Abstract: Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board having a cavity and including a circuit pattern at a region which does not have the cavity, an insulation substrate disposed in the cavity while being formed, at an upper portion thereof, with at least one pad, and at least one light emitting device disposed on the pad, wherein a joining structure is disposed between a bottom surface of the cavity and a bottom surface of the insulation substrate.

Abstract: Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board having a cavity and including a circuit pattern at a region which does not have the cavity, an insulation substrate disposed in the cavity while being formed, at an upper portion thereof, with at least one pad, and at least one light emitting device disposed on the pad, wherein a joining structure is disposed between a bottom surface of the cavity and a bottom surface of the insulation substrate.

Abstract: Disclosed is a light emitting module. The light emitting module includes a substrate and a plurality of light emitting devices disposed on the substrate, at least one of the plurality of light emitting devices includes a plurality of light emitting cells which are individually driven, and the plurality of light emitting cells include a light emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and has a light emitting surface emitting light.

Abstract: The lamp unit includes a first substrate, a second substrate provided over the first substrate, a light emitting device provided over the second substrate, a first conductive layer and a second conductive layer provided over the second substrate, and at least one wire electrically coupling at least one of the first conductive layer and the second conductive layer to each of the light emitting device. A protective layer is provided over the first substrate and the second substrate and surrounding the light emitting device and the at least one wire, and the upper surface of the protecting layer is located at a position above the highest point of the at least one wire.

Abstract: A lamp unit may be provided that includes: a first substrate; a second substrate disposed on the first substrate; and a plurality of light sources disposed on the second substrate, wherein at least two light source arrays are provided, in each of which a plurality of the light sources are disposed in a row, and wherein at least a first light source array and a second light source array among the light source arrays are individually driven.

Abstract: An intelligent type lamp and a vehicle lamp apparatus are disclosed. The lamp includes a first substrate, a second substrate disposed on the first substrate, and a plurality of light sources disposed on the second substrate, wherein the light sources are grouped into at least one light source array, in each of which the light sources are disposed in a line, and the at least one light source array includes neighboring first and second light source arrays electrically isolated and individually driven. The light sources of the first light source array may be electrically isolated and individually driven, and the light sources of the second light source array may be electrically isolated and individually driven. Alternatively, the light sources of the first light source array may be electrically isolated and individually driven, and the light sources of the second light source array may be electrically connected and simultaneously driven.

Abstract: Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board having a cavity and including a circuit pattern at a region which does not have the cavity, an insulation substrate disposed in the cavity while being formed, at an upper portion thereof, with at least one pad, and at least one light emitting device disposed on the pad, wherein a joining structure is disposed between a bottom surface of the cavity and a bottom surface of the insulation substrate.

Abstract: Disclosed herein is a light emitting module. The light emitting module according to an exemplary embodiment includes a circuit board which has a cavity and includes a metal board, an insulation layer, and a circuit pattern, an insulation board disposed in the cavity, at least one light emitting device disposed on the insulation board, first and second pads disposed on the insulation board to be electrically connected with the light emitting device, and a conductive pad for electrically connecting the second pad and the circuit pattern.

Abstract: Disclosed is a light emitting module including a light emitting device package having a circuit board having a cavity, an insulation substrate arranged in the cavity, with a conductive pattern formed thereon, and at least one light emitting device disposed on the insulation substrate, with being electrically connected with the conductive pattern; and a glass cover located on the light emitting device package, with lateral surfaces, a top surface and an open bottom surface, wherein the light emitting device package and the circuit board are electrically connected with each other.

Abstract: Disclosed is a light emitting module capable of representing improved heat radiation and improved light collection. there is provided a light emitting module. The light emitting module includes a metallic circuit board formed therein with a cavity, and a light emitting device package including a nitride insulating substrate attached in the cavity of the metallic circuit board, at least one pad part on the nitride insulating substrate, and at least one light emitting device attached on the pad part.