Patents by Inventor Yun Chen

Yun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Crystal device and method for manufacturing crystal device
    Patent number: 11764756
    Abstract: A crystal device includes a bearing base, an integrated chip and a conductive adhesive unit. The bearing base includes a conductive seat. The integrated chip includes a principal reference plane facing the conductive seat, and having a first major axis. The conductive adhesive unit has a second major axis and an aspect ratio, and is at least partly disposed between the conductive seat and the integrated chip. The aspect ratio ranges from 1.1 to 1.9. The principal reference plane further has a perpendicular projection straight line defined according to the second major axis. A practical angle is included by the first perpendicular projection straight line and the first major axis, and ranges from 0 degree to 90 degrees.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: September 19, 2023
    Assignee: TAI-SAW TECHNOLOGY CO., LTD.
    Inventors: Cheng-Kang Peng, Kun-Yu Huang, Chi-Yun Chen, Song Tian, Tsung-Pin Yang
  • OPTICAL ELEMENT DRIVING MECHANISM
    Publication number: 20230288658
    Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion, a fixed portion and a sensing assembly. The movable portion is connected with an optical element. The movable portion is movable relative to the fixed portion. The sensing assembly senses whether the movable portion is in a first position relative to the fixed portion.
    Type: Application
    Filed: January 18, 2023
    Publication date: September 14, 2023
    Inventors: Xuan-Huan SU, Yu-Chi KUO, Yung-Yun CHEN, Yi-Ho CHEN, Ying-Jen WANG
  • SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
    Publication number: 20230290824
    Abstract: A method for forming a semiconductor device structure includes forming first nanostructures and second nanostructures over a substrate. The method also includes forming a first metal gate layer surrounding the first nanostructures and over the first nanostructures and the second nanostructures. The method also includes etching back the first metal gate layer over the first nanostructures and the second nanostructures. The method also includes removing the first metal gate layer over the second nanostructures. The method also includes forming a second metal gate layer surrounding the second nanostructures and over the first nanostructures and the second nanostructures.
    Type: Application
    Filed: March 10, 2022
    Publication date: September 14, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Yao YANG, Chia-Wei CHEN, Wei-Cheng HSU, Jo-Chun HUNG, Yung-Hsiang CHAN, Hui-Chi CHEN, Yen-Ta LIN, Te-Fu YEH, Yun-Chen WU, Yen-Ju CHEN, Chih-Ming SUN
  • CLEANING ROBOT
    Publication number: 20230284847
    Abstract: Disclosed is a cleaning robot. The cleaning robot includes a body, a traveling assembly, a rolling brush assembly and a dust suction assembly. The traveling assembly, the rolling brush assembly and the dust suction assembly are arranged on the body. The dust suction assembly includes a dust box arranged in front of the rolling brush assembly in the advancing direction of the cleaning robot. The rolling brush assembly is configured for sweeping garbage on a ground. The dust box is configured for receiving garbage swept by the rolling brush assembly. The present application is beneficial to increasing the volume and storage space of the dust box, reducing the number of times of cleaning the dust box by the user, and improving the user experience.
    Type: Application
    Filed: May 22, 2023
    Publication date: September 14, 2023
    Inventors: JUNBIN ZHANG, WEIJING LIN, MINZHAO XIE, MINHUA SHENG, YUN CHEN, ZHAOQUN ZHU, YU AI, XINGYAN LI
  • Brewing guide device and method and computer-readable media thereof
    Patent number: 11751719
    Abstract: A brewing guide device is provided having a communication device, a processing device, and a display device. The communication device obtains real-time weight information and real-time time information from an electronic scale. In a first brewing stage, the processing device determines whether the flow rate is higher than, equal to or lower than a first threshold according to the real-time weight information and the real-time time information to generate a first display instruction. According to the first instruction, the display device displays a first water line corresponding to the real-time weight information, a first target line corresponding to the first brewing stage, and a first display pattern corresponding to a first display block below the first target line on a display interface, wherein the level of the first water line is lower than or equal to the first target line.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: September 12, 2023
    Assignee: WISTRON CORP.
