Patents by Inventor Yun Chen

Yun Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240159521
    Abstract: A three-dimensional measurement method combines the three-step phase shift method to embed the marker line information into the sinusoidal stripe pattern to obtain the target stripe pattern. The target stripe pattern is projected onto the surface of the object to be measured, and the wrapped phase image, mean intensity image and modulated intensity image of the stripe pattern collected by the left and right cameras are solved. The mask image according to the mean intensity image and modulation intensity image is solved to extract the marker line. The spatial phase unwrapping starting from the marker line in the wrapped phase image is performed to obtain the spatial phase. The spatial phase matching based on the unique correspondence between the left and right cameras based on the spatial phase of the marker line is performed, the best matching point of the right camera is obtained.
    Type: Application
    Filed: January 25, 2024
    Publication date: May 16, 2024
    Inventors: Jian GAO, Yizhong ZHUANG, Lanyu ZHANG, Haixiang DENG, Yun CHEN, Xin CHEN
  • Publication number: 20240153786
    Abstract: A method includes bonding a package component to a composite carrier. The composite carrier includes a base carrier and an absorption layer, and the absorption layer is between the base carrier and the package component. A laser beam is projected onto the composite carrier. The laser beam penetrates through the base carrier to ablate the absorption layer. The base carrier may then be separated from the package component.
    Type: Application
    Filed: January 11, 2024
    Publication date: May 9, 2024
    Inventors: Huicheng Chang, Jyh-Cherng Sheu, Chen-Fong Tsai, Yun Chen Teng, Han-De Chen, Yee-Chia Yeo
  • Publication number: 20240145706
    Abstract: The present invention provides a core-shell cathode characterized by comprising: a shell comprising an electrically conductive, porous carbon material; and a core, which is an inner cavity enclosed within the shell, wherein the core contains an active material and an electrolyte, and the active material comprises liquid polysulfide having the general formula Li2Sx, wherein 4?x?8; the shell comprises a first layer, an O-ring and a second layer sequentially stacked from bottom to top to form the inner cavity to contain the active material and the electrolyte. The present invention also provides a lithium-sulfur battery using said core-shell cathode, which attains both high sulfur loading and high sulfur content, and simultaneously satisfies high energy density, high capacity retention and high cycle stability under lean-electrolyte condition.
    Type: Application
    Filed: December 23, 2022
    Publication date: May 2, 2024
    Applicant: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Sheng-Heng CHUNG, Yun-Chen WU
  • Patent number: 11969716
    Abstract: This application discloses a silicon carbide (SiC)-loaded graphene photocatalyst for hydrogen production under visible light irradiation and a preparation method thereof. Pure SiC and pure black carbon are respectively prepared and mixed to obtain a mixture with a resistance less than 100?. Then the mixture was vacuumized and processed with a current pulse with an increasing voltage until a breakdown occurs, and subjected to ultrasonic stirring, centrifugal washing and vacuum drying in turn to obtain the SiC-loaded graphene photocatalyst. By means of the current pulse, a heterojunction is formed between SiC and graphene to improve the catalytic activity of the photocatalyst; and the photocatalytic hydrogen production rate of SiC nanoparticles can be enhanced after loaded on the graphene.
    Type: Grant
    Filed: June 21, 2023
    Date of Patent: April 30, 2024
    Assignee: Guangdong University of Technology
    Inventors: Yun Chen, Shengbao Lai, Biao Li, Zuohui Liu, Guanhai Wen, Maoxiang Hou, Xin Chen
  • Patent number: 11969771
    Abstract: A method of fabricating a film vibration device, including: photoetching a surface of a silicon wafer to form a circular-hole array; etching an aluminum layer on the silicon wafer; etching the silicon wafer to form a through-hole array to obtain a porous silicon wafer; attaching a polyethylene terephthalate (PET) sheet to a side of the porous silicon wafer; ablating the PET sheet to obtain a porous PET film; attaching a polyvinylidene fluoride (PVDF) film to a lower side of the porous silicon wafer; performing vacuumization above the porous silicon wafer, while heating the PVDF film below the porous silicon wafer to create dome micro-structures on the PVDF film; and laminating the porous PET film on each of two sides of the PVDF film to obtain the film vibration device. This application also provides a cleaning device having the film vibration device.
