Patents by Inventor Yun-Ping CHIU

Yun-Ping CHIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20250056857
    Abstract: An integrated circuit device includes a Janus transition metal dichalcogenide layer, a first gate structure, and a second gate structure. The Janus transition metal dichalcogenide layer has opposite first and second sides. The first gate structure is on the first side of the Janus transition metal dichalcogenide layer. A second gate structure is on the second side of the Janus transition metal dichalcogenide layer.
    Type: Application
    Filed: August 11, 2023
    Publication date: February 13, 2025
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Yuh-Renn WU, Yun-Ping CHIU, Hsin-Wen HUANG, Hsiu-Chi PAI