    Inventors: Shu Jing Lin, Yu Tao Kao, Li-Xuan Sun, Chih-Kang Chen, Tai-Yun Chen
  • BOTTOM DIELECTRIC ISOLATION AND METHODS OF FORMING THE SAME IN FIELD-EFFECT TRANSISTORS
    Publication number: 20230282751
    Abstract: A semiconductor structure includes a substrate and a stacked structure including channel layers interleaved with a metal gate structure. The semiconductor structure also includes an isolation feature disposed between the stacked structure and the substrate, where a bottommost portion of the metal gate structure directly contacts the isolation feature. The semiconductor structure further includes a source/drain feature disposed adjacent the stacked structure and an inner spacer disposed between the metal gate structure and the source/drain feature.
    Type: Application
    Filed: June 6, 2022
    Publication date: September 7, 2023
    Inventors: Chia-Cheng Chen, Yun Chen Teng, Liang-Yin Chen, Yee-Chia Yeo, Tsai-Jung Ho
  • Secure access to shared digital content
    Patent number: 11748456
    Abstract: In a server configured to operate on a network. secured access to shared digital content is implemented in response to a request from a first user to access one or more content items belonging to a second user. Information about the first and second users is analyzed with a machine learning algorithm to determine a relationship between the first user and the second user. The first user is granted or denied access to the one or more content items based on the determined relationship.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: September 5, 2023
    Inventors: David Haydon, Monica Dabaghi, Urson Urbanik, Cullen Coughlin, Yun Chen
  • Magnetically-controlled graphene-based micro-/nano-motor and fabrication method thereof
    Patent number: 11745160
    Abstract: A method of fabricating a magnetically-controlled graphene-based micro-/nano-motor includes: (a) mixing FeCl3 crystal powder with deionized water to obtain a FeCl3 solution; (b) completely immersing a carbon-based microsphere in the FeCl3 solution; transferring the carbon-based microsphere from the FeCl3 solution followed by heating to allow crystallization of FeCl3 on the surface of the carbon-based microsphere to obtain a FeCl3-carbon-based microsphere; (c) heating the FeCl3-carbon-based microsphere in a vacuum chamber until there is no moisture in the vacuum chamber; continuously removing gas in the vacuum chamber and introducing oxygen; and treating the FeCl3-carbon-based microsphere with a laser in an oxygen-enriched environment to obtain the magnetically controlled graphene-based micro-/nano-motor. A magnetically-controlled graphene-based micro-/nano-motor is further provided.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: September 5, 2023
    Assignee: Guangdong University of Technology
    Inventors: Yun Chen, Yuanhui Guo, Bin Xie, Lu Yan, Maoxiang Hou, Xin Chen
  • THERMOPLASTIC VULCANIZATE AND METHOD FOR PREPARING THE SAME
    Publication number: 20230272214
    Abstract: A thermoplastic vulcanizate and a method for preparing the same are provided. The thermoplastic vulcanizate includes a thermoplastic, a cross-linked rubber particle, and a compatibilizer, wherein the cross-linked rubber particle is dispersed in the thermoplastic serving as a continuous phase, wherein the cross-linked rubber particle is a product of a composition via a cross-linking reaction. The composition includes an ethylene copolymer and a cross-linking agent, wherein the weight ratio of the thermoplastic to the ethylene copolymer is 3:17 to 1:1.
    Type: Application
    Filed: February 23, 2023
    Publication date: August 31, 2023
    Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, FORMOSA PLASTICS CORPORATION
    Inventors: Jin-An WU, Fu-Ming CHIEN, Yun-Chen CHANG, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Ying-Cheng WENG, Shih-Hsun LIN
  • Processes for Reducing Leakage and Improving Adhesion
    Publication number: 20230274976
    Abstract: A method includes forming a metal seed layer on a dielectric layer, and forming a patterned mask over the metal seed layer. An opening in the patterned mask is over a first portion of the dielectric layer, and the patterned mask overlaps a second portion of the dielectric layer. The method further includes plating a metal region in the opening, removing the patterned mask to expose portions of the metal seed layer, etching the exposed portions of the metal seed layer, performing a plasma treatment on a surface of the second portion of the dielectric layer, and performing an etching process on the surface of the second portion of the dielectric layer.
