Patents by Inventor Yun-Heng CHEN

Yun-Heng CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11685985
    Abstract: A method of manufacturing a metal mask includes calendering a metal material, so as to form a metal mask substrate, where the metal mask substrate includes a surface and a plurality of grooves formed in the surface, and the grooves all extend in a direction. The surface has at least one sampling region, while at least two grooves are distributed in the sampling region, where an average area ratio of the area of the grooves within the sampling region to the area of the sampling region ranges between 45% and 68%.
    Type: Grant
    Filed: January 17, 2022
    Date of Patent: June 27, 2023
    Assignee: DARWIN PRECISIONS CORPORATION
    Inventors: Yun-Heng Chen, Wen-Yi Lin
  • Publication number: 20230037092
    Abstract: A method of manufacturing a metal mask includes calendering a metal material, so as to form a metal mask substrate, where the metal mask substrate includes a surface and a plurality of grooves formed in the surface, and the grooves all extend in a direction. The surface has at least one sampling region, while at least two grooves are distributed in the sampling region, where an average area ratio of the area of the grooves within the sampling region to the area of the sampling region ranges between 45% and 68%.
    Type: Application
    Filed: October 12, 2022
    Publication date: February 2, 2023
    Inventors: Yun-Heng CHEN, Wen-Yi LIN
  • Publication number: 20220396866
    Abstract: A method of manufacturing a metal mask includes calendering a metal material, so as to form a metal mask substrate, where the metal mask substrate includes a surface and a plurality of grooves formed in the surface, and the grooves all extend in a direction. The surface has at least one sampling region, while at least two grooves are distributed in the sampling region, where an average area ratio of the area of the grooves within the sampling region to the area of the sampling region ranges between 45% and 68%.
    Type: Application
    Filed: January 17, 2022
    Publication date: December 15, 2022
    Inventors: Yun-Heng CHEN, Wen-Yi LIN