Patents by Inventor Yun-Jai Choo

Yun-Jai Choo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160010835
    Abstract: A lighting installation assembly includes a first bracket directly or indirectly fixed to a ceiling or a wall surface, and a second bracket fastened to the first bracket in a state in which a lighting is fixed to the second bracket. One of the first bracket and the second bracket is formed with an interlocking wing part and the other is formed with an interlocking blade part configured to be caught on the interlocking wing part. When the second bracket is rotated in a forward direction in a state in which the interlocking wing part is caught on the interlocking blade part, the second bracket is fastened to the first bracket such that the rotation of the second bracket in the forward or backward direction is suppressed. One worker may easily install the lighting installation assembly on a ceiling or a wall surface and rigidly assembly the lighting installation assembly.
    Type: Application
    Filed: September 2, 2014
    Publication date: January 14, 2016
    Inventors: Young Ju LEE, Yun Jai CHOO, Seong Eun OH
  • Publication number: 20100193885
    Abstract: Provided is a condenser microphone that can reduce the size of a product by disposing a support member over a sound hole of a PCB and mounting a chip on the support member. The condenser microphone includes a micro electro mechanical system (MEMS) chip converting a sound into an electrical signal, a substrate including a sound hole through which the sound is introduced, the MEMS chip being mounted to the substrate, a support member over the sound hole, and a semiconductor chip processing the electrical signal converted through the MEMS chip.
    Type: Application
    Filed: April 3, 2008
    Publication date: August 5, 2010
    Inventors: Yun-Jai Choo, Kyung-Ho Kim
  • Publication number: 20100177922
    Abstract: A condenser microphone comprising a substrate disposed on a micro electro mechanical system (MEMS) microphone chip and a circuit part; a package having a ring shape disposed on the substrate with the package surrounding the MEMS microphone chip and the circuit part; an insertion part having a ring shape formed of a conductive material, the insertion part being attached to an inner wall of the package; and an upper plate completely covering the package, wherein the package or the upper plate has an acoustic hole through which sound passes.
    Type: Application
    Filed: April 3, 2008
    Publication date: July 15, 2010
    Inventors: Sung-Ho Park, Yun-Jai Choo