Patents by Inventor Yun Jin Jung

Yun Jin Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automatic packing apparatus and automatic packing method using the same
    Patent number: 9114897
    Abstract: According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: August 25, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Ho Kim, Byoung Oh Park, Yong Ki Cho, Jong Soo Jeong, Bong Sup Lim, Yun Jin Jung
  • AUTOMATIC PACKING APPARATUS AND AUTOMATIC PACKING METHOD USING THE SAME
    Publication number: 20120079796
    Abstract: According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.
    Type: Application
    Filed: October 5, 2011
    Publication date: April 5, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Ho Kim, Byoung Oh Park, Yong Ki Cho, Jong Soo Jeong, Bong Sup Lim, Yun Jin Jung