Patents by Inventor Yun Kyoung Jo

Yun Kyoung Jo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board for memory card
    Patent number: 9788438
    Abstract: The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: October 10, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Seol Hee Lim, Yun Kyoung Jo, Ae Rim Kim, Sai Ran Eom, Chang Hwa Park
  • Printed circuit board and method of manufacturing the same
    Patent number: 9661750
    Abstract: Provided is a printed circuit board, including: a circuit pattern or a base pattern formed on an insulating layer; and a plurality of metal layers formed on the circuit pattern or the base pattern, wherein the metal layers includes: a silver metal layer formed of a metal material including silver; a first palladium metal layer formed at a lower part of the silver metal layer; and a second palladium metal layer formed at an upper part of the silver metal layer.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: May 23, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yun Kyoung Jo, Seol Hee Lim, Chang Hwa Park, Sai Ran Eom, Ae Rim Kim
  • HEAT CONVERSION DEVICE
    Publication number: 20150333246
    Abstract: Provided is a heat conversion device, including: a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module includes: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate.
    Type: Application
    Filed: May 13, 2015
    Publication date: November 19, 2015
    Inventors: Jong Min Lee, Sang Gon Kim, Sook Hyun Kim, Chae Hoon Kim, Myoung Lae Roh, Joong Hyun Park, Hyung Min Sohn, Jong Bae Shin, Boone Won, Yong Sang Cho, Yun Kyoung Jo
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150000966
    Abstract: Provided is a printed circuit board, including: a circuit pattern or a base pattern formed on an insulating layer; and a plurality of metal layers formed on the circuit pattern or the base pattern, wherein the metal layers includes: a silver metal layer formed of a metal material including silver; a first palladium metal layer formed at a lower part of the silver metal layer; and a second palladium metal layer formed at an upper part of the silver metal layer.
    Type: Application
    Filed: November 30, 2012
    Publication date: January 1, 2015
    Inventors: Yun Kyoung JO, Seol Hee LIM, Chang Hwa PARK, Sai Ran EOM, Ae Rim KIM
  • PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140369016
    Abstract: Provided is a printed circuit board for a memory card and a method of manufacturing the same, the printed circuit board for the memory card, including: an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.
    Type: Application
    Filed: December 12, 2012
    Publication date: December 18, 2014
    Inventors: Seol Hee Lim, Yun Kyoung Jo, Ae Rim Kim, Sai Ran Eom, Chang Hwa Park