Abstract: A plasma processing apparatus includes a chamber in which plasma is generated, a support portion configured to support an object to be processed within the chamber, a head portion within the chamber and opposite to the support portion in a first direction, and a plasma analyzer including: a plurality of light collectors in the head portion, the plurality of light collectors configured to receive light emitted from plasma at a plurality of positions, a spectrometer outside the chamber nd connected to the plurality of light collectors, and a multiplexer connected between the plurality of light collectors and the spectrometer, the multiplexer configured to select one of a plurality of lights transmitted from the plurality of light collectors and transmit the selected one of the plurality of lights to the spectrometer.

Abstract: A sensor apparatus for analyzing plasma in a plasma processing chamber, includes: a first substrate; a second substrate on the first substrate; and a plurality of sensors between the first substrate and the second substrate, the plurality of sensors being spaced apart from each other, wherein each of the plurality of sensors includes: (a) a sensing assembly that includes: (i) a wavelength selector on which light emitted from the plasma is incident and that is configured to separate wavelengths of a spectrum of the light, and (ii) a spectrometer that is optically connected to the wavelength selector and that is configured to detect the spectrum for each separated wavelength; and (b) a battery connected to the sensing assembly and configured to supply first power to the sensing assembly.

Abstract: A sensor device includes a first substrate, a second substrate on the first substrate, a plurality of detection units between the first substrate and the second substrate and configured to collect detection information from plasma formed in a space above the second substrate, a controller configured to generate characteristic data representing characteristics of the plasma based on the detection information collected by the plurality of detection units, and a power supply unit including a radio frequency (RF) energy harvester configured to produce power for operation of at least one of the plurality of detection units and the controller from RF power used to form the plasma.

Abstract: A sensor device includes a lower substrate, an upper substrate disposed on the lower substrate, formed of a material different from a material of the lower substrate, and including a plurality of light-receiving regions disposed in different positions, a plurality of optical members disposed between the lower substrate and the upper substrate, and configured to be generated in a plasma formed in a space above the upper substrate and to provide a traveling path of light entering the plurality of light-receiving regions, a spectrum sensor configured to detect intensity of light received through each of the plurality of optical members in a predetermined wavelength band, a controller configured to generate raw data including intensity of light according to the wavelength band by matching the raw data with each of the plurality of light-receiving regions.

Abstract: The present disclosure relates to calibration apparatuses of sensor devices. An example calibration apparatus of a sensor device includes a housing providing a darkroom space by blocking light from the outside, a lighting unit installed in the darkroom space and configured to output light in a specific wavelength band, a stage on which the sensor device, configured to detect intensity of light output by the lighting unit in at least one measurement position, is mounted, the stage installed below the lighting unit in the darkroom space, and a control device configured to receive raw data including intensity of light measured by the sensor device. The control device generates calibration data for adjusting intensity of light measured at the at least one measurement position.

Abstract: A plasma monitoring system includes a chamber with an interior space, the chamber being configured to perform a semiconductor process on a semiconductor substrate using plasma in the interior space, and the chamber including an optical window, a substrate stage within the chamber to support the semiconductor substrate, a light collecting device on the substrate stage, the light collecting device including a body and light collectors, the body having through holes therethrough, and the light collectors being configured to collect light respectively incident on the through holes from the plasma and to transfer the collected lights onto the optical window, and a light analyzer including a spectrometer that is configured to obtain an optical spectrum from each light irradiated onto the optical window, and to map a state of the plasma from the optical spectrum to correspond to positions of the through holes.

Abstract: An inspection system includes a stage unit configured to load a blank mask thereon. A side illumination unit, which is disposed to face a side surface of the blank mask and includes a plurality of LEDs, is provided. A camera disposed adjacent to the blank mask is provided. An inspection light beam irradiated from the side illumination unit toward the side surface of the blank mask is substantially parallel to an upper surface of the blank mask.

Abstract: Disclosed are a mask treating apparatus and a mask treating method. The mask treating apparatus comprises a process chamber that receives a blank mask package inclusive of a blank mask and performs a process on the blank mask, an unpacking unit that is disposed in the process chamber and unpacks the blank mask package, and a laser marking unit that is disposed in the process chamber and irradiates a laser onto the blank mask to form a fiducial mark.

Abstract: Disclosed are a mask treating apparatus and a mask treating method. The mask treating apparatus comprises a process chamber that receives a blank mask package inclusive of a blank mask and performs a process on the blank mask, an unpacking unit that is disposed in the process chamber and unpacks the blank mask package, and a laser marking unit that is disposed in the process chamber and irradiates a laser onto the blank mask to form a fiducial mark.

Abstract: Disclosed are a mask treating apparatus and a mask treating method. The mask treating apparatus comprises a process chamber that receives a blank mask package inclusive of a blank mask and performs a process on the blank mask, an unpacking unit that is disposed in the process chamber and unpacks the blank mask package, and a laser marking unit that is disposed in the process chamber and irradiates a laser onto the blank mask to form a fiducial mark.

Abstract: Disclosed are a mask treating apparatus and a mask treating method. The mask treating apparatus comprises a process chamber that receives a blank mask package inclusive of a blank mask and performs a process on the blank mask, an unpacking unit that is disposed in the process chamber and unpacks the blank mask package, and a laser marking unit that is disposed in the process chamber and irradiates a laser onto the blank mask to form a fiducial mark.

Abstract: A reflective photomask comprises a photomask substrate, a photomask pattern, formed on an upper surface of the photomask substrate, at least one alignment mark, formed on the upper surface of the photomask substrate, for aligning the reflective photomask with an exposure apparatus, and at least one fiducial mark, formed on a lower surface of the photomask substrate, for determining locations of defects in the photomask pattern.

Abstract: A reflective photomask comprises a photomask substrate, a photomask pattern, formed on an upper surface of the photomask substrate, at least one alignment mark, formed on the upper surface of the photomask substrate, for aligning the reflective photomask with an exposure apparatus, and at least one fiducial mark, formed on a lower surface of the photomask substrate, for determining locations of defects in the photomask pattern.

Abstract: A reflective photomask comprises a photomask substrate, a photomask pattern, formed on an upper surface of the photomask substrate, at least one alignment mark, formed on the upper surface of the photomask substrate, for aligning the reflective photomask with an exposure apparatus, and at least one fiducial mark, formed on a lower surface of the photomask substrate, for determining locations of defects in the photomask pattern.

Abstract: A reflective photomask comprises a photomask substrate, a photomask pattern, formed on an upper surface of the photomask substrate, at least one alignment mark, formed on the upper surface of the photomask substrate, for aligning the reflective photomask with an exposure apparatus, and at least one fiducial mark, formed on a lower surface of the photomask substrate, for determining locations of defects in the photomask pattern.