Patents by Inventor Yun-Jui HE

Yun-Jui HE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for improved polysilicon etch dimensional control
    Patent number: 12020948
    Abstract: Provided are methods of manufacturing integrated circuit that include a polysilicon etch process in which the wafer having an etch poly pattern is loaded into a reactor chamber and exposed to an activated etchant and, during the etch process, adjusting the temperature conditions within the reactor chamber to increase polymeric deposition on an upper surface of the wafer.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: June 25, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yun-Jui He, Chih-Teng Liao
  • METHOD FOR IMPROVED POLYSILICON ETCH DIMENSIONAL CONTROL
    Publication number: 20230386857
    Abstract: Provided are methods of manufacturing integrated circuit that include a polysilicon etch process in which the wafer having an etch poly pattern is loaded into a reactor chamber and exposed to an activated etchant and, during the etch process, adjusting the temperature conditions within the reactor chamber to increase polymeric deposition on an upper surface of the wafer.
    Type: Application
    Filed: August 10, 2023
    Publication date: November 30, 2023
    Inventors: Yun-Jui HE, Chih-Teng LIAO
  • METHOD FOR IMPROVED POLYSILICON ETCH DIMENSIONAL CONTROL
    Publication number: 20230024640
    Abstract: Provided are methods of manufacturing integrated circuit that include a polysilicon etch process in which the wafer having an etch poly pattern is loaded into a reactor chamber and exposed to an activated etchant and, during the etch process, adjusting the temperature conditions within the reactor chamber to increase polymeric deposition on an upper surface of the wafer.
    Type: Application
    Filed: July 16, 2021
    Publication date: January 26, 2023
    Inventors: Yun-Jui HE, Chih-Teng LIAO