Patents by Inventor Yun Mi Bae

Yun Mi Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250147382
    Abstract: A laser system according to an example of the present disclosure comprises: a supercontinuum laser that generates light with a visible wavelength; a wavelength selector comprising a filter whose angle is adjustable and configured to filter the wavelength of light incident from the supercontinuum laser to have a wavelength corresponding to the angle of the filter based on the angle of the filter; a compressor configured to compress the pulse width of light incident from the wavelength selector; and, a non-linear crystal configured to convert the wavelength of light incident from the compressor into an ultraviolet wavelength.
    Type: Application
    Filed: July 24, 2024
    Publication date: May 8, 2025
    Applicant: iiSM Inc.
    Inventors: IL SEUNG YANG, Yun Mi BAE, Yu Sic KIM, Kwan KYu LEE, Youn Jin KIM, Chang Hyun BAE, Sung Dong KIM, Jong MIn PARK, Yun Ji LEE, Hueng Khon KIM
  • Patent number: 12232273
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: February 18, 2025
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yun Mi Bae, Soon Gyu Kwon, Sang Hwa Kim, Sang Young Lee, Jin Hak Lee, Han Su Lee, Dong Hun Jeong, In Ho Jeong, Dae Young Choi, Jung Ho Hwang
  • Publication number: 20240247780
    Abstract: The present invention provides a light source apparatus and method for integrating diffused light with high efficiency using a collimating including an axicon lens, collimating it, tuning the wavelength of desired light, and passing it.
    Type: Application
    Filed: January 24, 2023
    Publication date: July 25, 2024
    Applicant: IISM INC.
    Inventors: IL SEUNG YANG, YUN MI BAE, YU SIC KIM, SUNG YUN CHO, KWAN KYU LEE, JAE KEUN CHOI, YOUN JIN KIM, CHANG HYUN BAE, SUNG DONG KIM, JONG MIN PARK, YUN JI LEE, SE MIN PARK, HUENG KHON KIM
  • Patent number: 11889634
    Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: January 30, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jung Ho Hwang, Han Su Lee, Dae Young Choi, Soon Gyu Kwon, Dong Hun Jeong, In Ho Jeong, Kil Dong Son, Sang Hwa Kim, Sang Young Lee, Jae Hoon Jeon, Jin Hak Lee, Yun Mi Bae
  • Publication number: 20230337370
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Inventors: Yun Mi BAE, Soon Gyu KWON, Sang Hwa KIM, Sang Young LEE, Jin Hak LEE, Han Su LEE, Dong Hun JEONG, In Ho JEONG, Dae Young CHOI, Jung Ho HWANG
  • Patent number: 11723153
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Grant
    Filed: March 1, 2022
    Date of Patent: August 8, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yun Mi Bae, Soon Gyu Kwon, Sang Hwa Kim, Sang Young Lee, Jin Hak Lee, Han Su Lee, Dong Hun Jeong, In Ho Jeong, Dae Young Choi, Jung Ho Hwang
  • Publication number: 20220240390
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Application
    Filed: March 1, 2022
    Publication date: July 28, 2022
    Inventors: Yun Mi BAE, Soon Gyu KWON, Sang Hwa KIM, Sang Young LEE, Jin Hak LEE, Han Su LEE, Dong Hun JEONG, In Ho JEONG, Dae Young CHOI, Jung Ho HWANG
  • Patent number: 11297720
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: April 5, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yun Mi Bae, Soon Gyu Kwon, Sang Hwa Kim, Sang Young Lee, Jin Hak Lee, Han Su Lee, Dong Hun Jeong, In Ho Jeong, Dae Young Choi, Jung Ho Hwang
  • Publication number: 20210243901
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Application
    Filed: April 21, 2021
    Publication date: August 5, 2021
    Inventors: Yun Mi BAE, Soon Gyu KWON, Sang Hwa KIM, Sang Young LEE, Jin Hak LEE, Han Su LEE, Dong Hun JEONG, In Ho JEONG, Dae Young CHOI, Jung Ho HWANG
  • Patent number: 11019731
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: May 25, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yun Mi Bae, Soon Gyu Kwon, Sang Hwa Kim, Sang Young Lee, Jin Hak Lee, Han Su Lee, Dong Hun Jeong, In Ho Jeong, Dae Young Choi, Jung Ho Hwang
  • Publication number: 20210120677
    Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 22, 2021
    Inventors: Jung Ho HWANG, Han Su LEE, Dae Young CHOI, Soon Gyu KWON, Dong Hun JEONG, In Ho JEONG, Kil Dong SON, Sang Hwa KIM, Sang Young LEE, Jae Hoon JEON, Jin Hak LEE, Yun Mi BAE
  • Patent number: 10912202
    Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: February 2, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jung Ho Hwang, Han Su Lee, Dae Young Choi, Soon Gyu Kwon, Dong Hun Jeong, In Ho Jeong, Kil Dong Son, Sang Hwa Kim, Sang Young Lee, Jae Hoon Jeon, Jin Hak Lee, Yun Mi Bae
  • Publication number: 20200396846
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Application
    Filed: August 28, 2020
    Publication date: December 17, 2020
    Inventors: Yun Mi BAE, Soon Gyu KWON, Sang Hwa KIM, Sang Young LEE, Jin Hak LEE, Han Su LEE, Dong Hun JEONG, In Ho JEONG, Dae Young CHOI, Jung Ho HWANG
  • Patent number: 10798827
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: October 6, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yun Mi Bae, Soon Gyu Kwon, Sang Hwa Kim, Sang Young Lee, Jin Hak Lee, Han Su Lee, Dong Hun Jeong, In Ho Jeong, Dae Young Choi, Jung Ho Hwang
  • Publication number: 20200146156
    Abstract: A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
    Type: Application
    Filed: December 17, 2019
