Abstract: A portable bioreactor is provided for driving displacement of at least one stirring sleeve relative to at least one tube cassette in a first direction and includes a machine frame unit and a first elevator. The first elevator includes a first linear movement module, a first transmission module, and a first turning module. The first linear movement module includes a first slider which is slidable on the first guide rail in the first direction between a first top position and a first bottom position. The first turning module is coupled to the first slider through the first transmission module so as to permit turning of the first turning module to be translated by the first transmission module into linear sliding movement of the first slider at a varying speed.

Abstract: A cartridge for a bioreactor adapted for accommodating a plurality of objects includes a cartridge main body defining a plurality of spaced-apart accommodating slots for respectively accommodating the objects therein. The cartridge main body includes a retaining portion extending into at least one of the accommodating slots, and adapted to retain a corresponding one of the objects in a corresponding one of the accommodating slots. The retaining portion is pushable to move resiliently in the corresponding one of the accommodating slots.

Abstract: Provided is a heating mechanism for a biochemical reaction device, including: a heat-conducting body including: at least one accommodating groove each including a chamber and an opening communicating with the chamber; a clamping hole, in communication with the opening and for inserting a reaction tube; and at least one heat-conducting block, movably disposed in the chamber and having one end connected with an elastic element and another opposite end provided with an abutting portion, the elastic element enabling the abutting portion of the heat-conducting block to protrude from the opening and locate in the clamping hole; and a temperature control element connected to the heat-conducting body for heating and regulating a temperature of the heat-conducting block.

Abstract: A portable bioreactor is provided for driving displacement of at least one stirring sleeve relative to at least one tube cassette in a first direction and includes a machine frame unit and a first elevator. The first elevator includes a first linear movement module, a first transmission module, and a first turning module. The first linear movement module includes a first slider which is slidable on the first guide rail in the first direction between a first top position and a first bottom position. The first turning module is coupled to the first slider through the first transmission module so as to permit turning of the first turning module to be translated by the first transmission module into linear sliding movement of the first slider at a varying speed.

Abstract: Provided is a heating mechanism for a biochemical reaction device, including: a heat-conducting body including: at least one accommodating groove each including a chamber and an opening communicating with the chamber; a clamping hole, in communication with the opening and for inserting a reaction tube; and at least one heat-conducting block, movably disposed in the chamber and having one end connected with an elastic element and another opposite end provided with an abutting portion, the elastic element enabling the abutting portion of the heat-conducting block to protrude from the opening and locate in the clamping hole; and a temperature control element connected to the heat-conducting body for heating and regulating a temperature of the heat-conducting block.

Abstract: The present disclosure relates to a heating device and a biochemical reactor having the heating device. The heating device includes an upper plate, a lower plate, a middle plate, and an electric heating element. The upper plate has an upper heating hole, an upper receiving hole, and an upper conductive layer. The lower plate has a lower heating hole, a lower receiving hole, and a first lower conductive layer. The middle plate is disposed between the upper and lower plates and has a middle heating hole and a middle receiving hole. The upper, middle and lower receiving holes are connected together to form a receiving through hole. The electric heating element is disposed in the receiving through hole and has two terminals connected to the upper conductive layer and the lower conductive layer, respectively.

Abstract: A biochemical reactor includes a temperature control device containing a substrate, a first conductive layer, a second conductive layer, a receiving hole, and a heating element. The substrate has a through hole for accommodating the vessel; the receiving hole is adjacent to the through hole for receiving the heating element; the first conductive layer has a connecting region formed on the wall of the through hole; and two terminals of the heating element are respectively connected electrically to the first and the second conductive layers. As such, the heat generated from the heating element can be transferred to the through hole via the first conductive layer to heat the vessel.

Abstract: The present disclosure relates to a heating device and a biochemical reactor having the heating device. The heating device includes an upper plate, a lower plate, a middle plate, and an electric heating element. The upper plate has an upper heating hole, an upper receiving hole, and an upper conductive layer. The lower plate has a lower heating hole, a lower receiving hole, and a first lower conductive layer. The middle plate is disposed between the upper and lower plates and has a middle heating hole and a middle receiving hole. The upper, middle and lower receiving holes are connected together to form a receiving through hole. The electric heating element is disposed in the receiving through hole and has two terminals connected to the upper conductive layer and the lower conductive layer, respectively.

Abstract: A biochemical reactor includes a temperature control device containing a substrate, a first conductive layer, a second conductive layer, a receiving hole, and a heating element. The substrate has a through hole for accommodating the vessel; the receiving hole is adjacent to the through hole for receiving the heating element; the first conductive layer has a connecting region formed on the wall of the through hole; and two terminals of the heating element are respectively connected electrically to the first and the second conductive layers. As such, the heat generated from the heating element can be transferred to the through hole via the first conductive layer to heat the vessel.

Abstract: A method for detecting Bacillus Anthracis comprises steps: obtaining DNA of a sample; respectively mixing the DNA with Primer Sets pXO1, pXO2 and PL3 to form a first reactant mixture, a second reactant mixture and a third reactant mixture, wherein the Primer Sets pXO1, pXO2 and PL3 are respectively sequences specially designed for pXO1, pXO2 and PL3; respectively undertaking PCRs of the first reactant mixture, the second reactant mixture and the third reactant mixture; and detecting whether the sample contains sequences of pXO1, pXO2 and PL3 simultaneously to determine whether the sample contains Bacillus Anthracis. The present invention detects whether the sample contains pXO1, pXO2 and PL3 simultaneously to determine whether the sample contains Bacillus Anthracis and further uses specified primer sets to undertake PCRs and increase the sensitivity and specificity of detection. Thereby is increased the speed and accuracy of detection.

Abstract: A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.

Abstract: A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.

Abstract: A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.

Abstract: A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.

Abstract: A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.

Abstract: A circuit board and a package structure thereof are proposed. The circuit board includes a main body and a solder mask layer covered on a surface of the main body. The circuit board is formed with a cutting path to define a plurality of array-arranged circuit board units, wherein the solder mask layer is formed with a groove at a position corresponding to the cutting path to expose the main body of the circuit board. By such arrangement, when a laser is employed to perform a singulation process after a chip mounting process and a packaging process have been completed on the circuit board unit, the problem wherein the solder mask layer melts on the cutting path of the circuit board due to a thermal effect caused by the laser is avoided, so as to avoid the generation of irregular and uneven surface of the cutting plane. Additionally, chippings on a surface of a substrate can be prevented from being generated, so as to avoid contamination of subsequent processes.

Abstract: A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is formed on the substrate to encapsulate the chip and the passive component, wherein the cutaway corner of the encapsulant is spaced apart from the slanted side of the opening by a predetermined distance. A singulation process is performed to cut the encapsulant to form a package with a chamfer. The package is embedded in a lid to form the semiconductor device, wherein a portion of the substrate located between the slanted side of the opening and the cutaway corner of the encapsulant is exposed from the encapsulant to form an exposed portion. The present invention also provides a carrier for the semiconductor device.