Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

Abstract: In examples, a method for manufacturing a package comprises coupling first and second semiconductor dies to a first surface of a conductive terminal; applying a dry film to a second surface of the conductive terminal opposite the first surface; removing a portion of the dry film contacting the second surface to form a dry film opening, the dry film opening having a linear, non-curved edge extending along a width of the conductive terminal; etching the second surface through the dry film opening; removing the dry film; plating the second surface; and sawing through the conductive terminal to form the package.

Abstract: A semiconductor package includes a semiconductor component and a plurality of leads electrically connected to the semiconductor component. Each of the leads has a first surface, and has a second surface opposite from the first surface, with a solderable metal on the first surface and the second surface. The solderable metal has a first average thickness on the first surfaces, and has a second average thickness on the second surfaces. The second average thickness is 10 percent to 80 percent of the first average thickness. The semiconductor package is formed by concurrently electroplating the solderable metal on the first surfaces and on the second surfaces. The solderable metal is electroplated on the first surfaces with a first average current, and is electroplated on the second surfaces with a second average current. The second average current is 10 percent to 80 percent of the first average current.

Abstract: A method for forming integrated circuit (IC) packages includes mounting tape on a mold compound of a strip of flat no-leads IC packages. The method also includes sawing the mold compound of the strip of flat no-leads IC packages to form singulated IC packages mounted on the tape. The method further includes immersing the singulated IC packages in a bath of immersion tin to form immersion tin plating on a flank of leads of the singulated IC packages.

Abstract: In a described example, an example no-lead semiconductor device package includes: a die pad in a central portion of a partially etched leadframe and terminals. The terminals include a device side surface formed in an upper layer of the partially etched leadframe, and a first exterior end in the upper layer; a board side surface formed in a lower layer of the partially etched leadframe extending from the upper layer; a second exterior end in the lower layer, the second exterior end inset from the first exterior end, and an inset portion extending from the first exterior end to the second exterior end. A semiconductor die is mounted to the die pad. Mold compound covers the semiconductor die, the second exterior end of the terminals and the inset portion of the terminals are exposed from the mold compound, with the mold compound extending along sides of the terminals.

Abstract: The disclosure provides a display method and electronic device. In the method, an electronic device displays a first interface, where the first interface includes at least one control and a first folder, the control is displayed outside the first folder, the first folder includes a first page and a second page, the first page and the second page each include at least one application icon, and the first page is displayed on the first interface; the electronic device detects a first operation performed by a user on the first page of the first folder; and the electronic device displays a second interface in response to the first operation, where the second interface includes the at least one control and the second page.

Abstract: The method of the embodiments of the present invention includes: determining, by a first terminal, a desktop drawing file according to a desktop of the first terminal when a first operation of a user received by the first terminal meets a first preconfigured condition, where the desktop drawing file includes a desktop description file and a file package of at least one screen interface on the desktop of the first terminal, the desktop description file includes a location of at least one application interface element on the desktop of the first terminal, and the file package includes a thumbnail of the at least one application interface element; and sharing, by the first terminal, the determined desktop drawing file, so that a second terminal updates a desktop of the second terminal according to the shared desktop drawing file.

Abstract: This application discloses a scrolling screenshot method. When displaying a multi-column interface, an electronic device may receive an operation of triggering scrolling screenshot by a user. In response to the operation, the electronic device may simultaneously/sequentially take scrolling screenshots of a plurality of display areas, to obtain column-wise screenshot images of the display areas. The electronic device may compare lengths of the column-wise screenshot images to obtain a long column-wise screenshot image and a short column-wise screenshot image. The electronic device extends, with reference to a length of the long column-wise screenshot image, the short column-wise screenshot image by a length the same as that of the long column-wise screenshot image, and splices the short column-wise screenshot image and the long column-wise screenshot image together to obtain a long screenshot image. In this way, the long screenshot image with complete content can be obtained.

Abstract: A scrolling screenshot method and an apparatus, the method including displaying, by an electronic device, a first interface that displays a first part of a first page, receiving, by the electronic device, a first input, capturing the first part of the first page in response to the first input, scrolling, by the electronic device in a first direction for display, and capturing a second part of the first page, where the first part is adjacent to the second part, scrolling, after the electronic device captures the second part, by the electronic device, in a second direction, for display, and capturing a third part of the first page, where the second direction is different from the first direction, determining that a first condition is met. and synthesizing a target screenshot image in response, where the target screenshot image comprises the first part, the second part, and the third part.