    Type: Application
    Filed: April 18, 2023
    Publication date: August 31, 2023
    Inventors: Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo, Chen-Hua Yu
  • Process including a re-etching process for forming a semiconductor structure
    Patent number: 11742317
    Abstract: A method includes encapsulating a device in an encapsulating material, planarizing the encapsulating material and the device, and forming a conductive feature over the encapsulating material and the device. The formation of the conductive feature includes depositing a first conductive material to from a first seed layer, depositing a second conductive material different from the first conductive material over the first seed layer to form a second seed layer, plating a metal region over the second seed layer, performing a first etching on the second seed layer, performing a second etching on the first seed layer, and after the first seed layer is etched, performing a third etching on the second seed layer and the metal region.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: August 29, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo, Chen-Hua Yu
  • Method for synthesizing artepillin C and intermediate compound thereof
    Patent number: 11739044
    Abstract: The present invention relates to a method for synthesizing artepillin C and a synthetic method for synthesizing an intermediate compound for use in preparing artepillin C. The structural formula of artepillin C is shown in the following formula (IV), and the intermediate compound is shown in the following formula (II). The synthesis method includes the following steps: a first reaction step: in the presence of a base initiator, a compound A shown in formula I and 3,3-dimethylallyl bromide are mixed, the reaction continues for a first reaction time and is stopped to generate an intermediate of artepillin C shown in formula II; and a second reaction step: the intermediate of artepillin C is dissolved in an aqueous alcohol solution and then mixed with an alkali metal salt, and the reaction continues for a second reaction time to generate artepillin C.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: August 29, 2023
    Assignee: GWO XI STEM CELL APPLIED TECHNOLOGY CO., LTD.
    Inventors: Ming-Hsi Chuang, Lin-Hsiang Chuang, Ming-Hsuan Lu, Wen-Peng Shen, Yun-Chen Lin, Chi-Hsuan Chuang
  • THERMOELECTRIC POLYMER FILM, MANUFACTURING METHOD THEREOF, POWER SUPPLY DEVICE AND TEMPERATURE CONTROL DEVICE
    Publication number: 20230270008
    Abstract: A method for manufacturing a thermoelectric polymer film includes steps as follows . A conductive polymer liquid and a plurality of carbon nanotubes are mixed to form a mixture. The mixture is coated on a substrate to form a film precursor. Two electrode parts are arranged on the film precursor. An electric field is applied to the film precursor through the two electrode parts at a room temperature, so as to change an arrangement of the plurality of carbon nanotubes, such that the thermoelectric polymer film is formed.
    Type: Application
    Filed: March 3, 2022
    Publication date: August 24, 2023
    Applicant: National Cheng Kung University
    Inventors: Chia-Yun Chen, Kuan-Yi Kuo, Po-Hsuan Hsiao, Yi-Yin Lin
  • OPTICAL ELEMENT DRIVING MECHANISM
    Publication number: 20230266579
    Abstract: An optical element driving mechanism, which drives an optical element, includes a fixed portion, a first movable portion, and a driving assembly. The first movable portion is moved relative to the fixed portion, and the driving assembly drives the first movable portion to move relative to the fixed portion. The first movable portion is moved in a first dimension relative to the fixed portion, and the first movable portion drives the optical element to move.
