Abstract: A negative electrode binder for rechargeable lithium batteries and a rechargeable lithium battery including the same are disclosed. The binder of negative electrode includes: a unit derived from a first monomer; and a unit derived from a (meth)acrylic monomer as a second monomer. The first monomer includes at least one of a (meth)allyl ether monomer or a (meth)acryl ester monomer, and each of the (meth)allyl ether monomer and the (meth)acryl ester monomer contains an alkyl group having a carbon number of 3 or more and an anionic functional group.

Abstract: The present invention relates to a method for manufacturing an electrostatic chuck, and more specifically, to a method for manufacturing an electrostatic chuck with minimized temperature deviation. The method of the present invention includes: a step S10 of forming a metal layer by depositing metal on a lower portion of a base containing a ceramic material and provided with an ESC electrode at an upper portion thereof; and a step S20 of forming a heater electrode by forming a pattern on the metal layer using a photolithography process.

Abstract: An insulation composition for a high-voltage cable according to an example of the present disclosure includes a base resin, a flame retardant, a cross-linking agent, and other additives. Here, the base resin includes 30 to 60 wt % of a polar ethylene-based copolymer, 20 to 50 wt % of ethylene-propylene rubber or ethylene alpha-olefin, and 10 to 20 wt % of maleic anhydride-modified ethylene-vinyl acetate.

Abstract: A heat pump system for a vehicle cools or heats the vehicle interior by using a natural refrigerant, and efficiently adjusts the temperature of a battery module by using a single chiller that exchanges heat between refrigerant and coolant.

Abstract: Disclosed are an apparatus and a method for compensating for a phase delay of a resolver signal. The apparatus includes an input/output interface, and a processor connected to the input/output interface, wherein the processor receives a command signal and the resolver signal through the input/output interface, calculates a delay time of the resolver signal with respect to the command signal based on the command signal and the resolver signal, calculates a compensation time based on the delay time, and compensates the command signal based on the compensation time.

Abstract: Disclosed is a method of controlling at least one server configured to assign a task to a plurality of robots assisting to a worker. The control method includes generating one or more picking rounds including a plurality of orders with respect to the same shipment, identifying at least one robot corresponding to an idle state as a target robot, selecting a picking round with the highest priority among the one or more picking rounds in progress, assigning the target robot to the selected picking round, selecting a location group matching a picking unit in a waiting state among a plurality of location groups in which locations at which shipments related to the selected picking round are stored are grouped, and assigning the target robot to the selected location group and assigning a picking task to the target robot according to a picking unit matching the selected location group.

Abstract: A junction passage control system based on a location of an OHT using a power line communication, includes: an OHT controller mounted on an OHT which moves along tracks; and a central controller that is installed in a junction section of the tracks and controls junction passing of a plurality of OHTs, wherein power lines are laid on the tracks in a zone from a start point of the junction section to an end point of the junction section, and the central controller and the OHT controller transmit and receive data for a junction passage control through power line communication to and from each other.

Abstract: A cooling apparatus for a power module including a plurality of cooling modules provided to be in contact with each of both surfaces of the power module, in which the cooling module includes a manifold cover provided with a plurality of guide walls extending in a first direction in a state of being spaced apart from each other and a pin plate having one surface being in contact with the power module and having a plurality of pins extending in a second direction crossing the first direction formed on the other surface thereof.

Abstract: Provided is an ultrasonic welding system and a power module package for a power converting apparatus to which a substrate where connection members are ultrasonic welded by using the system is applied, wherein the ultrasonic welding system includes a waffle pack 110 on which connection members 10 to be ultrasonic welded onto a substrate 20 are arranged in a specific form, a centering aligning unit 120 which aligns and centers the connection members 10 transferred from the waffle pack 110, an ultrasonic welding part 130 which fixes the substrate 20 and ultrasonic welds the connection members 10 aligned by the centering aligning unit 120 onto the substrate 20, and a picker 140 which separately picks the connection members 10 from the waffle pack 110 to be transferred to the centering aligning unit 120 and re-picks the aligned connection members 10 from the centering aligning unit 120 to be transferred to ultrasonic welding positions on the substrate 20 fixed to the ultrasonic welding part 130, wherein the connec

Abstract: The present invention relates to a use of a compound of Chemical Formula 1, an isomer thereof, a solvate thereof, a hydrate thereof, or a pharmaceutically acceptable salt thereof as a ferroptosis inhibitor, and a method of inhibiting ferroptosis using the same. The compound of Chemical Formula 1 according to the present invention may exhibit an effect of inhibiting ferroptosis in various cells such as cardiac, renal, nerve, retinal, hepatic or pulmonary cells, and thus it may be effectively used in preventing or treating a ferroptosis-related disease.

Abstract: There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.

Abstract: The invention concerns an adhesive film for stacking chips which enables chips to be stacked in layers without using a separate spacer usually provided to keep a given distance between wires of an upper chip and a lower chip to have the same area. The adhesive film of the invention has an intermediate adhesive layer of thermoplastic phenoxy resin on both side of which a thermosetting adhesive layer of epoxy resin is placed, respectively, to make a three-layer structure, the thermoplastic phenoxy resin comprising UV curable small molecule compounds. The adhesive film of the invention is a multi-layered adhesive film produced by a method of comprising the steps of achieving compatibility on an interface between the thermosetting epoxy resin and thermoplastic phenoxy resin and then directly forming a phenoxy film of a high elastic modulus through UV curing in an adhesive film.