Abstract: The present invention relates to a compound of Formula 1, a preparation method thereof, a pharmaceutical composition comprising the same as an active ingredient, and a use thereof. The compound of Formula 1 according to the present invention can exhibit cell necrosis and ferroptosis inhibitory efficacy in various cells such as heart, kidney, nerve, retina, liver, or lung cells, and accordingly, can be usefully used for prevention or treatment of cell necrosis or ferroptosis-related diseases.

Abstract: The present invention relates to a use of a compound of Chemical Formula 1, an isomer thereof, a solvate thereof, a hydrate thereof, or a pharmaceutically acceptable salt thereof as a ferroptosis inhibitor, and a method of inhibiting ferroptosis using the same. The compound of Chemical Formula 1 according to the present invention may exhibit an effect of inhibiting ferroptosis in various cells such as cardiac, renal, nerve, retinal, hepatic or pulmonary cells, and thus it may be effectively used in preventing or treating a ferroptosis-related disease.

Abstract: There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.

Abstract: The invention concerns an adhesive film for stacking chips which enables chips to be stacked in layers without using a separate spacer usually provided to keep a given distance between wires of an upper chip and a lower chip to have the same area. The adhesive film of the invention has an intermediate adhesive layer of thermoplastic phenoxy resin on both side of which a thermosetting adhesive layer of epoxy resin is placed, respectively, to make a three-layer structure, the thermoplastic phenoxy resin comprising UV curable small molecule compounds. The adhesive film of the invention is a multi-layered adhesive film produced by a method of comprising the steps of achieving compatibility on an interface between the thermosetting epoxy resin and thermoplastic phenoxy resin and then directly forming a phenoxy film of a high elastic modulus through UV curing in an adhesive film.