Patents by Inventor Yun-Lung Huang

Yun-Lung Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sieve for microparticles
    Patent number: 10029280
    Abstract: A sieve for microparticles includes a seat having a chamber and a plurality of boards mounted in the chamber. Each of the plurality of boards includes a first face and a second face opposite to the first face. The first face includes at least one notch. The second face includes at least one groove. The first face of each of the plurality of boards abuts the second face of an adjacent board. The at least one notch and the at least one groove respectively of two adjacent boards are partially aligned and intercommunicated with each other.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: July 24, 2018
    Assignee: Metal Industries Research & Development Centre
    Inventors: Cheng-Han Hung, Zong-Hsin Liu, Ying-Chieh Lin, Ming-Fang Tsai, Chia-Ming Jan, Yun-Lung Huang, Hai-Ching Tsou, Ying-Cheng Lu
  • Sieve for Microparticles
    Publication number: 20180161819
    Abstract: A sieve for microparticles includes a seat having a chamber and a plurality of boards mounted in the chamber. Each of the plurality of boards includes a first face and a second face opposite to the first face. The first face includes at least one notch. The second face includes at least one groove. The first face of each of the plurality of boards abuts the second face of an adjacent board. The at least one notch and the at least one groove respectively of two adjacent boards are partially aligned and intercommunicated with each other.
    Type: Application
    Filed: December 14, 2016
    Publication date: June 14, 2018
    Inventors: Cheng-Han Hung, Zong-Hsin Liu, Ying-Chieh Lin, Ming-Fang Tsai, Chia-Ming Jan, Yun-Lung Huang, Hai-Ching Tsou, Ying-Cheng Lu
  • Contact pad supporting structure and integrated circuit for crack suppresion
    Patent number: 8080881
    Abstract: The invention provides a contact pad supporting structure. The contact pad supporting structure includes an underlying first conductive plate and an overlying second conductive plate, wherein the first and second conductive plates are separated by a first dielectric layer. A plurality of circular ring-shaped via plug groups comprising a plurality of circular ring-shaped via plugs is through the first dielectric layer, electrically connecting to the first and second conductive plates. All of the circular ring-shaped via plugs of each of the circular ring-shaped via plug groups are disorderly arranged.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: December 20, 2011
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Sheng-Hsiung Tsao, Yung-Lung Lin, Yun-Lung Huang
  • CONTACT PAD SUPPORTING STRUCTURE AND INTEGRATED CIRCUIT
    Publication number: 20100176515
    Abstract: The invention provides a contact pad supporting structure. The contact pad supporting structure includes an underlying first conductive plate and an overlying second conductive plate, wherein the first and second conductive plates are separated by a first dielectric layer. A plurality of circular ring-shaped via plug groups comprising a plurality of circular ring-shaped via plugs is through the first dielectric layer, electrically connecting to the first and second conductive plates. All of the circular ring-shaped via plugs of each of the circular ring-shaped via plug groups are disorderly arranged.
    Type: Application
    Filed: April 28, 2009
    Publication date: July 15, 2010
    Applicant: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Sheng-Hsiung TSAO, Yung-Lung LIN, Yun-Lung HUANG