Patents by Inventor Yun Soung Kim
Yun Soung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11185468Abstract: Methods, systems, and devices are disclosed for monitoring the dispensing of a fluid from a container. In one aspect, a system includes a conformal substrate including a mechanically flexible and an electrically insulative material, the substrate attached and conformed to a container containing a fluid; a data acquisition unit including a sensor and a signal processing circuit formed on the conformal substrate, in which the sensor transduces an occurrence of the fluid dispensing from the container into an electrical signal, and the signal processing circuit amplifies the electrical signal; a data processing unit formed on the conformal substrate and in communication with the data acquisition unit to process the amplified electrical signal as data; and a communications unit formed on the conformal substrate and in communication with the data processing unit to wirelessly transmit the processed data to a remote device.Type: GrantFiled: April 28, 2015Date of Patent: November 30, 2021Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Todd Prentice Coleman, Robert N. Weinreb, Yun Soung Kim, Michael Bajema, Dae Kang, Amr Haj Omar
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Patent number: 11154231Abstract: Disclosed are flexible and stretchable antenna devices, systems and methods of use and manufacture. In some aspects, a flexible and stretchable antenna device includes an adhesive substrate having flexible and stretchable material properties and capable of adhering to a surface of an object; and an antenna attached on or at least partially embedded within the adhesive substrate, the antenna including a radiating element and a ground element, in which one or both of the radiating element and the ground element include a mesh structure allowing the antenna device to transmit or receive wireless communication signals at a predetermined operating frequency while being stretched.Type: GrantFiled: March 13, 2017Date of Patent: October 26, 2021Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Todd Prentice Coleman, Amr Haj-Omar, Yun Soung Kim
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Publication number: 20200255791Abstract: A thin, soft sensor array system that can be deployed over the surfaces of bag bioreactors. The sensor array is fabricated using microfabrication processes along with functionalization methods necessary for measuring pH, glucose, and temperature. Miniature integrated circuit (IC) components are incorporated with the thin-film circuits, allowing for the real-time, on-board data analysis and wireless data communication.Type: ApplicationFiled: February 10, 2020Publication date: August 13, 2020Inventors: Woon-Hong Yeo, Yun-Soung Kim
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Patent number: 10582618Abstract: Disclosed are methods for fabrication of flexible circuits and electronic devices in cost effective manner that can include integration of submicron structures directly onto target substrates compatible with industrial microfabrication techniques. In one aspect, a method to fabricate an electronic device, includes depositing an electrically conductive layer on a processing substrate including a weakly-adhesive interface layer on a support substrate; depositing an insulating layer on the conductive layer to attach to the conductive layer; forming a circuit on the processing substrate by etching selected portions of the conductive layer based on a circuit design; and producing a flexible electronic device by attaching a flexible substrate to the formed circuit on the processing substrate and detaching the circuit and the flexible substrate from the interface layer, in which the flexible electronic device includes the circuit attached to the flexible substrate.Type: GrantFiled: May 18, 2015Date of Patent: March 3, 2020Assignee: The Regents of the University of CaliforniaInventors: Todd Prentice Coleman, Dae Kang, Yun Soung Kim, Mridu Sinha
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Patent number: 10506715Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.Type: GrantFiled: December 19, 2014Date of Patent: December 10, 2019Assignee: The Regents of the University of CaliforniaInventors: Todd Prentice Coleman, Yun Soung Kim, Michael Bajema, Robert N. Weinreb
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Publication number: 20190069788Abstract: Disclosed are flexible and stretchable antenna devices, systems and methods of use and manufacture. In some aspects, a flexible and stretchable antenna device includes an adhesive substrate having flexible and stretchable material properties and capable of adhering to a surface of an object; and an antenna attached on or at least partially embedded within the adhesive substrate, the antenna including a radiating element and a ground element, in which one or both of the radiating element and the ground element include a mesh structure allowing the antenna device to transmit or receive wireless communication signals at a predetermined operating frequency while being stretched.Type: ApplicationFiled: March 13, 2017Publication date: March 7, 2019Inventors: Todd Prentice COLEMAN, Amr HAJ-OMAR, Yun Soung KIM
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Publication number: 20170079144Abstract: Disclosed are methods for fabrication of flexible circuits and electronic devices in cost effective manner that can include integration of submicron structures directly onto target substrates compatible with industrial microfabrication techniques. In one aspect, a method to fabricate an electronic device, includes depositing an electrically conductive layer on a processing substrate including a weakly-adhesive interface layer on a support substrate; depositing an insulating layer on the conductive layer to attach to the conductive layer; forming a circuit on the processing substrate by etching selected portions of the conductive layer based on a circuit design; and producing a flexible electronic device by attaching a flexible substrate to the formed circuit on the processing substrate and detaching the circuit and the flexible substrate from the interface layer, in which the flexible electronic device includes the circuit attached to the flexible substrate.Type: ApplicationFiled: May 18, 2015Publication date: March 16, 2017Inventors: Todd Prentice Coleman, Dae Kang, Yun Soung Kim, Mridu Sinha
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Publication number: 20170046501Abstract: Methods, systems, and devices are disclosed for monitoring the dispensing of a fluid from a container. In one aspect, a system includes a conformal substrate including a mechanically flexible and an electrically insulative material, the substrate attached and conformed to a container containing a fluid; a data acquisition unit including a sensor and a signal processing circuit formed on the conformal substrate, in which the sensor transduces an occurrence of the fluid dispensing from the container into an electrical signal, and the signal processing circuit amplifies the electrical signal; a data processing unit formed on the conformal substrate and in communication with the data acquisition unit to process the amplified electrical signal as data; and a communications unit formed on the conformal substrate and in communication with the data processing unit to wirelessly transmit the processed data to a remote device.Type: ApplicationFiled: April 28, 2015Publication date: February 16, 2017Inventors: Todd Prentice COLEMAN, Robert N. WEINREB, Yun Soung KIM, Michael BAJEMA, Dae KANG, Amr Haj OMAR
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Publication number: 20160330837Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased.Type: ApplicationFiled: December 19, 2014Publication date: November 10, 2016Inventors: Todd Prentice Coleman, Yun Soung Kim, Michael Bajema, Robert N. Weinreb