    Type: Grant
    Filed: July 26, 2023
    Date of Patent: April 30, 2024
    Assignee: Guangdong University of Technology
    Inventors: Yun Chen, Biao Li, Aoke Song, Shankun Dong, Shengbao Lai, Maoxiang Hou, Xin Chen
  • Publication number: 20240133995
    Abstract: In an aspect, a method performed by a network node includes obtaining a first plurality of radio frequency fingerprint positioning (RFFP) measurements corresponding to a plurality of known displacements between positions of a user equipment (UE); and training a positioning model to provide a position estimate of the UE, wherein the training of the positioning model is at least based on the first plurality of RFFP measurements and the known displacements between the positions of the UE corresponding to the first plurality of RFFP measurements.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 25, 2024
    Inventors: Mohammed Ali Mohammed HIRZALLAH, Srinivas YERRAMALLI, Yun CHEN, Rajat PRAKASH, Taesang YOO
  • Publication number: 20240132412
    Abstract: In one aspect, the present disclosure relates to doped thermoelectric oxide ceramic compositions comprising stable cerium oxide nanoinclusions. In a further aspect, the thermoelectric oxide ceramic compositions comprise calcium cobaltite ceramic with a dopant, such as bismuth. The disclosed doped thermoelectric ceramic oxide compositions comprising ceramic oxide nanoinclusions have reduced thermal conductivity and an increased energy conversion efficiency as compared to a conventional doped thermoelectric oxide ceramic material without cerium oxide nanoninclusions. Also disclosed herein are methods for making the doped thermoelectric ceramic oxide compositions.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 25, 2024
    Inventors: Xueyan SONG, Cesar-Octavio ROMO-DE-LA-CRUZ, Geoffroy GAUNEAU, Liang LIANG, Yun CHEN
  • Patent number: 11963450
    Abstract: A method for manufacturing a core-shell coaxial gallium nitride (GaN) piezoelectric nanogenerator is provided. A mask covering a center part of a gallium nitride wafer is removed. An electrodeless photoelectrochemical etching is performed on the gallium nitride wafer to form a primary GaN nanowire array on a surface of the gallium nitride wafer. A precious metal layer provided on the surface of the gallium nitride wafer is removed and an alumina layer is deposited on the surface of the gallium nitride wafer to cover the primary GaN nanowire array to obtain a core-shell coaxial GaN nanowire array. A first conductive layer is provided on a flexible substrate to which the core-shell coaxial GaN nanowire array is transferred. A second conductive layer is provided at a top end of the core-shell coaxial GaN nanowire array, and is connected to an external circuit to obtain the core-shell coaxial GaN piezoelectric nanogenerator.
    Type: Grant
    Filed: August 11, 2023
    Date of Patent: April 16, 2024
    Assignee: Guangdong University of Technology
    Inventors: Yun Chen, Pengfei Yu, Aoke Song, Zijian Li, Maoxiang Hou, Xin Chen
  • Publication number: 20240120314
    Abstract: Methods of ion implantation combined with annealing using a pulsed laser or a furnace for cutting substrate in forming semiconductor devices and semiconductor devices including the same are disclosed. In an embodiment, a method includes forming a transistor structure of a device on a first semiconductor substrate; forming a front-side interconnect structure over a front side of the transistor structure; bonding a carrier substrate to the front-side interconnect structure; implanting ions into the first semiconductor substrate to form an implantation region of the first semiconductor substrate; and removing the first semiconductor substrate. Removing the first semiconductor substrate includes applying an annealing process to separate the implantation region from a remainder region of the first semiconductor substrate. The method also includes forming a back-side interconnect structure over a back side of the transistor structure.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 11, 2024
    Inventors: Huicheng Chang, Jyh-Cherng Sheu, Chen-Fong Tsai, Yun Chen Teng, Han-De Chen, Yee-Chia Yeo
  • Publication number: 20240115079
    Abstract: A food preparation system weighs ingredients added to a receptacle. For identified ingredient and its added weight, a corresponding amount of a set of different sugar type is estimated, and a total sugar content and a sweetness index of the overall recipe is derived. The system determines if there are suitable alternative recipes with reduced total sugar content and similar sweetness index and suggests such determined alternative recipes to the user.
