Abstract: A method (480, 580) of depositing layers of a thin-film transistor on a substrate using a sputter deposition source comprising at least one first pair of electrodes and at least one second pair of electrodes, the method comprising moving (482, 582) the substrate to a first vacuum chamber; depositing (484, 584) a first layer of the layers on the substrate by supplying the at least one first pair of electrodes with bipolar pulsed DC voltage, wherein a first material of the first layer comprises a first metal oxide; moving (486, 586) the substrate from the first vacuum chamber to a second vacuum chamber without a vacuum break; and depositing (488, 588) a second layer of the layers on the first layer by supplying the at least one second pair of electrodes with bipolar pulsed DC voltage, wherein a second material of the second layer comprises a second metal oxide, the second material being different from the first material.

Abstract: A memory device includes memory cell array and an address decoder. The memory cell array includes a normal memory region and a redundant memory region. The normal memory region operates in response to data signal and plurality of normal memory region signals. The redundant memory region operates in response to data signal and plurality of redundant memory region signals. The address decoder includes normal memory region signal generator and redundant memory region signal generator. The normal memory region signal generator activates first normal memory region signals and redundant memory region signal generator activates first redundant memory region signal simultaneously when address decoder operates in test mode. First normal memory region signals correspond to an address signal and are included in plurality of normal memory region signals. A first redundant memory region signal corresponds to an address signal and is included in the plurality of redundant memory region signals.

Abstract: A memory device includes memory cell array and an address decoder. The memory cell array includes a normal memory region and a redundant memory region. The normal memory region operates in response to data signal and plurality of normal memory region signals. The redundant memory region operates in response to data signal and plurality of redundant memory region signals. The address decoder includes normal memory region signal generator and redundant memory region signal generator. The normal memory region signal generator activates first normal memory region signals and redundant memory region signal generator activates first redundant memory region signal simultaneously when address decoder operates in test mode. First normal memory region signals correspond to an address signal and are included in plurality of normal memory region signals. A first redundant memory region signal corresponds to an address signal and is included in the plurality of redundant memory region signals.

Abstract: A memory device includes a memory array, a plurality of input/output pins, a mask signal generator, an input/output block. The memory array is configured to output read data including a plurality of data bits. The mask signal generator is configured to generate at least one data mask signal. The input/output block is configured to mask bits having a logic level among the plurality of data bits in the read data to output the masked read data to the plurality of input/output pins.

Abstract: A memory device includes a memory array, a plurality of input/output pins, a mask signal generator, an input/output block. The memory array is configured to output read data including a plurality of data bits. The mask signal generator is configured to generate at least one data mask signal. The input/output block is configured to mask bits having a logic level among the plurality of data bits in the read data to output the masked read data to the plurality of input/output pins.