Patents by Inventor Yun Liao

Yun Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11979977
    Abstract: A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.
    Type: Grant
    Filed: August 31, 2019
    Date of Patent: May 7, 2024
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Hsiao-Ting Hsu, Tao-Ming Liao, Ming-Jaan Ho, Xian-Qin Hu, Fu-Yun Shen
  • Publication number: 20240145431
    Abstract: A method includes: attaching a first die and a second die to a substrate, the first die comprising a conductive via; forming a die spacer between the first die and the second die; thinning the first die and the second die, wherein after thinning the first die and the second die, the die spacer protrudes a first height above an upper surface of the first die; depositing an insulating layer over the first die and the second die; planarizing the insulating layer, wherein after planarizing, the insulating layer has a first thickness above the first die and a second thickness above the die spacer; attaching a third die and a fourth die to the first die and the second die; and attaching a support substrate to the third die and the fourth die.
    Type: Application
    Filed: January 6, 2023
    Publication date: May 2, 2024
    Inventors: Yung-Lung Chen, Ming-Yun Liao, Yi-Hsiu Chen, Wen-Chih Chiou
  • Publication number: 20240134164
    Abstract: An optical imaging lens assembly includes six lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The second lens element with negative refractive power has an image-side surface being concave in a paraxial region thereof. The fifth lens element has negative refractive power. The sixth lens element has positive refractive power.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 25, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Cheng-Yuan LIAO, Shu-Yun YANG
  • Publication number: 20240132904
    Abstract: The present invention relates to a method for producing recombinant human prethrombin-2 protein and having human ?-thrombin activity by the plant-based expression systems.
    Type: Application
    Filed: October 16, 2023
    Publication date: April 25, 2024
    Applicant: PROVIEW-MBD BIOTECH CO., LTD.
    Inventors: Yu-Chia CHANG, Jer-Cheng KUO, Ruey-Chih SU, Li-Kun HUANG, Ya-Yun LIAO, Ching-I LEE, Shao-Kang HUNG
  • Patent number: 11964303
    Abstract: The invention provides a method for cargo sorting, configured to control an end effector with a package placement platform to sort the cargo, and the method includes: moving the package placement platform to a package obtaining position and obtaining the cargo to be sorted that enters into the package placement platform; moving the package placement platform to a package storage location; and exerting a first force to push the cargo into a package storage unit. With the help of the package placement platform, the method of the invention can receive the packages of different types or different sizes or different material so as to sort and transport all kinds of packages.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: April 23, 2024
    Inventors: Qiyang Liu, Guillaume Crabé, Hailiang Zhang, Ilia Vasilev, Hongbin Liao, Shimin Xia, Kaixiang Wang, Xinghao Liang, Yuan Li, Jie Shen, Yun Zhao
  • Patent number: 11962714
    Abstract: The present disclosure provides a multipath device working system, including a processor and a touch display module, a control management module, a wireless communication module, a USB module, a microphone, and a loudspeaker that are respectively connected to the processor. The touch display module is configured to display a user operation interface and obtain a control instruction from a user. Both the wireless communication module and the USB module are configured to perform data transmission between the multipath device working system and an external communication device. The control management module is configured to manage a plurality of software communication terminals on the external communication device. The processor is configured to separately perform data processing on data transmitted by the touch display module, the control management module, the wireless communication module, the USB module, the microphone, and the loudspeaker.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: April 16, 2024
    Assignee: YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD.
    Inventor: Yun Liao
  • Publication number: 20240118178
    Abstract: A staining kit is provided, including a first pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, CD8, CD45, and CTLA4; a second pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, dendritic cell, and CD45; a third pattern including antibodies against T cell, B cell, NK cell, monocyte, CD8, CD45, CD45RA, CD62L, CD197, CX3CR1 and TCR??; and a fourth pattern including antibodies against B cell, CD23, CD38, CD40, CD45 and IgM, wherein the antibodies of each pattern are labeled with fluorescent dyes. A method of identifying characterized immune cell subsets of a disease and a method of predicting the likelihood of NPC in a subject in the need thereof using the staining kit are also provided.
    Type: Application
    Filed: October 5, 2022
    Publication date: April 11, 2024
    Applicant: FULLHOPE BIOMEDICAL CO., LTD.
    Inventors: Jan-Mou Lee, Li-Jen Liao, Yen-Ling Chiu, Chih-Hao Fang, Kai-Yuan Chou, Pei-Hsien Liu, Cheng-Yun Lee
  • Patent number: 11641426
    Abstract: A USB phone supporting multi-device conference application includes: a touch display module, an audio processing module, a digital enhanced cordless telecommunications (DECT) module, a Bluetooth module, a USB interface, and an MCU controller. The Bluetooth module is configured to establish a Bluetooth communication connection with an external Bluetooth terminal; the USB interface is configured to establish a USB communication connection with an external intelligent terminal; the DECT module is configured to establish a communication connection with an external wireless headphone; the touch display module is configured to display data, and recognize and obtain a touch operation instruction; the audio processing module is configured to perform audio processing on received audio data; the MCU controller is configured to process received data, further provided with a first mixer and connected to the touch display module, the audio processing module, the DECT module, the Bluetooth module, and the USB interface.