    Type: Application
    Filed: January 24, 2022
    Publication date: April 11, 2024
    Applicant: KONINKLIJKE PHILIPS N.V.
    Inventors: Yun CHEN, Anna Louise WIJNOLTZ, Henriette Christine Marie HOONHOUT, Jasper DE VREEDE
  • Publication number: 20240113166
    Abstract: A method for fabricating semiconductor devices includes forming channel regions over a substrate. The channel regions, in parallel with one another, extend along a first lateral direction. Each channel region includes at least a respective pair of epitaxial structures. The method includes forming a gate structure over the channel regions, wherein the gate structure extends along a second lateral direction. The method includes removing, through a first etching process, a portion of the gate structure that was disposed over a first one of the channel regions. The method includes removing, through a second etching process, a portion of the first channel region. The second etching process includes one silicon etching process and one silicon oxide deposition process. The method includes removing, through a third etching process controlled based on a pulse signal, a portion of the substrate that was disposed below the removed portion of the first channel region.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Ging Lin, Chun-Liang Lai, Yun-Chen Wu, Ya-Yi Tsai, Shu-Yuan Ku, Shun-Hui Yang
  • Publication number: 20240113187
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having one or more interior surfaces forming a recess within an upper surface of the substrate. Source/drain regions are disposed within the substrate on opposing sides of the recess. A first gate dielectric is arranged along the one or more interior surfaces forming the recess, and a second gate dielectric is arranged on the first gate dielectric and within the recess. A gate electrode is disposed on the second gate dielectric. The second gate dielectric includes one or more protrusions that extend outward from a recessed upper surface of the second gate dielectric and that are arranged along opposing sides of the second gate dielectric.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Jhu-Min Song, Ying-Chou Chen, Yi-Kai Ciou, Chien-Chih Chou, Fei-Yun Chen, Yu-Chang Jong, Chi-Te Lin
  • Publication number: 20240099528
    Abstract: Disclosed is a cleaning robot. The cleaning robot includes a body, a traveling assembly, a rolling brush assembly, a dust suction assembly, a mopping assembly, and a universal wheel. The traveling assembly, the rolling brush assembly, the dust suction assembly, the mopping assembly, and the universal wheel are all arranged on the body. The dust suction assembly includes a dust box. The rolling brush assembly is configured for sweeping garbage on a ground. The dust box is configured for receiving garbage swept by the rolling brush assembly. In an advancing direction of the cleaning robot, the dust box is arranged in front of the rolling brush assembly, and the mopping assembly and/or the universal wheel is arranged behind the rolling brush assembly.
    Type: Application
    Filed: December 7, 2023
    Publication date: March 28, 2024
    Inventors: JUNBIN ZHANG, WEIJING LIN, MINZHAO XIE, MINHUA SHENG, YUN CHEN, ZHAOQUN ZHU, YU AI, XINGYAN LI
  • Publication number: 20240105909
    Abstract: A secondary battery and an electrochemical device are provided. The secondary battery includes a positive electrode plate, a separator, an electrolyte solution, and a negative electrode plate. The negative electrode plate includes a negative electrode current collector, and a negative electrode active material layer disposed on the negative electrode current collector. Non-faradaic electric quantity Q C of the negative electrode plate satisfies: 0.05?Q?2.5, wherein Q=CdlĂ—?U, Cdl nF is non-faradaic capacitance of the negative electrode plate, and ?U V is potential interval of the negative electrode active material layer.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: Sunwoda Mobility Energy Technology Co., Ltd.
