Patents by Inventor YunPeng XIAO
YunPeng XIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240119206Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.Type: ApplicationFiled: December 14, 2023Publication date: April 11, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph VICTORY, Thomas NEYER, YunPeng XIAO, Hyeongwoo JANG, Peter DINGENEN, Vaclav VALENTA, Mehrdad BAGHAIE YAZDI, Christopher Lawrence REXER, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU, Roman SICKARUK
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Publication number: 20240028801Abstract: Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.Type: ApplicationFiled: October 2, 2023Publication date: January 25, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph VICTORY, Klaus NEUMAIER, YunPeng XIAO, Jonathan HARPER, Vaclav VALENTA, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU
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Patent number: 11880642Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.Type: GrantFiled: September 7, 2022Date of Patent: January 23, 2024Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph Victory, Thomas Neyer, YunPeng Xiao, Hyeongwoo Jang, Peter Dingenen, Vaclav Valenta, Mehrdad Baghaie Yazdi, Christopher Lawrence Rexer, Stanley Benczkowski, Thierry Bordignon, Wai Lun Chu, Roman Sickaruk
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Patent number: 11816405Abstract: Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.Type: GrantFiled: September 7, 2022Date of Patent: November 14, 2023Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph Victory, Klaus Neumaier, YunPeng Xiao, Jonathan Harper, Vaclav Valenta, Stanley Benczkowski, Thierry Bordignon, Wai Lun Chu
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Publication number: 20230004699Abstract: Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.Type: ApplicationFiled: September 7, 2022Publication date: January 5, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph VICTORY, Klaus NEUMAIER, YunPeng XIAO, Jonathan HARPER, Vaclav VALENTA, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU
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Publication number: 20230004700Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.Type: ApplicationFiled: September 7, 2022Publication date: January 5, 2023Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph VICTORY, Thomas NEYER, YunPeng XIAO, Hyeongwoo JANG, Peter DINGENEN, Vaclav VALENTA, Mehrdad BAGHAIE YAZDI, Christopher Lawrence REXER, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU, Roman SICKARUK
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Patent number: 11481532Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.Type: GrantFiled: October 21, 2020Date of Patent: October 25, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph Victory, Thomas Neyer, YunPeng Xiao, Hyeongwoo Jang, Peter Dingenen, Vaclav Valenta, Tirthajyoti Sarkar, Mehrdad Baghaie Yazdi, Christopher Lawrence Rexer, Stanley Benczkowski, Thierry Bordignon, Wai Lun Chu, Roman Sickaruk
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Patent number: 11481533Abstract: Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.Type: GrantFiled: October 21, 2020Date of Patent: October 25, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph Victory, Klaus Neumaier, YunPeng Xiao, Jonathan Harper, Vaclav Valenta, Stanley Benczkowski, Thierry Bordignon, Wai Lun Chu
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Publication number: 20210117598Abstract: Implementations disclosed herein may include receiving from a user a selection of at least one die, a package type, and at least one test condition; generating, using a processor, a product die configuration and a product package configuration using a predictive modeling module and the at least one die and the package type; generating a graphic design system file; generating a package bonding diagram; generating a product spice model of the discrete device product using a technology computer aided design module; generating, using a processor, one or more datasheet characteristics of the discrete device product with the product SPICE model; generating a product datasheet for the discrete device product using the graphic design system file; and using a second interface generated by a computing device to provide access to the graphic design system file, the package bonding diagram, the product datasheet, and the product SPICE model.Type: ApplicationFiled: October 21, 2020Publication date: April 22, 2021Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph VICTORY, Thomas NEYER, YunPeng XIAO, Hyeongwoo JANG, Peter DINGENEN, Vaclav VALENTA, Tirthajyoti SARKAR, Mehrdad BAGHAIE YAZDI, Christopher Lawrence REXER, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU, Roman SICKARUK
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Publication number: 20210117599Abstract: Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.Type: ApplicationFiled: October 21, 2020Publication date: April 22, 2021Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: James Joseph VICTORY, Klaus NEUMAIER, YunPeng XIAO, Jonathan HARPER, Vaclav VALENTA, Stanley BENCZKOWSKI, Thierry BORDIGNON, Wai Lun CHU