Patents by Inventor Yun Mi SONG

Yun Mi SONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND MEMORY CARDS INCLUDING THE SAME
    Publication number: 20160118337
    Abstract: An embedded package includes a chip having a top surface on which a connection member is disposed, a first insulation layer surrounding a portion of the chip, a second insulation layer disposed on the first insulation layer to cover the chip, circuit patterns disposed on a bottom surface of the first insulation layer, a third insulation layer disposed on the bottom surface of the first insulation layer to cover the circuit patterns, an external connection terminal penetrating the third insulation layer to contact any one of the circuit patterns, a metal layer disposed on a top surface of the second insulation layer, a first via penetrating the first insulation layer to electrically couple the connection member to any one of the circuit patterns, and a second via penetrating the first and second insulation layers to electrically couple the metal layer to any one of the circuit patterns.
    Type: Application
    Filed: May 20, 2015
    Publication date: April 28, 2016
    Inventors: Sang Hoon YOON, Ki Il MOON, Myoung Seob KIM, Yun Mi SONG