Patents by Inventor Yun-sik Yoo

Yun-sik Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD USING THE SAME
    Publication number: 20230395404
    Abstract: A semiconductor package manufacturing apparatus is provided, which comprises a pin holder including a plurality of through holes, a plurality of ejector pins corresponding to the plurality of through holes, a first pin disk including a first protrusion pattern having a first arrangement configured to adjust heights of the plurality of ejector pins, a second pin disk including a second protrusion pattern having a second arrangement configured to adjust the heights of the plurality of ejector pins, and a controller configured to select at least a portion of the plurality of ejector pins to protrude toward an upper portion of the pin holder by selecting one of the first and second pin disks.
    Type: Application
    Filed: April 19, 2023
    Publication date: December 7, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Woo Ram MYUNG, Dae Ung PARK, Oh Chul KWON, Seon Young KIM, Yun-Sik YOO, Jun Ho CHO
  • Substrate treating apparatus and substrate treating method
    Patent number: 9881827
    Abstract: An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: January 30, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Geunwoo Kim, Seunghee Lee, Hyun Kim, Ohchul Kwon, Sangho An, Seonju Oh, Yun-Sik Yoo
  • SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
    Publication number: 20150340263
    Abstract: An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.
    Type: Application
    Filed: May 15, 2015
    Publication date: November 26, 2015
    Inventors: GEUNWOO KIM, SEUNGHEE LEE, Hyun KIM, Ohchul KWON, SANGHO AN, SEONJU OH, Yun-Sik YOO
  • APPARATUS AND METHOD OF DETECTING A DEFECT OF A SEMICONDUCTOR DEVICE
    Publication number: 20140208850
    Abstract: A semiconductor device defect detecting apparatus including: a sensor disposed on semiconductor process equipment, the sensor configured to detect a signal emitted from a semiconductor device in contact with the semiconductor process equipment; and a signal analyzer configured to determine whether the semiconductor device is defective based on the detected signal in a predetermined frequency range.
    Type: Application
    Filed: January 29, 2013
    Publication date: July 31, 2014
    Inventors: Geun-woo Kim, Hyun Kim, Yun-sik Yoo, Sang-jun Kim, Jae-yong Park, Tae-gyeong Chung