Abstract: A chip-on-film (COF) package includes a base film, a semiconductor chip mounted on a chip mounting region of a top surface of the base film, a plurality of top inner output conductive patterns, a plurality of bottom inner output conductive patterns and a plurality of landing vias. The top inner output conductive patterns are formed on the top surface of the base film and respectively connected to chip inner output pads formed on a bottom surface of the semiconductor chip. The bottom inner output conductive patterns are formed on a bottom surface of the base film. The landing vias are formed to vertically penetrate the base film and to respectively connect the top inner output conductive patterns and the bottom inner output conductive patterns. The landing vias are arranged within the chip mounting region to form a two-dimensional shape.

Abstract: A display driver integrated circuit chip is provided. The display driver integrated circuit chip may include a source driver circuit configured to process gamma data and generate a driving signal in response to a control signal and a clock signal, a gamma data manager circuit configured to provide the gamma data to the source driver circuit, control logic configured to provide the control signal and the clock signal to the source driver circuit, and a memory configured to store data used to operate the source driver circuit, the gamma data manager circuit and the control logic. A gamma signal line used to transmit the gamma data may include a metal line provided on an area other than an area on which the source driver circuit is disposed.

Abstract: A chip-on-film (COF) package includes a base film, a semiconductor chip mounted on a chip mounting region of a top surface of the base film, a plurality of top inner output conductive patterns, a plurality of bottom inner output conductive patterns and a plurality of landing vias. The top inner output conductive patterns are formed on the top surface of the base film and respectively connected to chip inner output pads formed on a bottom surface of the semiconductor chip. The bottom inner output conductive patterns are formed on a bottom surface of the base film. The landing vias are formed to vertically penetrate the base film and to respectively connect the top inner output conductive patterns and the bottom inner output conductive patterns. The landing vias are arranged within the chip mounting region to form a two-dimensional shape.

Abstract: A display driver integrated circuit chip is provided. The display driver integrated circuit chip may include a source driver circuit configured to process gamma data and generate a driving signal in response to a control signal and a clock signal, a gamma data manager circuit configured to provide the gamma data to the source driver circuit, control logic configured to provide the control signal and the clock signal to the source driver circuit, and a memory configured to store data used to operate the source driver circuit, the gamma data manager circuit and the control logic. A gamma signal line used to transmit the gamma data may include a metal line provided on an area other than an area on which the source driver circuit is disposed.