Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.

Abstract: A hard water-repellent structure and a method for fabricating the same are provided. The method adopts an atmospheric pressure plasma deposition (APPD) technique to form a hard coating having a rough surface on a substrate, and form a water-repellent coating on the rough surface. Because the hard water-repellent structure includes the hard coating and the water-repellent coating, hardness, abrasion-resistance, transparency and hydrophobicity of the hard water-repellent structure are improved. The hard water-repellent structure protects the substrate from friction. Moreover, because the disclosure adopts the APPD technique to form the hard water-repellent structure, the cost of production is reduced dramatically. Thus, the disclosure can solve drawbacks of prior art.

Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board having a first positing holes and a plurality of second position holes is provided, wherein the first and the second position holes correspond in position to a plurality of through holes on the flexible substrate. A portion of the carrier board material close to the second position holes is removed to form a hole body and a plurality of curved extending arms connected to the hole body and the carrier board. A first dowel pin and a plurality of second dowel pins are provided for inserting into the first positioning hole and the second positioning holes, respectively.

Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board having a first positing holes and a plurality of second position holes is provided, wherein the first and the second position holes correspond in position to a plurality of through holes on the flexible substrate. A portion of the carrier board material close to the second position holes is removed to form a hole body and a plurality of curved extending arms connected to the hole body and the carrier board. A first dowel pin and a plurality of second dowel pins are provided for inserting into the first positioning hole and the second positioning holes, respectively.

Abstract: A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.

Abstract: A clamping device for a flexible substrate is provided. The clamping device includes a carrier board. The carrier board has a fixed positioning assembly and a plurality of movable positioning assemblies. The fixed positioning assembly and the movable positioning assemblies are disposed in locations that almost correspond to a plurality of through holes on the flexible substrate. The fixed positioning assembly includes a hole body with a positioning hole and a dowel pin. Each movable positioning assembly includes a hole body with a positioning hole, a plurality of curved extending arms and a dowel pin. Each curved extending arm is connected to the hole body and the carrier board and the dowel pin is inserted into the positioning hole.

Abstract: A water-repellent structure and a method for fabricating the same are provided. The method adopts an atmospheric pressure plasma deposition (APPD) technique to form a hardened coating having a rough surface on a substrate, and form a water-repellent coating on the rough surface. Because the water-repellent structure includes the hardened coating and the water-repellent coating, hardness, abrasion-resistance, transparency and hydrophobicity of the water-repellent structure are improved. The hard water-repellent structure protects the substrate from friction. Moreover, because the present invention adopts the APPD technique to form the water-repellent structure, the cost of production is reduced dramatically. Thus, the present invention can solve drawbacks of prior art.

Abstract: A fabrication method for an alignment film is proposed. A film is deposited on a substrate by an atmosphere plasma in a predetermined direction at a predetermined angle, while moving the substrate and the atmosphere plasma relative to each other. Thereby, a uniform isotropic alignment film with strong anchoring energy is formed and the pre-tilt angle can be designed according to the need. Problems such as static charge and dust generated during a conventional rubbing process are prevented. In addition, since the above fabrication method eliminates the need of vacuum devices that are required in conventional ion beam alignment and plasma beam alignment processes, the fabrication method can be used to fabricate large sized alignment film. Moreover, fabrication cost is lowered through the use of the fabrication method.

Abstract: A clamping device for a flexible substrate is provided. The clamping device includes a carrier board. The carrier board has a fixed positioning assembly and a plurality of movable positioning assemblies. The fixed positioning assembly and the movable positioning assemblies are disposed in locations that almost correspond to a plurality of through holes on the flexible substrate. The fixed positioning assembly includes a hole body with a positioning hole and a dowel pin. Each movable positioning assembly includes a hole body with a positioning hole, a plurality of curved extending arms and a dowel pin. Each curved extending arm is connected to the hole body and the carrier board and the dowel pin is inserted into the positioning hole.

Abstract: A non-contact pick-up device is disclosed. The non-contact pick-up device mainly includes a disk, and a plurality of air nozzles on the disk. Each nozzle has an air channel; and an upper end of the channel is tilt outwards. Therefore, as a disc-shaped article is placed on the disk; air jets out from the nozzles, due to Bernoulli principle, pressure difference is formed on the disc-shaped article. Thus, due to the action of atmosphere pressure, the disc-shaped article will be clamped. The pick-up device may be used in semiconductor manufacturing process for clamping a wafer.

Abstract: A novel gas control module switch mechanism includes a diaphragm means, a valve body, a piston means and a fastening means. The diaphragm means has a plurality of diaphragms and a seal plate sandwiched between a first and a second diaphragm. The first diaphragm has a center opening to prevent the first diaphragm from making direct sealing contact. Sealing is done through the seal plate. The seal plate is made of a soft material for obtaining improved sealing effect and longer durability. The valve body has a bulged ring around an opening plane and a bulged body ring for enhancing sealing effect when the seal plate making contact with the bulged ring.