Abstract: A touch sensor is provided. The touch sensor including: first touch electrodes; scan lines connected to the first touch electrodes; and a controller that applies a scan signal to each of the scan lines, wherein the scan signal includes a plurality of unit signals in a first time period and a second time period, and includes a gap signal in a gap period between the first time period and the second time period, and an amplitude of each of the plurality of unit signals is greater than an amplitude of the gap signal.

Abstract: In one example, a semiconductor device includes a first substrate with a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a first substrate conductive structure. An electronic component is coupled to the first substrate top side and coupled to the first substrate conductive structure. A support includes a support wall having a first ledge coupled to the first substrate top side, a first riser coupled to the first substrate lateral side, and a second ledge extending from the first riser away from the first substrate lateral side. Other examples and related methods are also disclosed herein.

Abstract: A display device including a first substrate, a second substrate, a display layer, and a sealing glue is provided. The first substrate includes a conductive pad. The second substrate is opposite to the first substrate. The display layer is disposed between the first substrate and the second substrate. The sealing glue is disposed between the first substrate and the second substrate and surrounds the display layer. The sealing glue has a conductive portion, and the conductive portion is in contact with the conductive pad.

Abstract: An exemplary semiconductor device can comprise (a) a substrate comprising a substrate dielectric structure between the substrate top side and the substrate bottom side, conductive pads at the substrate bottom side, and a substrate cavity through the substrate dielectric structure, (b) a base electronic component comprising inner short bumps; outer short bumps bounding a perimeter around the inner short bumps, and tall bumps between the outer short bumps and an edge of the base component top side, and (c) a mounted electronic component coupled to the inner short bumps of the base electronic component. The tall bumps of the base component can be coupled to the conductive pads of the substrate. The mounted electronic component can be located in the substrate cavity. The substrate bottom side can cover at least a portion of the outer short bumps of the base electronic component. Other examples and related methods are disclosed herein.

Abstract: A display device includes a display region and a periphery region surrounding the display region. The display device includes an driving circuit substrate, a TFT array substrate, a front plane laminate, and multiple conductive wires. The driving circuit substrate includes multiple first conductive pads. The TFT array substrate includes multiple second conductive pads. The TFT array substrate is located on the driving circuit substrate. The TFT array substrate is located between the driving circuit substrate and the front plane laminate. The conductive wires are electrically connected with the first conductive pads and the second conductive pads, respectively. The first conductive pads and the second conductive pads are located in the periphery region.

Abstract: In one example, an electronic device includes a substrate with a substrate first side; a substrate second side opposite to the substrate first side, a substrate lateral side connecting the substrate first side to the substrate second side, a dielectric structure, and a conductive structure. A substrate dock includes a substrate dock base at the substrate first side and a first substrate dock sidewall extending upward from the substrate dock base. The substrate dock base and the first substrate dock sidewall define a substrate dock cavity. A cover structure includes a cover sidewall with a cover sidewall lower side. An interface material couples the cover sidewall to the substrate dock. An electronic component is coupled to the conductive structure. Other examples and related methods are also disclosed herein.

Abstract: A method implements an integrated energy data science platform. The method includes presenting a data discovery component, including a map view to select data using the map view. The method further includes presenting a model selection component to select a machine learning model configured with deployment settings and configured to use the data, wherein the deployment settings identify sample features of the data. The method further includes authorizing access to the machine learning model and the data, deploying the machine learning model using the deployment settings, and presenting results generated from the sample features using the machine learning model, wherein the sample features are extracted from the data.

Abstract: An input sensor includes sensing electrodes, and multiplexers for connecting sensing electrodes corresponding to one group of the sensing electrodes to one output terminal. Each of the multiplexers includes a multiplexer circuit including a plurality of switching transistors, and a shift register array for outputting selection signals for controlling the plurality of switching transistors. Each of the switching transistors includes sub-switching transistors connected in parallel between one of the sensing electrodes corresponding to the one group and the output terminal. The sub-switching transistors are sequentially turned on in response to one of the selection signals.

Abstract: An exemplary semiconductor device can comprise (a) a substrate comprising a substrate dielectric structure between the substrate top side and the substrate bottom side, conductive pads at the substrate bottom side, and a substrate cavity through the substrate dielectric structure, (b) a base electronic component comprising inner short bumps; outer short bumps bounding a perimeter around the inner short bumps, and tall bumps between the outer short bumps and an edge of the base component top side, and (c) a mounted electronic component coupled to the inner short bumps of the base electronic component. The tall bumps of the base component can be coupled to the conductive pads of the substrate. The mounted electronic component can be located in the substrate cavity. The substrate bottom side can cover at least a portion of the outer short bumps of the base electronic component. Other examples and related methods are disclosed herein.

Abstract: An exemplary semiconductor device can comprise (a) a substrate comprising a substrate dielectric structure between the substrate top side and the substrate bottom side, conductive pads at the substrate bottom side, and a substrate cavity through the substrate dielectric structure, (b) a base electronic component comprising inner short bumps; outer short bumps bounding a perimeter around the inner short bumps, and tall bumps between the outer short bumps and an edge of the base component top side, and (c) a mounted electronic component coupled to the inner short bumps of the base electronic component. The tall bumps of the base component can be coupled to the conductive pads of the substrate. The mounted electronic component can be located in the substrate cavity. The substrate bottom side can cover at least a portion of the outer short bumps of the base electronic component. Other examples and related methods are disclosed herein.

