Patents by Inventor Yun Seong Bae

Yun Seong Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240194610
    Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: December 20, 2023
    Publication date: June 13, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
  • Patent number: D586368
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: February 10, 2009
    Assignee: TAPS International Co., Ltd.
    Inventor: Yun Seong Bae
  • Patent number: D586369
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: February 10, 2009
    Assignee: Taps International Co., Ltd.
    Inventor: Yun Seong Bae
  • Patent number: D586829
    Type: Grant
    Filed: October 23, 2007
    Date of Patent: February 17, 2009
    Assignee: Taps International Co., Ltd.
    Inventor: Yun Seong Bae