Patents by Inventor Yun-Hwan Jo

Yun-Hwan Jo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8496873
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: July 30, 2013
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim
  • Publication number: 20120272790
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Application
    Filed: June 13, 2012
    Publication date: November 1, 2012
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwi-Jong Lee, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim
  • Publication number: 20100031848
    Abstract: The invention relates to Sn—Cu—Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.
    Type: Application
    Filed: May 8, 2009
    Publication date: February 11, 2010
    Inventors: Kwi-Jong LEE, Hyuck-Mo Lee, Hyun-Joon Song, Yun-Hwan Jo, Ji-Chan Park, Jung-Up Bang, Dong-Hoon Kim