    Type: Grant
    Filed: February 9, 2021
    Date of Patent: May 2, 2023
    Assignee: YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD.
    Inventors: Yingkun Chu, Yun Liao
  • Patent number: 11573871
    Abstract: A debugging method for a Universal Serial Bus (USB) device includes: receiving input information of a terminal through a Human Interface Device (HID) device; when report ID of the input information is a serial port ID, transmitting the input information to a buffer of a virtual serial port Teletype (TTY) device; and extracting the input information of the terminal from the buffer of the virtual serial port TTY device, executing a shell command on the input information, and returning execution result to the terminal through an original path. The method uses a USB interface to implement a HID device, thereby realizing drive-free execution. In addition, use of the endpoint of the HID device can save endpoints needed for additional debugging and driving.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: February 7, 2023
    Assignee: YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD.
    Inventors: Hu Jiang, Yun Liao, Huirong Zhang, Zhizhong Ouyang
  • Publication number: 20220407954
    Abstract: The present disclosure provides a multipath device working system, including a processor and a touch display module, a control management module, a wireless communication module, a USB module, a microphone, and a loudspeaker that are respectively connected to the processor. The touch display module is configured to display a user operation interface and obtain a control instruction from a user. Both the wireless communication module and the USB module are configured to perform data transmission between the multipath device working system and an external communication device. The control management module is configured to manage a plurality of software communication terminals on the external communication device. The processor is configured to separately perform data processing on data transmitted by the touch display module, the control management module, the wireless communication module, the USB module, the microphone, and the loudspeaker.
    Type: Application
    Filed: June 16, 2022
    Publication date: December 22, 2022
    Inventor: Yun Liao
  • Publication number: 20220407952
    Abstract: A dual-mode voice communications system includes a processor, and a first communication connection module, a second communication connection module, and a wireless transceiver module that are separately connected to the processor, where the first communication connection module is configured to realize a communication connection between the dual-mode voice communications system and an Internet Protocol (IP) base station, the second communication connection module is configured to realize a communication connection between the dual-mode voice communications system and an external communications device, the wireless transceiver module is configured to realize a communication connection between the dual-mode voice communications system and a wireless terminal device, and the processor is configured to process data transmitted by the IP base station, the external communications device, and the wireless terminal device.
    Type: Application
    Filed: June 17, 2022
    Publication date: December 22, 2022
    Inventors: Yun Liao, Qi Yang
  • Patent number: 11528156
    Abstract: The present disclosure provides a secondary-stream data transmission method for use in a conference. An electronic device is communicatively connected to a peripheral device, and a virtual display apparatus and a virtual UAC device are virtualized on the electronic device. The virtual UAC device is configured to establish an audio data channel between the electronic device and the peripheral device, to obtain audio data. Image data is obtained from an output interface of a graphics card of the electronic device. If the image data needs to be transmitted to the virtual display apparatus, the image data, or the image data and the audio data are transmitted to the peripheral device, and are transmitted to the outside by the peripheral device. The present disclosure can not only implement compatibility of cross-platform operating systems, but also support different display modes such as duplication and extension.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: December 13, 2022
    Assignee: YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD.
    Inventor: Yun Liao
  • Publication number: 20220377166
    Abstract: A wireless headset includes a first wireless transceiver module, an account processing module, a session control module, a headset module, and a network communication processing module. The first wireless transceiver module is configured to implement data transmission between the wireless headset and a wireless base station via a first wireless communication protocol. The network communication processing module is configured to process a registration instruction sent by the account processing module to obtain a registration request, and send the registration request to the first wireless transceiver module. The first wireless transceiver module sends the registration request to the wireless base station. The network communication processing module is further configured to forward session control data sent by the session control module and media data of the headset module to the first wireless transceiver module.
    Type: Application
    Filed: May 17, 2022
    Publication date: November 24, 2022
    Inventor: Yun Liao
  • Patent number: 11503151
    Abstract: Disclosed are a communication device having a base station function of a Digital Enhanced Cordless Telecommunications (DECT) cellular system, and a communication system. The communication device includes an IP phone and a DECT adapter. The IP phone is connected to the DECT adapter, to form a base station; and the DECT adapter is configured to wirelessly communicate with at least one cordless handset via DECT, so as to register information of the at least one cordless handset with the IP phone. The present application enables the IP phone to be externally connected to the DECT adapter to support a DECT mode, so that the IP phone possesses a base station function of a DECT cellular system. It is not required to deploy multiple different systems. Such an IP phone and other base stations can form a Multi-Cell DECT system, expanding the coverage of a DECT signal.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: November 15, 2022
    Assignee: YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD.
