Patents by Inventor Yun Hao
Yun Hao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200365636Abstract: The present disclosure provides an optical structure, including a substrate, a light detection region in the substrate, an isolation structure in the substrate, surrounding the light detection region, a color filter layer over the substrate, and a dielectric grid structure in the color filter layer, the dielectric grid structure overlapping with the light detection region.Type: ApplicationFiled: May 16, 2019Publication date: November 19, 2020Inventors: YUN-HAO CHEN, KUO-YU WU, TSE-HUA LU
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Publication number: 20200311013Abstract: A hard disk status monitoring system for monitoring an operating status of at least one hard disk in real time includes a control unit, a complex programmable logic device, a baseboard management controller, and a display unit. The control unit is configured to acquire a status from the at least one hard disk and generate a corresponding output signal. The complex programmable logic device is configured to receive the output signal generated by the control unit and analyze the output signal to generate a corresponding status signal. The baseboard management controller is configured to receive the status signal generated by the complex programmable logic device and analyze the status signal to generate a corresponding display signal. The display unit is configured to receive the display signal and display the status information of the corresponding hard disk according to the display signal.Type: ApplicationFiled: May 15, 2019Publication date: October 1, 2020Inventors: LI-YUN HAO, DUO QIU
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Publication number: 20200241588Abstract: A method for monitoring working states of hard disks of a system of hard disks in a hard disk module includes a hard disk controller and a complex programmable logic device (CPLD). The hard disk controller and CPLD communicate with the hard disk module. The CPLD receives output signals from the hard disk controller and determines whether rise and fall changes in a clock signal of each output signal are steady. When a level change of the clock signal of one output signal is steady, the CPLD decodes the one output signal. When a level change of the clock signal of one output signal is not steady, the CPLD will stop decoding the one output signal. A related method is also provided.Type: ApplicationFiled: March 19, 2019Publication date: July 30, 2020Inventor: LI-YUN HAO
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Patent number: 10636453Abstract: An electronic device providing visible indications as to the status of each hard disk in an internal hard disk module includes a housing, a display board, and hard disk controller. The display board displays the operating status of each disk of a plurality of hard disks. The housing defines a first mounting area and a second mounting area. The first mounting area and the second mounting area are spaced apart to form a slot, and the viewable display board is slidably mounted to the slot.Type: GrantFiled: March 15, 2019Date of Patent: April 28, 2020Assignee: Shenzhen Fugui Precision Ind. Co., Ltd.Inventors: Li-Yun Hao, Duo Qiu
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Publication number: 20200034397Abstract: A supplemental content provider provides extensions to client devices. The extension receives information on third-party content displayed to a user of a client device, and retrieves a list of supplemental items relevant to the third-party content. The extension displays the list of supplemental items such that users can retain view of the third-party content while browsing the list of relevant items. The extension allows users to view relevant items without submitting search queries or disengaging from the third-party content. The supplemental items may be videos of an online education system. The extension may also allow users to gain access to the supplemental items without opening a new page of the application.Type: ApplicationFiled: July 26, 2019Publication date: January 30, 2020Inventors: Roshan Sumbaly, Raghav Pasari, Yun Hao, Yuan Liu
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Publication number: 20190384698Abstract: A test system including an image capturing apparatus, a server apparatus, and a behavior actuation apparatus is provided. The server apparatus is coupled to the image capturing apparatus, drives the image capturing apparatus to take an image of an application of a device under test, analyzes the image to obtain object information in the image, and obtains a corresponding test procedure based on the object information. The behavior actuation apparatus is coupled to the server apparatus, receives the test procedure from the server apparatus, generates a control signal based on the test procedure, and transmits the control signal to the device under test as an inputting signal of the application.Type: ApplicationFiled: August 27, 2018Publication date: December 19, 2019Applicant: Acer IncorporatedInventors: Ying-Shih Hung, Cheng-Tse Wu, An-Cheng Lee, Yun-Hao Chou, Chao-Kuang Yang
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Patent number: 10355502Abstract: A charging cabinet includes a housing including a plurality of horizontal storage chambers for storing mobile electronic devices, a mounting chamber at a back side relative to the horizontal storage chambers, a plurality of flip covers pivotally mounted at a front panel thereof and biasable to close/open the respective horizontal storage chambers and clocks for locking the respective flip covers, and a power supply unit including a power input module mounted at a back panel of the housing and electrically connectable to an external power source for power input, and a power socket module and an expansion module respectively electrically connected to the power input module with respective power jacks and respective USB connectors thereof arranged at different elevations to face toward the respective horizontal storage chambers for the connection of the respective storage mobile electronic device for charging.Type: GrantFiled: December 8, 2016Date of Patent: July 16, 2019Assignee: CHEN-SOURCE INC.Inventor: Yun-Hao Chen
