Abstract: The present invention is to provide a machining tool bar in which mechanical machining properties are improved by using high stiffness composite material. According to the present invention, the tool bar includes an adaptor constructed to be coupled to a driving device, a body constructed to be mounted with cutting tools and a tip constructed to be supported by a workpiece, said body is constructed to be mounted with one or more cutting tools, wherein the adaptor and tip are made of metal material, the body is made of composite material having high stiffness, the composite material constructing the body is formed to surround at least a portion of the adaptor and at least a portion of the tip, and the metal material constructing the adaptor and tip and the composite material constructing the body are securely joined to each other in an interface therebetween.

Abstract: An overheated steam oven which discharges overheated steam to an outside after changing the overheated steam of a high temperature into water. The overheated steam oven includes a cabinet to define a cooking cavity therein, an overheated steam generator to supply overheated steam into the cooking cavity, and an overheated steam discharger to discharge the overheated steam from the cooking cavity to the outside after condensing the overheated steam. The overheated steam discharger includes a cooling water path which is provided on a steam discharging path to exchange heat with the overheated steam discharged from the cooking cavity to the outside.

Abstract: An overheated steam oven designed for home use by simplifying a construction and reducing a size of the overheated steam oven, and effectively reduces heat loss due to an insulating construction thereof, and includes an overheated steam discharging structure to discharge the overheated steam to an outside of the overheated steam oven after changing the overheated steam into low temperature water to prevent the overheated steam from burning a user, thermally deteriorating or damaging items around the overheated steam oven, thus having a safety structure, reducing a size and a noise of the overheated steam discharging structure.

Abstract: The present invention is to provide a machining tool bar in which mechanical machining properties are improved by using high stiffness composite material.

Abstract: An apparatus for grinding wafers includes a grind chuck, formed of a soft material having a high elastic modulus, formed on a grind table. A grind unit grinds the wafer held by the grind chuck. Deionized water is supplied onto the wafer by a supply duct. A dam is formed on the grind table to surround the grind chuck, so that the wafer and the grind unit are submerged during grinding of the wafer. Also, an exhaust hole is formed through the grind table within an area surrounded by the dam, to exhaust the deionized water from the area surrounded by the dam.

Abstract: Terminally-branched polymeric prodrug platforms capable of high degrees of loading are disclosed. In preferred aspects of the invention, the prodrug platform releases multiple parent compounds after each branch holding the active agent undergoes a benzyl elimination reaction. Methods of preparing the prodrugs and using the same in the treatment of mammals are also disclosed.

Abstract: Terminally-branched polymeric prodrug platforms capable of high degrees of loading are disclosed. In preferred aspects of the invention, the prodrug platform releases multiple parent compounds after each branch holding the active agent undergoes a benzyl elimination reaction. Methods of preparing the prodrugs and using the same in the treatment of mammals are also disclosed.

Abstract: The present invention is directed to polymeric-prodrug transport forms of the formula: wherein: G is a linear or branched, terminally functionalized polymer residue; Y1 is O, S, or NR1; M is X or Q; wherein X is an electron withdrawing group and Q is a moiety containing a free electron pair positioned three to six atoms from C(═Y1); R1-5 are independently selected from the group consisting of hydrogen, C1-6 alkyls, C3-12 branched alkyls, C3-8 cycloalkyls, C1-6 substituted alkyls, C3-8 substituted cycloalkyls, aryls, substituted aryls, aralkyls, C1-6 heteroalkyls, substituted C1-6 heteroalkyls; R6 is OR7 or N3, NH2, NO2 or CN, where R7 is selected from the same group which defines R1-5; R8-9 are independently selected from the group consisting of hydrogen, fluoro, chloro, bromo, iodo, or R6; and a and n are each independently zero or a positive integer.

Abstract: The present invention relates in general to alkali free grass, and more particularly, to alkali free glass available for use in various kinds of displaying devices including a TFT-LCD and a photo mask. The present invention is alkali free glass comprised, in weight percent, of about 57-61% SiO2, 16-18% Al2O3, 8-11% B2O3, 3-4.5% CaO, 1-5% SrO, 5-8% BaO, 0.1-3% ZnO, being substantially free from alkali metallic oxides and MgO.

Abstract: A back lapping in-line system for semiconductor device fabrication carries out a vinyl covering, a back side grinding, and a vinyl removing for grinding the back side of a wafer in-line with one single process. The back lapping in-line system has a server connected to a network line, a program therein for controlling the in-line processes, and an in-line facility connected to the server by a standard communication line, wherein parts of the in-line facility are assembled in order, and each part carries out its corresponding process according to information communicated to and from the server, and unloads the wafer after it passes through all of the corresponding processes successively. The in-line facility uses a single loading and unloading, and needs no storage space between parts.

Abstract: A method and apparatus for grinding wafers without using an ultraviolet tape attached to the front face of the wafer reduces manufacturing costs, simplifies the grinding process and protects the semiconductor chips formed on the front face of the wafer from being damaged by static electricity. The grinding apparatus uses a grind chuck formed of a soft material having a high elastic modulus and a rising groove formed in the grind chuck. Deionized water is supplied onto the wafer from a first direction. Simultaneously, deionized water or air is supplied into the rising groove of the grind chuck from a second direction opposite to the first direction. The circumferential edge of the wafer overlaps the rising groove, such that the simultaneous supply of deionized water and/or air from the two directions protects the front surface of the wafer from being contaminated by silicon dust.

Abstract: A brushless DC motor having external and internal permanent magnets buried in rotor core in a two-tier structure to form the poles of the rotor, thereby improving efficiency of the motor and reducing vibration and noise, as well.

Abstract: A process for producing semiconductor devices using ultraviolet sensitive tape including the steps of forming a plurality of chips on a first surface of a semiconductor wafer, adhering an ultraviolet sensitive tape to the first surface of the semiconductor wafer, back lapping a second surface of the wafer, opposite to the first surface, and irradiating the ultraviolet sensitive tape with ultraviolet rays to release the ultraviolet sensitive tape from the wafer.

Abstract: A programmable logic array which can produce single level logic or can produce multiple level logic through the use of internal feedback loops. A plurality of input lines intersect a plurality of term lines and can be programmable coupled to the term lines. A number of term lines provide a feedback input which intersects all of the term lines and can be programmably coupled to the tem lines. Teh input lines and the feedback input lines form a single matrix with the term lines.