Patents by Inventor Yun Fu An

Yun Fu An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaged electronic device with low resistance roughened backside contact
    Patent number: 11404385
    Abstract: In a described example, an electrical apparatus includes: a metal layer formed over a non-device side of a semiconductor device die, the semiconductor device die having devices formed on a device side of the semiconductor device die opposite the non-device side; a first side of the metal layer bonded to a die mount pad on a package substrate; a second side of the metal layer formed over a roughened surface on the non-device side of the semiconductor device die, the roughened surface having an average surface roughness (Ra) between 40 nm and 500 nm; bond pads on the semiconductor device die electrically coupled to conductive leads on the package substrate; and mold compound covering at least a portion of the semiconductor device die and at least a portion of the conductive leads.
    Type: Grant
    Filed: April 6, 2020
    Date of Patent: August 2, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Qin Xu Yu, Jian Jun Kong, She Yu Tang, Yun Fu An
  • PACKAGED ELECTRONIC DEVICE WITH LOW RESISTANCE BACKSIDE CONTACT
    Publication number: 20210159189
    Abstract: In a described example, an electrical apparatus includes: a metal layer formed over a non-device side of a semiconductor device die, the semiconductor device die having devices formed on a device side of the semiconductor device die opposite the non-device side; a first side of the metal layer bonded to a die mount pad on a package substrate; a second side of the metal layer formed over a roughened surface on the non-device side of the semiconductor device die, the roughened surface having an average surface roughness (Ra) between 40 nm and 500 nm; bond pads on the semiconductor device die electrically coupled to conductive leads on the package substrate; and mold compound covering at least a portion of the semiconductor device die and at least a portion of the conductive leads.
    Type: Application
    Filed: April 6, 2020
    Publication date: May 27, 2021
    Inventors: Qin Xu Yu, Jian Jun Kong, She Yu Tang, Yun Fu An