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Publication number: 20180175646Abstract: The present disclosure illustrates a charging cabinet in which a main body comprises a frame defining a receiving space, a panel disposed on a front surface of the frame, a hinge lid movably disposed on the panel corresponding in position to the receiving space, a locking device disposed at a side of the hinge lid and configured to control open or lock of the hinge lid. The power supply device comprises a power input module connected with an external power source for supplying power to a power socket module and an expansion connection module which comprise a socket and an adaptor socket respectively. An electronic device can be placed into the receiving space to be charged through the power socket module or expansion connection module, and the hinge lid can be locked by the locking device, so as to achieve anti-theft effect.Type: ApplicationFiled: December 15, 2016Publication date: June 21, 2018Inventor: Yun-Hao CHEN
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Publication number: 20180166896Abstract: A charging cabinet includes a housing including a plurality of horizontal storage chambers for storing mobile electronic devices, a mounting chamber at a back side relative to the horizontal storage chambers, a plurality of flip covers pivotally mounted at a front panel thereof and biasable to close/open the respective horizontal storage chambers and clocks for locking the respective flip covers, and a power supply unit including a power input module mounted at a back panel of the housing and electrically connectable to an external power source for power input, and a power socket module and an expansion module respectively electrically connected to the power input module with respective power jacks and respective USB connectors thereof arranged at different elevations to face toward the respective horizontal storage chambers for the connection of the respective storage mobile electronic device for charging.Type: ApplicationFiled: December 8, 2016Publication date: June 14, 2018Inventor: Yun-Hao CHEN
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Publication number: 20170206353Abstract: The present disclosure includes a detection method for files infected by malware, especially ransomware, and an anti-malware system implemented with the method during file transmission, especially for backup or synchronization. Applying the detection method in the present disclosure before file transmission may prevent infection spreading by replace uninfected files with infected files. In one embodiment, the method includes: creating files as “baits” for being accessed by ransomware; and detecting whether files being to be transmitted due to updates including the “baits”. The present disclosure also includes file recovery method while finding malware infection by the detection method of in the present disclosure.Type: ApplicationFiled: October 6, 2016Publication date: July 20, 2017Inventors: BENCHIAO JAI, Chung-Hung Chiang, Jin-Shi Lee, Chi-Tung Tsai, Ching-Ting Liu, Yun-Hao Liang, Chun-Hung Lee
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Patent number: 9150062Abstract: The present invention relates to an articulated chassis system of large articulated vehicle, which comprises a front beam, a spherical hinge connecting structure, a front frame, a turnplate bearing, a rear frame, a rear beam and a turning angle sensing means, the front beam is connected with the front frame through the spherical hinge connecting structure, the turnplate bearing comprises an inner ring and an outer ring, the front frame is connected fixedly with the outer ring/the inner ring, the rear frame is connected fixedly with the inner ring/the outer ring, the inner ring and the outer ring can rotate relatively, the rear frame is connected with the rear beam, the turning angle sensing means is arranged between the inner ring/the outer ring and the front frame/the rear frame.Type: GrantFiled: December 29, 2010Date of Patent: October 6, 2015Inventor: Yun Hao
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Patent number: 9146959Abstract: Data query in a share-nothing database includes obtaining a query request and generating an optimized access plan with respect to the query request. The query request relates to external data stored in an external data source and contains a definition for expected distribution of the external data. The data query also includes obtaining data distribution information related to the expected distribution based on the optimized access plan, transmitting the data distribution information to the external data source so that the external data source splits and returns the external data in accordance with the data distribution information, and executing query-related processing of the split external data in accordance with the optimized access plan.Type: GrantFiled: August 13, 2013Date of Patent: September 29, 2015Assignee: International Business Machines CorporationInventors: Xing Chen, Qing Yun Hao, Yi Jin, Wan Chuan Zhang