Abstract: A narrow border reflective display device includes an driving circuit substrate, a TFT substrate, a front plane laminate, multiple conductive wires, a cover, and a glue. The TFT substrate is located on the driving circuit substrate. The TFT substrate is located between the driving circuit substrate and the front plane laminate. The conductive wires are electrically connected with the driving circuit substrate and the TFT substrate. The cover is located on the front plane laminate. The glue surrounds the driving circuit substrate, the TFT substrate, the front plane laminate, the front plane laminate, and the conductive wires.

Abstract: A display device includes a display region and a periphery region surrounding the display region. The display device includes an driving circuit substrate, a TFT array substrate, a front plane laminate, and multiple conductive wires. The driving circuit substrate includes multiple first conductive pads. The TFT array substrate includes multiple second conductive pads. The TFT array substrate is located on the driving circuit substrate. The TFT array substrate is located between the driving circuit substrate and the front plane laminate. The conductive wires are electrically connected with the first conductive pads and the second conductive pads, respectively. The first conductive pads and the second conductive pads are located in the periphery region.

Abstract: An input sensor includes sensing electrodes, and multiplexers for connecting sensing electrodes corresponding to one group of the sensing electrodes to one output terminal. Each of the multiplexers includes a multiplexer circuit including a plurality of switching transistors, and a shift register array for outputting selection signals for controlling the plurality of switching transistors. Each of the switching transistors includes sub-switching transistors connected in parallel between one of the sensing electrodes corresponding to the one group and the output terminal. The sub-switching transistors are sequentially turned on in response to one of the selection signals.

Abstract: The invention discloses a method and its device for preparing a magnetic core with amorphous ribbon. The magnetic core is prepared with amorphous ribbon, the size of the amorphous ribbon is controlled according to the target requirements, and the magnetic core with required size and shape is prepared according to the target requirements; the single-roller rapid quenching technology with online automatic segmentation and automatic storage capability is used for preparation, which can control the length, width and thickness of the amorphous ribbon according to the target requirements; the amorphous ribbon segmented by single-roller rapid quenching technology is used to spray and cool down one by one, and then air-dry, transfer, spray adhesive and online store it one by one; the stored amorphous ribbon is reshaped, compressed and heat-treated successively, and then demoulded to prepare a magnetic core.

Abstract: In one example, a semiconductor device includes a first substrate with a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a first substrate conductive structure. An electronic component is coupled to the first substrate top side and coupled to the first substrate conductive structure. A support includes a support wall having a first ledge coupled to the first substrate top side, a first riser coupled to the first substrate lateral side, and a second ledge extending from the first riser away from the first substrate lateral side. Other examples and related methods are also disclosed herein.

Abstract: A display device includes: a display panel configured to display an image; an input sensor on the display panel; an approach sensing electrode arranged around the input sensor; and a sensor controller connected to the input sensor and the approach sensing electrode, wherein the sensor controller is configured to drive the input sensor in a first driving mode during a first input sensing frame and to drive the input sensor in a second driving mode during a second input sensing frame, and the sensor controller is further configured to provide an uplink signal to the approach sensing electrode in response to the input sensor operating in the first or second driving mode.

Abstract: A human-cyber-physical resource-oriented adaptive construction method and apparatus for a structured peer-to-peer (P2P) network are provided. The structured P2P network is a point-to-point network with physical perception information and can be effectively used in a human-cyber-physical fusion scenario. The method includes: using a grid aggregation algorithm to calculate the latitude and longitude coordinates of a new node to acquire a position hash value of the new node; determining, according to the position hash value, a registration node of the new node from the existing nodes of the structured P2P network; and completing, according to the information returned by the registration node to the new node, registration of the new node, thereby resulting adding of the registered new node into the structured P2P network.

Abstract: A method and system for accessing a digital object in a Human-Cyber-Physical environment are provided. A P2P network is established based on a distributed hash table (DHT); a Kademlia algorithm is used to establish a forward routing table corresponding to each node; and an index binary tree is established according to a logical distance between each node in the forward routing table and a target node. In a process of transmitting a message from a node of a storage digital object to a root node, all nodes that the message passes establish backward routing tables for the digital object, so that in a data query stage, target data may be found from any node through the forward routing table and the backward routing table, and a data identifier of a data entity in the DHT-based P2P network from a storage location of the data identifier may be decoupled.

Abstract: The invention discloses a method and its device for preparing a magnetic core with amorphous ribbon. The magnetic core is prepared with amorphous ribbon, the size of the amorphous ribbon is controlled according to the target requirements, and the magnetic core with required size and shape is prepared according to the target requirements; the single-roller rapid quenching technology with online automatic segmentation and automatic storage capability is used for preparation, which can control the length, width and thickness of the amorphous ribbon according to the target requirements; the amorphous ribbon segmented by single-roller rapid quenching technology is used to spray and cool down one by one, and then air-dry, transfer, spray adhesive and online store it one by one; the stored amorphous ribbon is reshaped, compressed and heat-treated successively, and then demoulded to prepare a magnetic core.