Abstract: A Dual-directional Silicon Controlled Rectifier (DSCR) includes a substrate of a first conductivity type, a buried layer formed on the substrate and of a second conductivity type, a first well and a second well formed on the buried layer and of the first conductivity type, a third well formed between the first well and the second well and of the second conductivity type, and a doped region formed between a first semiconductor region and a third semiconductor region and of the second conductivity type. The doped region includes a part of the third well. The DSCR may regulate a breakdown voltage of a junction thereof. Therefore, when an I/O voltage of an Integrated Circuit (IC) is much higher than a working voltage, a false action may not occur.

Abstract: A pulse width modulation (PWM) controlling module, includes: a PWM controller, a load detector, and an adjusting module. The PWM controller generates a PWM signal that is utilized for controlling a supply voltage applied to an electronic system. The load detector, coupled to the PWM controller, detects a load of the electronic system according to the PWM signal and generates a decision value accordingly. The adjusting module, coupled to the PWM controller and the load detector, controls the PWM controller to adjust the PWM signal according to the decision value.

Abstract: A pulse width modulation (PWM) controlling module, includes: a PWM controller, a load detector, and an adjusting module. The PWM controller generates a PWM signal that is utilized for controlling a supply voltage applied to an electronic system. The load detector, coupled to the PWM controller, detects a load of the electronic system according to the PWM signal and generates a decision value accordingly. The adjusting module, coupled to the PWM controller and the load detector, controls the PWM controller to adjust the PWM signal according to the decision value.

Abstract: An exclusive memory structure applicable for Multi Media Card and Secure Digital Card includes a casing and a substrate, in which the substrate is attached to the casing; a control chip and two or more flash-memory chips are disposed on the substrate; and a plurality of connecting pieces is arranged on the bottom face of the substrate, whereby the storage capacity of a memory card could be enlarged and data could be stored by way of splitting.