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Publication number: 20140095470Abstract: Data query in a share-nothing database includes obtaining a query request and generating an optimized access plan with respect to the query request. The query request relates to external data stored in an external data source and contains a definition for expected distribution of the external data. The data query also includes obtaining data distribution information related to the expected distribution based on the optimized access plan, transmitting the data distribution information to the external data source so that the external data source splits and returns the external data in accordance with the data distribution information, and executing query-related processing of the split external data in accordance with the optimized access plan.Type: ApplicationFiled: August 13, 2013Publication date: April 3, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Xing Chen, Qing Yun Hao, Yi Jin, Wan Chuan Zhang
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Publication number: 20130062860Abstract: The present invention relates to an articulated chassis system of large articulated vehicle, which comprises a front beam, a spherical hinge connecting structure, a front frame, a turnplate bearing, a rear frame, a rear beam and a turning angle sensing means, the front beam is connected with the front frame through the spherical hinge connecting structure, the turnplate bearing comprises an inner ring and an outer ring, the front frame is connected fixedly with the outer ring/the inner ring, the rear frame is connected fixedly with the inner ring/the outer ring, the inner ring and the outer ring can rotate relatively, the rear frame is connected with the rear beam, the turning angle sensing means is arranged between the inner ring/the outer ring and the front frame/the rear frame.Type: ApplicationFiled: December 29, 2010Publication date: March 14, 2013Inventor: Yun Hao
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Publication number: 20110003434Abstract: A semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a substrate unit, a first insulative unit, a first conductive unit, a second conductive unit, and a second insulative unit. The package unit has a central receiving groove and an outer receiving groove formed around the central receiving groove. The semiconductor chip has a plurality of conductive pads. The first insulative unit has a first insulative layer formed between the conductive pads. The first conductive unit has a plurality of first conductive layers. The second conductive unit has a plurality of second conductive layers formed on the first conductive layers. The second insulative unit is formed between the first conductive layers and between the second conductive layers.Type: ApplicationFiled: September 8, 2010Publication date: January 6, 2011Applicant: HARVATEK CORPORATIONInventors: BILY WANG, SUNG-YI HSIAO, YUN-HAO CHANG, JACK CHEN
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Publication number: 20090283881Abstract: A semiconductor chip package structure for achieving face-down electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a substrate unit, a first insulative unit, a first conductive unit, a second conductive unit, and a second insulative unit. The semiconductor chip has a plurality of conductive pads. The first insulative unit has a first insulative layer formed between the conductive pads. The first conductive unit has a plurality of first conductive layers, and one side of each first conductive layer is electrically connected with the corresponding conductive pad. The second conductive unit has a plurality of second conductive layers respectively formed on the first conductive layers. The second insulative unit is formed between the first conductive layers and between the second conductive layers.Type: ApplicationFiled: October 1, 2008Publication date: November 19, 2009Applicant: HARVATEK CORPORATIONInventors: BILY WANG, SUNG-YI HSIAO, YUN-HAO CHANG, JACK CHEN
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Publication number: 20090278159Abstract: A semiconductor chip package structure without substrates for achieving face-up electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative unit, a first conductive unit, a second conductive unit, and a second insulative unit. The package unit has a central receiving groove for receiving the semiconductor chip. The semiconductor chip has a plurality of conductive pads. The first insulative unit has a first insulative layer formed between the conductive pads. The first conductive unit has a plurality of first conductive layers. The second conductive unit has a plurality of second conductive layers formed on the first conductive layers. The second insulative unit is formed between the first conductive layers and between the second conductive layers.Type: ApplicationFiled: October 1, 2008Publication date: November 12, 2009Applicant: HARVATEK CORPORATIONInventors: Bily WANG, Sung-Yi HSIAO, Yun-Hao CHANG, Jack CHEN
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Publication number: 20090230538Abstract: A semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a substrate unit, a first insulative unit, a first conductive unit, a second conductive unit, and a second insulative unit. The package unit has a central receiving groove and an outer receiving groove formed around the central receiving groove. The semiconductor chip has a plurality of conductive pads. The first insulative unit has a first insulative layer formed between the conductive pads. The first conductive unit has a plurality of first conductive layers. The second conductive unit has a plurality of second conductive layers formed on the first conductive layers. The second insulative unit is formed between the first conductive layers and between the second conductive layers.Type: ApplicationFiled: October 1, 2008Publication date: September 17, 2009Applicant: HARVATEK CORPORATIONInventors: BILY WANG, SUNG-YI HSIAO, YUN-HAO CHANG, JACK CHEN