Abstract: A desktop sharing method, including receiving, by a second terminal, a desktop drawing file shared by a first terminal, where the desktop drawing file includes a desktop description file and a file package of a screen interface on a desktop of the first terminal, the desktop description file includes a location of an application interface element on the desktop of the first terminal, and the file package includes a thumbnail of the application interface element, and replacing, by the second terminal, a desktop of the second terminal with the received desktop drawing file, where replacing a desktop of the second terminal with the received desktop drawing file includes displaying a special mark for a desktop application icon, the application corresponding to the desktop application icon is not installed on the second terminal but the information of the application is in the desktop drawing file shared by the first terminal.

Abstract: An example apparatus includes: a metal leadframe including a die pad in a central portion and leads spaced from the die pad. The leads include: an interior end spaced from the die pad and having a full thickness of the metal leadframe; a central portion connected to the interior end and extending away from the die pad having a partial thickness less than the full thickness; and an exterior end having the full thickness extending from the central portion. A semiconductor die is mounted to the die pad by die attach material. Wire bonds couple bond pads of the semiconductor die to the interior ends of the leads. Mold compound covers the semiconductor die, the die pad, the wire bonds, the interior ends of the leads, the central portion of the leads, and portions of the exterior ends of the leads to form a semiconductor device package.

Abstract: An example semiconductor package comprises a semiconductor die having a top surface, a bond pad formed on the top surface, a bond wire having a first end and a second end, wherein the first end is attached to the bond pad. The semiconductor package having a contact pad, wherein the second end of the wire bond is attached to the contact pad by a stitch bond, the stitch bond having a plateau region formed between a cut end and a ramped portion, wherein a bottom surface of the plateau region forms an attachment to the contact pad.

Abstract: An example integrated circuit (IC) package comprises a DAP having a diamond shape with four corners. The DAP has a first thickness. The IC package has at least one tie bar segment attached to a corner of the DAP. The at least one tie bar segment extends from the DAP to an edge of the IC package. The IC package has at least one contact portion positioned adjacent to a side of the DAP. The at least one contact portions has a second thickness that is greater than the first thickness of the DAP. A semiconductor die mounted on the DAP. A wire bond couples a bond pad on the semiconductor die and a selected one of the contact portions. A molding compound covers the semiconductor die and the bond wire and at least a portion of the DAP and the at least one contact portion.

Abstract: A method includes displaying, by an electronic device, a graphical user interface (GUI) of a first application on a touchscreen of the electronic device, detecting, by the electronic device, a screenshot operation from a user, taking, by the electronic device, a screenshot of the GUI in response to the screenshot operation, displaying, on the touchscreen, a first preview image corresponding to an obtained first screenshot, detecting, by the electronic device, a first touch operation on the first preview image, updating the first preview image to a second preview image in response to the first touch operation, and displaying the second preview image on the touchscreen.

Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of leads including a first lead, wherein the first lead includes a first ball bond. A semiconductor die having a plurality of bond pads including a first bond pad is on the die pad including a second ball bond on the first bond pad and a stitch bond on the second ball bond. A first wirebond connection is between the first ball bond and the stitch bond.

Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

Abstract: A method includes displaying, by an electronic device, a graphical user interface (GUI) of a first application on a touchscreen of the electronic device, detecting, by the electronic device, a screenshot operation from a user, taking, by the electronic device, a screenshot of the GUI in response to the screenshot operation, displaying, on the touchscreen, a first preview image corresponding to an obtained first screenshot, detecting, by the electronic device, a first touch operation on the first preview image, updating the first preview image to a second preview image in response to the first touch operation, and displaying the second preview image on the touchscreen.

Abstract: A method includes displaying, by an electronic device, a graphical user interface (GUI) of a first application on a touchscreen of the electronic device, detecting, by the electronic device, a screenshot operation from a user, taking, by the electronic device, a screenshot of the GUI in response to the screenshot operation, displaying, on the touchscreen, a first preview image corresponding to an obtained first screenshot, detecting, by the electronic device, a first touch operation on the first preview image, updating the first preview image to a second preview image in response to the first touch operation, and displaying the second preview image on the touchscreen.

Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.