    Inventors: Man LI, Yun CHEN, Peng LIU, Chunbo CHU
  • Publication number: 20240094600
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly and a first driving assembly. The movable assembly is movable relative to the fixed assembly. The first driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The optical element driving mechanism further includes a first opening, and an external light beam travels along a first axis to pass through the first opening.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Inventors: Tso-Hsiang WU, Chao-Chang HU, Yung-Yun CHEN, Ya-Hsiu WU
  • Publication number: 20240096861
    Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes first semiconductor die, a second semiconductor die and a memory package. The first semiconductor die and the second semiconductor die are stacked on each other. The first semiconductor die includes a first interface and a third interface. The first interface overlaps and is electrically connected to the second interface arranged on the second semiconductor die. The third interface is arranged on a first edge of the first semiconductor die. The memory package is disposed beside the first semiconductor die, wherein the memory package is electrically connected to the first semiconductor die by the third interface.
    Type: Application
    Filed: August 23, 2023
    Publication date: March 21, 2024
    Inventors: Che-Hung KUO, Hsiao-Yun CHEN, Wen-Pin CHU, Chun-Hsiang HUANG
  • Publication number: 20240097051
    Abstract: A Schottky diode includes a substrate, a first drift region in the substrate, a second drift region in the substrate, a first dielectric layer disposed over the substrate, a first doped region in the first drift region, a second doped region in the second drift region, a third doped region in the first drift region, and a metal field plate disposed over the first dielectric layer. The first drift region and the first doped region include a first conductivity type. The second drift region, the second doped region and third doped region include a second conductivity type complementary to the first conductivity type. The first dielectric layer overlaps a portion of the first drift region and a portion of the second drift region. The second doped region is separated from the first doped region.
    Type: Application
    Filed: January 16, 2023
    Publication date: March 21, 2024
    Inventors: GUAN-YI LI, CHIA-CHENG HO, CHAN-YU HUNG, FEI-YUN CHEN
  • Patent number: 11926456
    Abstract: A reconfigurable container-closure system is comprised of first (10) and second containers (110) and first (12) and second closures (112). The container-closure system can assume either of two configurations. The first configuration means that the first closure (12) is secured to the first container (10), and the second closure (112) is secured to the second container (110). Also, an orifice reducer, cartridge and piston are all attached to the second closure (112), and two products are separated. Second configuration means that the second closure (112) is secured to the first container (10), and the first closure (12) is secured to the second container (110). Also, the orifice reducer, cartridge and piston are all attached to the first container (10), and two products are allowed to mix and be dispensed. The transfer is accomplished by a user who simply screws the second closure (112) onto the first container (10).
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: March 12, 2024
    Assignee: ELC Management LLC
    Inventor: Yun Chen
  • Publication number: 20240074616
    Abstract: Disclosed is a food processing apparatus having a food processing chamber, comprising a blade arrangement and a motor arranged to drive the blade arrangement. The blade arrangement comprises a body having a surface arrangement delimiting a cavity and a plurality of cutting blades extending from the surface arrangement into the cavity.
    Type: Application
    Filed: December 14, 2021
    Publication date: March 7, 2024
    Applicant: KONINKLIJKE PHILIPS N.V.
    Inventors: Jingwei TAN, Declan Patrick KELLY, Yun CHEN, Paul Bernard Joseph HIGGINS
  • Publication number: 20240069358
    Abstract: Provided is a glasses structure, mainly including a frame, two temples, a lens unit and two blocking walls. Both sides of the frames are respectively provided with a first magnetic seat. Each of the temples is pivotally connected to both sides of the frame. The lens unit includes a lens body and a second magnetic seat arranged on both sides of the lens body. Each of the second magnetic seats can be magnetically attracted to each of the first magnetic seats. Each of the blocking walls and both sides of the frame jointly surround two sides of the lens unit. The lens unit is fixed on the frame by means of a magnetic manner, and the lens unit can be detached from the frame such that users can replace the lens unit by themselves.
    Type: Application
    Filed: August 9, 2023
    Publication date: February 29, 2024
    Inventor: Lin-Yun Chen