Abstract: A display panel includes a first substrate, pixel structures, a first common pad, a second substrate, a second common electrode, a display medium and a conductive particle. The pixel structures are disposed on an active area of the first substrate. The first common pad is disposed on a peripheral area of the first substrate, and is electrically connected to first common electrodes of the pixel structures. The second common electrode is disposed on the second substrate. The conductive particle is disposed on the first common pad, and is electrically connected to the first common pad and the second common electrode. The conductive particle includes a core and a conductive film disposed on a surface of the core, where the conductive film has a main portion and raised portions, and a film thickness of each of the raised portions is greater than a film thickness of the main portion.

Abstract: The present disclosure discloses a transceiver apparatus having self-calibration mechanism that includes a signal transmission path, a signal receiving path, a path switching circuit, a transceiver circuit and a self-calibration circuit. The path switching circuit includes a switch to switch a connection relation among an antenna, the signal transmission path and the signal receiving path. The transceiver circuit is coupled to the signal transmission path and the signal receiving path. The self-calibration circuit controls the transceiver circuit to transmit a transmission signal through the signal transmission path to the path switching circuit and receives a leakage signal generated according to the transmission signal through the signal receiving path, so as to perform a self-calibration process on the transceiver circuit based on the transmission signal and the leakage signal. The leakage signal has a leakage signal strength larger than a predetermined level.

Abstract: A method of producing a nanocomposite film includes generating a bilayer film including at least a first layer of at least one nanoparticle and a second layer of at least one material and annealing the bilayer film. A uniform nanocomposite film includes a plurality of nanoparticles dispersed in a polymer matrix, wherein the plurality of nanoparticles form at least 60% by volume of the polymer nanocomposite film.

Abstract: A method of producing a nanocomposite film includes generating a bilayer film including at least a first layer of at least one nanoparticle and a second layer of at least one material and annealing the bilayer film. A uniform nanocomposite film includes a plurality of nanoparticles dispersed in a polymer matrix, wherein the plurality of nanoparticles form at least 60% by volume of the polymer nanocomposite film.

Abstract: A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips.

Abstract: A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes a signal probe and a first conductor corresponding to the signal probe and being electrically connected with the ground probe. An insulation layer is disposed between the first conductor and the signal probe.

Abstract: A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one N-type ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes an N-type signal probe and a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe. An insulation layer is disposed between the first conductor and the N-type signal probe.

Abstract: A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips.

Abstract: An optical inspection device includes a circuit board having at least one first opening, a mounting plate disposed on a top or bottom surface of the circuit board and having at least one second opening corresponding to the at least one first opening respectively, at least one lens holder received in the at least one second opening, and at least one probe module disposed on a bottom surface of the mounting plate or the bottom surface of the circuit board, corresponding to the at least one lens holder respectively, and having probes electrically connected with the circuit board. Each lens holder has an accommodation for accommodating a lens, and is operatable to do a position adjusting motion in the corresponding second opening.