    Publication date: May 7, 2020
    Inventors: Yun Mi BAE, Soon Gyu KWON, Sang Hwa KIM, Sang Young LEE, Jin Hak LEE, Han Su LEE, Dong Hun JEONG, In Ho JEONG, Dae Young CHOI, Jung Ho HWANG
  • Patent number: 10531569
    Abstract: A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein the circuit pattern layer includes a corner portion of an upper portion which has a curvature, and wherein the corner portion of the circuit pattern layer is a boundary surface between the top surface and a side surface of the circuit pattern layer, and the boundary surface has a concavely curved surface.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: January 7, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yun Mi Bae, Soon Gyu Kwon, Sang Hwa Kim, Sang Young Lee, Jin Hak Lee, Han Su Lee, Dong Hun Jeong, In Ho Jeong, Dae Young Choi, Jung Ho Hwang
  • Patent number: 10514298
    Abstract: A spectrophotometer is provided, which comprises a receiving part diffusing an incident light, a first broadband filter group, and a detector detecting the light having passed through the first broadband filter group, in order to easily select and detect a plurality of lights having specific wavelengths, wherein the first broadband filter group comprises a first broadband filter arranged to have a first angle with respect to an incident direction of light to enable the incident light to pass through a first wavelength band, a second broadband filter arranged to have a second angle, which is different from the first angle, with respect to an incident direction of light to enable the light having passed through the first broadband filter to pass through a second wavelength band, and a first path compensation means for adjusting a path of the light having passed through the second broadband filter to be identical to a path of the light having passed through the first broadband filter, wherein the first broadband
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: December 24, 2019
    Inventors: Seung Min Jin, Il Seung Yang, Yun Mi Bae, Seong Oak Park, Yu Sic Kim, Du Cheon Choi, Mu Hyeop Han
  • Patent number: 10251584
    Abstract: Correction of a non-invasive blood glucose measurement measured from a video image. Correction includes irradiating white light on the skin, filtering the white light reflected from the skin by a first wavelength filter and a second wavelength filter, obtaining a first signal including a blood glucose signal and a pulse signal based on a video image generated by the white light filtered by the first wavelength filter, obtaining a second signal including a pulse signal based on a video image generated by the white light filtered by the second wavelength filter, obtaining a blood glucose signal by subtracting the second signal from the first signal, and calculating the amount of blood glucose in a subcutaneous blood vessel based on the obtained blood glucose signal. Moreover, fundamental blood glucose signals can be extracted in real time without collecting blood.
    Type: Grant
    Filed: November 25, 2016
    Date of Patent: April 9, 2019
    Inventors: Seung Min Jin, Il Seung Yang, Yun Mi Bae, Seong Oak Park, Yu Sic Kim, Du Cheon Choi, Mu Hyeop Han
  • Publication number: 20190056268
    Abstract: A spectrophotometer is provided, which comprises a receiving part diffusing an incident light, a first broadband filter group, and a detector detecting the light having passed through the first broadband filter group, in order to easily select and detect a plurality of lights having specific wavelengths, wherein the first broadband filter group comprises a first broadband filter arranged to have a first angle with respect to an incident direction of light to enable the incident light to pass through a first wavelength band, a second broadband filter arranged to have a second angle, which is different from the first angle, with respect to an incident direction of light to enable the light having passed through the first broadband filter to pass through a second wavelength band, and a first path compensation means for adjusting a path of the light having passed through the second broadband filter to be identical to a path of the light having passed through the first broadband filter, wherein the first broadband
    Type: Application
    Filed: December 1, 2016
    Publication date: February 21, 2019
    Inventors: Seung Min Jin, Il Seung Yang, Yun Mi Bae, Seong Oak Park, Yu Sic Kim, Du Cheon Choi, Mu Hyeop Han
  • Publication number: 20180332714
    Abstract: A printed circuit board includes: an insulating layer; a plating seed layer disposed on the insulating layer; a circuit pattern layer disposed on the plating seed layer and formed of copper (Cu); and a surface treatment layer disposed on the circuit pattern layer and formed of gold (Au), wherein the circuit pattern layer includes a corner portion of an upper portion which has a curvature, and wherein the corner portion of the circuit pattern layer is a boundary surface between the top surface and a side surface of the circuit pattern layer, and the boundary surface has a concavely curved surface.
    Type: Application
    Filed: January 24, 2018
    Publication date: November 15, 2018
    Inventors: Yun Mi BAE, Soon Gyu KWON, Sang Hwa KIM, Sang Young LEE, Jin Hak LEE, Han Su LEE, Dong Hun JEONG, In Ho JEONG, Dae Young CHOI, Jung Ho HWANG