a FeCl3 solution; (b) completely immersing a carbon-based microsphere in the FeCl3 solution; transferring the carbon-based microsphere from the FeCl3 solution followed by heating to allow crystallization of FeCl3 on the surface of the carbon-based microsphere to obtain a FeCl3-carbon-based microsphere; (c) heating the FeCl3-carbon-based microsphere in a vacuum chamber until there is no moisture in the vacuum chamber; continuously removing gas in the vacuum chamber and introducing oxygen; and treating the FeCl3-carbon-based microsphere with a laser in an oxygen-enriched environment to obtain the magnetically controlled graphene-based micro-/nano-motor. A magnetically-controlled graphene-based micro-/nano-motor is further provided.

Abstract: A semiconductor assembly package is provided. The semiconductor package assembly includes a system-on-chip (SOC) package, a memory package and a heat spreader. The SOC package includes a logic die and a first substrate. The logic die has pads on it. The first substrate is electrically connected to the logic die by the pads. The memory package includes a second substrate and a memory die. The second substrate has a top surface and a bottom surface. The memory die is mounted on the top surface of the second substrate and is electrically connected to the second substrate using bonding wires. The heat spreader is disposed between the SOC package and the memory package, wherein the heat spreader is in contact with a back surface of the logic die away from the pads.

Abstract: The disclosure is directed to compositions and methods comprising genetically engineered fibroblasts for inhibiting progression of a cancerous tumor.