Abstract: A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.

Abstract: A thin heat dissipation foil includes a first copper foil, a second copper foil, a plurality of bonding blocks and a working fluid. The first copper foil includes a first bonding surface, the first bonding surface defines a plurality of first receiving cavities and a plurality of first bonding recesses surrounding the first receiving cavities. The second copper foil includes a second bonding surface, the second bonding surface defines a plurality of second receiving cavities corresponding to each of the first receiving cavities. Each bonding block is located in the first bonding recess. The bonding block is configured to bond the first bonding surface and the second bonding surface to form a seamless interface, and each first receiving cavity and each second receiving cavity together form a vacuum tube. The working fluid is received in the vacuum tube.

Abstract: A method for culturing and maintaining a pluripotent stem cell in an undifferentiated state is provided. The method comprises culturing the pluripotent stem cell in a medium comprising an MEK inhibitor, a GSK3 inhibitor, a dual inhibitor of AMPK and/or BMP signaling and LIF. A cell produced by the method, cell culture medium and a kit for performing the method described is also provided.

Abstract: A flexible circuit board includes a first base layer, a circuit layer, a second base layer and a bonding layer. The circuit layer is coupled to a side of the first base layer and includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. The bonding layer couples the second base layer to the circuit layer and defines a first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer. The first opening of the bonding layer and the hollow areas of the circuit layer cooperatively define an air medium layer surrounding the linear signal line. A method for manufacturing the flexible circuit board is also provided.

Abstract: An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening.

Abstract: A use of a Lactobacillus reuteri GMNL-263 in decreasing blood lipid levels is disclosed. Lactobacillus reuteri GMNL-263 (accession No.: CCTCC M 209263) specifically inhibits gene expression related to pro-inflammatory factor and lipid synthesis and promotes gene expression related to cholesterol metabolism. Lactobacillus reuteri GMNL-263 is utilized to produce a composition for decreasing blood lipid levels, thereby achieving the aim of hyperlipidemia treatment.

Abstract: A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.

Abstract: A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.

Abstract: An ejecting mechanism provides an ejecting executing portion driven by an ejecting driving portion for pushing a secondary machine out of a primary machine and for separating a secondary connector and a primary connector connected to each other. It allows the secondary machine to be ejected out of the primary machine automatically and prevents damage of the secondary connector and the primary connector caused by applying an external pulling force on the secondary machine directly. Furthermore, when a first external force overcomes a resilient driving force to push the secondary machine into a slot, the ejecting executing portion contacting with the secondary machine swings toward a rear end of a connecting surface of the primary connector. Additionally, an ejecting locking portion moving with the swing of the ejecting executing portion can be locked by a locking executing portion, such that the automatic ejection of the secondary machine is restrained.

Abstract: A fixture applicable for breaking a circuit board includes: a bottom board, comprising a front side and a back side opposite to the front side; a breaking mechanism, disposed on the front side of the bottom board, and comprising a fixing board and a flap board adjacent to the fixing board, an axis line defined between the fixing board and the flap board, the flap board being flapped along the axis line, and the circuit board being placed on the fixing board and the flap board; a first platen, including a first moving device disposed on a side of the fixing board for fixing the circuit board onto the fixing board by the first moving device; and a second platen, including a second moving device disposed on a side of the flap board for fixing the circuit board onto the flap board by the second moving device.

Abstract: A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first opening spatially corresponding to the single layer electrically conductive circuit area. The adhesive sheet includes a first inner sidewall surrounding the first opening. The second electrically conductive circuit pattern defines a second opening spatially corresponding to the single layer electrically conductive circuit area. The second electrically conductive circuit pattern includes a second inner sidewall surrounding the second opening. The first inner sidewall and the second inner sidewall are not completely coplanar.

Abstract: A flexible printed circuit board (PCB) used for near field communication and a method for manufacturing the flexible PCB are provided. The flexible PCB includes an insulating layer; a first conductive circuit layer adhered on a surface of the insulating layer, the first conductive circuit layer includes at least one first conductive circuit arranged as spiral-shaped and defines a plurality of first spaces; a first resin layer is adhered on a surface of the insulating layer and fills the first spaces; and a first cover layer adhered on a surface of the first resin layer and a surface of the first conductive circuit layer away from the insulating layer.

Abstract: A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.

Abstract: Webpages configured for display on a full-sized screen such as a computer monitor (111) are reconfigured for use with a mobile device in accordance with a user's preferences. A custom rendering tool engages the user in customizing the webpage in order to render the webpage information suitable for display on a mobile device. A browser toolbar is used, by which the user may highlight a section of interest section (121) from a webpage and save the customization information. A proxy server receives the customization information and uses the information to accurately retrieve the sections of interest later, even after the webpage or the section has been updated.

Abstract: A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.

Abstract: A printed circuit board (PCB) and a method for manufacturing the PCB are disclosed. A PCB includes a transparent insulating substrate, a conductive circuit layer 16, and a transparent cover layer. The conductive circuit layer is located between the transparent insulating substrate and the transparent cover layer. The conductive circuit layer includes a first Ni—W alloy pattern layer, a copper pattern layer, and a second Ni—W alloy pattern layer. The first Ni—W alloy pattern layer is adhered with the transparent adhesive layer. Bottom surfaces of the conductive pattern layer are coated by the first Ni—W alloy pattern layer. Top surfaces and side surfaces of conductive pattern layer are coated by the second Ni—W alloy pattern layer.

Abstract: An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening.

Abstract: A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first opening spatially corresponding to the single layer electrically conductive circuit area. The adhesive sheet includes a first inner sidewall surrounding the first opening. The second electrically conductive circuit pattern defines a second opening spatially corresponding to the single layer electrically conductive circuit area. The second electrically conductive circuit pattern includes a second inner sidewall surrounding the second opening. The first inner sidewall and the second inner sidewall are not completely coplanar.

Abstract: A method for manufacturing a multilayer FPCB includes certain steps. A first printed circuit substrate is provided, the first printed circuit substrate includes a first copper layer and a first protective film, the film defining a first opening. A second printed circuit substrate is provided, this substrate includes a second copper layer and a second protective film. The second protective film defines a second opening. The first printed circuit substrate is laminated together with the second printed circuit substrate by an adhesive sheet. The adhesive sheet defines a third opening in communication with and aligned with the first opening and the second opening. The first copper layer is then etched to form a first outer wiring layer and the third copper layer is also etched to form a second outer wiring layer, thereby obtaining a multilayer FPCB.

Abstract: A fixture applicable for breaking a circuit board includes: a bottom board, comprising a front side and a back side opposite to the front side; a breaking mechanism, disposed on the front side of the bottom board, and comprising a fixing board and a flap board adjacent to the fixing board, an axis line defined between the fixing board and the flap board, the flap board being flapped along the axis line, and the circuit board being placed on the fixing board and the flap board; a first platen, including a first moving device disposed on a side of the fixing board for fixing the circuit board onto the fixing board by the first moving device; and a second platen, including a second moving device disposed on a side of the flap board for fixing the circuit board onto the flap board by the second moving device.