Patents by Inventor Yun-Hsiang Pai

Yun-Hsiang Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming a wire bonding substrate
    Patent number: 7877873
    Abstract: A method for forming a wire bonding substrate is disclosed. A substrate comprising a first surface and a second surface is provided. A through hole is formed in the substrate. A conductive layer is formed on the first surface and the second surface of the substrate and covers a sidewall of the through hole. The conductive layer on the first surface of the substrate is patterned to form at least a first conductive pad, and the conductive layer on the second surface of the substrate is patterned to form at least a second conductive pad. An insulating layer is formed on the first surface and the second surface of the substrate and covers the first conductive pad and the second conductive pad. The insulating layer is recessed until top surfaces of the first conductive pad and the second conductive pad are exposed. A first metal layer is electroplated on the first conductive pad by applying current from the second conductive pad to the first conductive pad through the conductive layer passing the through hole.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: February 1, 2011
    Assignee: NAN YA PCB Corp.
    Inventors: Meng-Han Lee, Hung-En Hsu, Wei-Wen Lan, Yun-Hsiang Pai
  • WIRE BONDING SUBSTRATE AND FABRICATION THEREOF
    Publication number: 20090206487
    Abstract: A method for forming a wire bonding substrate is disclosed. A substrate comprising a first surface and a second surface is provided. A through hole is formed in the substrate. A conductive layer is formed on the first surface and the second surface of the substrate and covers a sidewall of the through hole. The conductive layer on the first surface of the substrate is patterned to form at least a first conductive pad, and the conductive layer on the second surface of the substrate is patterned to form at least a second conductive pad. An insulating layer is formed on the first surface and the second surface of the substrate and covers the first conductive pad and the second conductive pad. The insulating layer is recessed until top surfaces of the first conductive pad and the second conductive pad are exposed. A first metal layer is electroplated on the first conductive pad by applying current from the second conductive pad to the first conductive pad through the conductive layer passing the through hole.
    Type: Application
    Filed: April 24, 2008
    Publication date: August 20, 2009
    Applicant: NAN YA PCB CORP.
    Inventors: Meng-Han Lee, Hung-En Hsu, Wei-Wen Lan, Yun-Hsiang Pai