    Type: Application
    Filed: February 23, 2023
    Publication date: August 24, 2023
    Inventors: Yung-Yun CHEN, Yu-Chi KUO, Xuan-Huan SU
  • Use of genomic NW_006882077.1 in CHO cell for stably expressing a protein
    Patent number: 11732276
    Abstract: Use of genomic NW_006882077.1 in CHO cell for stably expressing a protein is disclosed. The certain site in CHO cell genome for stably expressing a protein is positioned at a base of No. 691045 in a CHO cell gene NW_006882077.1; a sequence of 5? NNNNNNNNNNNNNNNNNNNNNGG3? that can be identified by CRISPR/Cas9 technology and positioned in a base range of No. 690980-691090 around the certain site is a target sequence. Various of protein genes are introduced into a fixed site in CHO cell genome, and expressed stably in the present disclosure.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: August 22, 2023
    Assignee: Jiangnan University
    Inventors: Huazhong Li, Yun Chen, Jian Jin, Songtao Zhou, Zuoying Duan, Xiaohai Gong
  • SEMICONDUCTOR PACKAGES
    Publication number: 20230260977
    Abstract: Various embodiments of a 3DIC die package, including trench capacitors integrated with IC dies, are disclosed. A 3DIC die package includes a first IC die and a second IC die disposed on the first IC die. The first IC die includes a substrate having a first surface and a second surface opposite to the first surface, a first active device disposed on the first surface of the substrate, and a passive device disposed on the second surface of the substrate. The passive device includes a plurality of trenches disposed in the substrate and through the second surface of the substrate, first and second conductive layers disposed in the plurality of trenches and on the second surface of the substrate, and a first dielectric layer disposed between the first and second conductive layers. The second IC die includes a second active device.
    Type: Application
    Filed: October 7, 2022
    Publication date: August 17, 2023
    Applicant: MediaTek Inc.
    Inventors: Hsiao-Yun CHEN, Chi-Hung HUANG, Yao-Tsung HUANG, Cheng-Jyi CHANG, Sheng Chieh CHANG
  • Semiconductor device and method
    Patent number: 11728406
    Abstract: A method for forming a semiconductor device and a semiconductor device formed by the method are disclosed. In an embodiment, the method includes depositing a dummy dielectric layer on a fin extending from a substrate; depositing a dummy gate seed layer on the dummy dielectric layer; reflowing the dummy gate seed layer; etching the dummy gate seed layer; and selectively depositing a dummy gate material over the dummy gate seed layer, the dummy gate material and the dummy gate seed layer constituting a dummy gate.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: De-Wei Yu, Cheng-Po Chau, Yun Chen Teng
  • BEAM-COLUMN JOINT OF PRECAST CONCRETE COLUMN AND CONSTRUCTION METHOD THEREOF
    Publication number: 20230250625
    Abstract: A beam-column joint of a concrete precast column and a construction method thereof, including: obtaining a hoop plate, in which an inner side of the hoop plate is provided with studs; welding a circumferential reinforcing plate in the hoop plate; arranging longitudinal bars and stirrups for bundling the longitudinal bars; pouring the upper precast column and the lower precast column with the circumferential reinforcing plates in the two hoop plates as the boundary support formwork; welding the hoop plate of the upper precast column with the hoop plate of the lower precast column; arranging a horizontal beam at the hoop plate, and connect the horizontal beam with the hoop plate. The upper precast column and the lower precast column are connected by welding hoop plate; the hoop plate is used to connect the precast column and the horizontal beam.
    Type: Application
    Filed: February 10, 2021
    Publication date: August 10, 2023
    Applicant: HAINAN UNIVERSITY
    Inventor: Yun CHEN
  • DRIVING MECHANISM
    Publication number: 20230236477
    Abstract: A driving mechanism for moving an optical element is provided, including a fixed part, a movable part, movably connected to the fixed part, a positioning structure, and a driving assembly. The optical element is disposed on the movable part, and the positioning structure is formed on the fixed part to restrict the movable part in a specific position relative to the fixed part. The driving assembly is configured to drive the movable part to move relative to the fixed part.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 27, 2023
    Inventors: Xuan-Huan SU, Ko-Lun CHAO, Yu-Chi KUO, Yung-Yun CHEN
  • OPTICAL ELEMENT DRIVING MECHANISM
    Publication number: 20230236476
    Abstract: An optical element driving mechanism is provided in the present disclosure, including a fixed portion, a first movable portion, and a driving assembly. The first movable portion is movable relative to the fixed portion. The driving assembly drives the first movable portion to move relative to the fixed portion. The first movable portion brings an optical element to move.
    Type: Application
    Filed: January 19, 2023
    Publication date: July 27, 2023
    Inventors: Yung-Yun CHEN, Yu-Chi KUO, Xuan-Huan SU