    Inventors: Yingkun Chu, Yun Liao, Lianchang Zhang
  • Patent number: 11470423
    Abstract: This application relates to the technical field of speakers and discloses a speaker assembly. The sound-raising assembly includes a first housing, the first housing forms a cavity. The sound assembly includes a cavity, a diaphragm and an armature member, a perimeter of the diaphragm is connected to an inner wall of the cavity, and a side of the diaphragm is provided with a voice coil, the voice coil for driving the vibration of the diaphragm. The armature member is set relative to the cavity and is located on the side of the diaphragm where the voice coil is set. The present application could improve the sound quality of the speaker.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: October 11, 2022
    Assignee: Anker Innovations Technology Co., Ltd.
    Inventors: Yun Liao, Bo Dong
  • Patent number: 11445146
    Abstract: The present disclosure relates to the field of communications technologies, and specifically, to a video conference terminal and a video conference system. The video conference terminal is provided with a content receiving module (101), an audio and video processing module (102), and a display module (103). To be specific, the video conference terminal (100) has a video conference function, so that the video conference terminal can serve as both an audio conference terminal and a video conference terminal, thereby enriching functions of the video conference terminal. Compared with a conventional conference terminal, the video conference terminal provided in embodiments of the present disclosure has easy deployment, low costs and high utilization as it can serve as a video conference terminal.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: September 13, 2022
    Assignee: YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD.
    Inventors: Yingkun Chu, Yun Liao, Huirong Zhang
  • Publication number: 20210375638
    Abstract: A semiconductor substrate includes a first silicon substrate, an oxide layer, a second silicon substrate, and an epitaxial layer. The oxide layer is disposed on the first silicon substrate. The second silicon substrate is disposed on the oxide layer. The second silicon substrate has a thickness between 10 nm and 10 ?m. The epitaxial layer is disposed on the second silicon substrate.
    Type: Application
    Filed: September 29, 2020
    Publication date: December 2, 2021
    Inventors: Wen-Chung LI, Tsui-Yun LIAO
  • Publication number: 20210368275
    Abstract: This application relates to the technical field of speakers and discloses a speaker assembly. The sound-raising assembly includes a first housing, the first housing forms a cavity. The sound assembly includes a cavity, a diaphragm and an armature member, a perimeter of the diaphragm is connected to an inner wall of the cavity, and a side of the diaphragm is provided with a voice coil, the voice coil for driving the vibration of the diaphragm. The armature member is set relative to the cavity and is located on the side of the diaphragm where the voice coil is set. The present application could improve the sound quality of the speaker.
    Type: Application
    Filed: June 4, 2021
    Publication date: November 25, 2021
    Inventors: Yun Liao, Bo Dong
  • Patent number: 11145507
    Abstract: A method of forming a GaN film includes following steps. A silicon-on-insulator (SOI) substrate is provided. The SOI substrate includes a substrate, an insulator layer and a silicon layer. The insulator layer is disposed on the substrate and the silicon layer is disposed on the insulator layer. The silicon layer is pattered into a patterned silicon layer including a plurality of recessed features. Each recessed feature has a sidewall. A plurality of GaN structures are epitaxially grown from the sidewalls, and the GaN structures are separated from each other. The GaN structures are continuously epitaxially grown vertically and horizontally to merge the GaN structures over top of the patterned silicon layer to form a GaN layer.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: October 12, 2021
    Assignee: WAFER WORKS CORPORATION
    Inventors: Ping-Hai Chiao, Wen-Chung Li, Tsui-Yun Liao
  • Patent number: 11137969
    Abstract: The present disclosure discloses an information interaction method, an information interaction system, and an application thereof, and belongs to the field of electronic whiteboards. In view of the problems in the prior art that an electronic whiteboard in a conference system has a large amount of data to be transmitted, requires a large interaction bandwidth, and has high network requirements, the present disclosure provides an information interaction method: When an image is annotated on the local device, the host serializes the annotation on the local device. The remote device combines the serialized data and corresponding coordinates and pressure sensing values, to calculate and draw an image for display from the data by using a GPU. The interaction method is applied to the electronic whiteboard in the conference system, thereby realizing multi-party real-time interactive whiteboard collaboration, which is supported in both local conferences and teleconferences.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 5, 2021
    Assignee: YEALINK (XIAMEN) NETWORK TECHNOLOGY CO., LTD.
    Inventors: Yingkun Chu, Yun Liao