Patents by Inventor YUN-SE OH

YUN-SE OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10121735
    Abstract: A semiconductor device includes active fins on a substrate. Gate lines each extend in the second direction on the active fins. A contact plug is positioned on the active fins. A first via is in one of the first contact plugs. A first conductive line overlaps a first via. A first distance from a first active fin on which a first gate line of the gate lines is formed to an end of the first gate line is more than a predetermined distance. A second distance from a second active fin on which the first gate line is formed to the first active fin of the active fins is equal to or less than the predetermined distance. The second active fin is spaced apart from the first contact plugs to not overlap the first contact plugs.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: November 6, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seon-Ah Nam, Ikuo Nakamatsu, Dong-Hyun Kim, Chul-Hong Park, Yun-Se Oh, Hae-Wang Lee, Ho-Jun Choi
  • Publication number: 20180174953
    Abstract: A semiconductor device includes active fins on a substrate. Gate lines each extend in the second direction on the active fins. A contact plug is positioned on the active fins. A first via is in one of the first contact plugs. A first conductive line overlaps a first via. A first distance from a first active fin on which a first gate line of the gate lines is formed to an end of the first gate line is more than a predetermined distance. A second distance from a second active fin on which the first gate line is formed to the first active fin of the active fins is equal to or less than the predetermined distance. The second active fin is spaced apart from the first contact plugs to not overlap the first contact plugs.
    Type: Application
    Filed: October 26, 2017
    Publication date: June 21, 2018
    Inventors: SEON-AH NAM, IKUO NAKAMATSU, DONG-HYUN KIM, CHUL-HONG PARK, YUN-SE OH, HAE-WANG LEE, HO-JUN CHOI