Patents by Inventor Yun-Meng YEH

Yun-Meng YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9726720
    Abstract: An integrated circuit test device includes a carrying base with a probe station installed thereon, a clamping and positioning mechanism and a cover plate. The clamping and positioning mechanism includes a lower base, an elastic piece, an upper base and a pair of elastic arms. The lower base is arranged corresponding to the probe station. The elastic piece is elastically clamped between the probe station and the lower base. The upper base is stacked on the lower case and disposed with a chip socket. The pair of elastic arms is movably arranged in the chip socket. The cover plate is fixed to the carrying base. The cover plate is disposed with an opening corresponding to the chip socket. A sliding structure (A) is disposed between the pair of elastic arms and the cover plate for enabling the pair of elastic arms to clamp and fix the integrated circuit.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: August 8, 2017
    Assignee: CHENG YUN TECHNOLOGY CO., LTD.
    Inventor: Yun-Meng Yeh
  • Publication number: 20170123002
    Abstract: An integrated circuit test device includes a carrying base with a probe station installed thereon, a clamping and positioning mechanism and a cover plate. The clamping and positioning mechanism includes a lower base, an elastic piece, an upper base and a pair of elastic arms. The lower base is arranged corresponding to the probe station. The elastic piece is elastically clamped between the probe station and the lower base. The upper base is stacked on the lower case and disposed with a chip socket. The pair of elastic arms is movably arranged in the chip socket. The cover plate is fixed to the carrying base. The cover plate is disposed with an opening corresponding to the chip socket. A sliding structure (A) is disposed between the pair of elastic arms and the cover plate for enabling the pair of elastic arms to clamp and fix the integrated circuit.
    Type: Application
    Filed: November 2, 2015
    Publication date: May 4, 2017
    Inventor: Yun-Meng YEH
  • Publication number: 20140266277
    Abstract: A semiconductor testing probe needle for connecting to a circuit board for inspection and to an inspection main board of a testing apparatus includes a conductive shaft having two ends of a connection end and an inspection end for contacting with the circuit board for inspection. A spring column includes one end electrically connected to the connection end of the conductive shaft and another end abuts the inspection main board. A conductive wire is arranged along the spring column and includes one end electrically connected to the conductive shaft and another end provided to be electrically connected to the inspection main board.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: CHENG YUN TECHNOLOGY CO., LTD.
    Inventor: Yun-Meng YEH
  • Publication number: 20140266278
    Abstract: A probe needle for connecting to a circuit board for inspection and to an inspection main board of a testing apparatus includes a conductive shaft having two ends of a connection end and an inspection end for contacting with the circuit board for inspection. An elastic conductive rod is axially connected to the conductive shaft and having two ends of a free end and a fixed end; wherein the free end is connected to the connection end of the conductive shaft and the fixed end abuts the inspection main board. The probe needle has a simplified structure facilitating the manufacturing of parts and assembly thereof.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: CHENG YUN TECHNOLOGY CO., LTD.
    Inventor: Yun-Meng YEH