Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Abstract: A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein the circuit pattern layer includes a corner portion of an upper portion which has a curvature, and wherein the corner portion of the circuit pattern layer is a boundary surface between the top surface and a side surface of the circuit pattern layer, and the boundary surface has a concavely curved surface.

Abstract: A spectrophotometer is provided, which comprises a receiving part diffusing an incident light, a first broadband filter group, and a detector detecting the light having passed through the first broadband filter group, in order to easily select and detect a plurality of lights having specific wavelengths, wherein the first broadband filter group comprises a first broadband filter arranged to have a first angle with respect to an incident direction of light to enable the incident light to pass through a first wavelength band, a second broadband filter arranged to have a second angle, which is different from the first angle, with respect to an incident direction of light to enable the light having passed through the first broadband filter to pass through a second wavelength band, and a first path compensation means for adjusting a path of the light having passed through the second broadband filter to be identical to a path of the light having passed through the first broadband filter, wherein the first broadband

Abstract: Correction of a non-invasive blood glucose measurement measured from a video image. Correction includes irradiating white light on the skin, filtering the white light reflected from the skin by a first wavelength filter and a second wavelength filter, obtaining a first signal including a blood glucose signal and a pulse signal based on a video image generated by the white light filtered by the first wavelength filter, obtaining a second signal including a pulse signal based on a video image generated by the white light filtered by the second wavelength filter, obtaining a blood glucose signal by subtracting the second signal from the first signal, and calculating the amount of blood glucose in a subcutaneous blood vessel based on the obtained blood glucose signal. Moreover, fundamental blood glucose signals can be extracted in real time without collecting blood.

Abstract: A spectrophotometer is provided, which comprises a receiving part diffusing an incident light, a first broadband filter group, and a detector detecting the light having passed through the first broadband filter group, in order to easily select and detect a plurality of lights having specific wavelengths, wherein the first broadband filter group comprises a first broadband filter arranged to have a first angle with respect to an incident direction of light to enable the incident light to pass through a first wavelength band, a second broadband filter arranged to have a second angle, which is different from the first angle, with respect to an incident direction of light to enable the light having passed through the first broadband filter to pass through a second wavelength band, and a first path compensation means for adjusting a path of the light having passed through the second broadband filter to be identical to a path of the light having passed through the first broadband filter, wherein the first broadband

Abstract: A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein the circuit pattern layer includes a corner portion of an upper portion which has a curvature, and wherein the corner portion of the circuit pattern layer is a boundary surface between the top surface and a side surface of the circuit pattern layer, and the boundary surface has a concavely curved surface.

Abstract: Correction of a non-invasive blood glucose measurement measured from a video image. Correction includes irradiating white light on the skin, filtering the white light reflected from the skin by a first wavelength filter and a second wavelength filter, obtaining a first signal including a blood glucose signal and a pulse signal based on a video image generated by the white light filtered by the first wavelength filter, obtaining a second signal including a pulse signal based on a video image generated by the white light filtered by the second wavelength filter, obtaining a blood glucose signal by subtracting the second signal from the first signal, and calculating the amount of blood glucose in a subcutaneous blood vessel based on the obtained blood glucose signal. Moreover, fundamental blood glucose signals can be extracted in real time without collecting blood.

Abstract: A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein a width of a bottom surface of the surface treatment layer is narrower than a width of a top surface of the plating seed layer, wherein the bottom surface of the surface treatment layer includes: a first portion contacted with the circuit pattern layer; and a second portion non contacted with the circuit pattern layer, and wherein a width of a top surface of the circuit pattern layer is narrower than a width of a bottom surface of the circuit pattern layer.

Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and a circuit pattern formed on the insulating layer, wherein the circuit pattern includes a first circuit pattern formed on the insulating layer and including a corner portion of an upper portion which has a predetermined curvature and a second circuit pattern formed on the first circuit pattern and configured to cover an upper surface of the first circuit pattern including the corner portion.