Abstract: The present invention relates to a work method for finishing an inner wall surface of a building, the method comprising the steps of: a) attaching a finishing tape to at least one of a board joint, a wall surface joint, and a wall surface crack section; b) cutting the finishing tape after attaching same by a predetermined length; c) repeating steps a) and b) for a space to be finished; and d) applying a paint to or wallpapering a building inner wall surface including a surface onto which the finishing tape is attached.

Abstract: The present invention relates to a work method for finishing an inner wall surface of a building, the method comprising the steps of: a) attaching a finishing tape to at least one of a board joint, a wall surface joint, and a wall surface crack section; b) cutting the finishing tape after attaching same by a predetermined length; c) repeating steps a) and b) for a space to be finished; and d) applying a paint to or wallpapering a building inner wall surface including a surface onto which the finishing tape is attached.

Abstract: A method and apparatus for regulating the temperature a wafer is provided. The apparatus may include a temperature controlling unit provided within the chamber and regulating the temperature of the wafer; a wafer support pin for adjusting the position of the wafer with respect to the temperature controlling unit; and/or a positioning assembly for adjusting the wafer support pin by which the position of the wafer is controlled. The temperature of a wafer baked at a high temperature may be regulated by performing a series of temperature controlling operation in order to reduce the possibility of fracturing the wafer due to a change in temperature.