Patents by Inventor Yun-Tien Chen

Yun-Tien Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8390984
    Abstract: The disclosed is a capacitor substrate structure to reduce the high leakage current and low insulation resistance issue of organic/inorganic hybrid materials with ultra-high dielectric constant. The insulation layer, disposed between two conductive layers, includes multi-layered dielectric layers. At least one of the dielectric layers has high dielectric constant, including high dielectric constant ceramic powder and conductive powder evenly dispersed in organic resin. The other dielectric layers can be organic resin, or further include high dielectric constant ceramic powder dispersed in the organic resin. The substrate has an insulation resistance of about 50K? and leakage current of below 100 ?Amp under operational voltage.
    Type: Grant
    Filed: August 21, 2009
    Date of Patent: March 5, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Shur-Fen Liu, Meng-Huei Chen, Bih-Yih Chen, Yun-Tien Chen
  • Publication number: 20100309607
    Abstract: The disclosed is a capacitor substrate structure to reduce the high leakage current and low insulation resistance issue of organic/inorganic hybrid materials with ultra-high dielectric constant. The insulation layer, disposed between two conductive layers, includes multi-layered dielectric layers. At least one of the dielectric layers has high dielectric constant, including high dielectric constant ceramic powder and conductive powder evenly dispersed in organic resin. The other dielectric layers can be organic resin, or further include high dielectric constant ceramic powder dispersed in the organic resin. The substrate has an insulation resistance of about 50 K? and leakage current of below 100 ?Amp under operational voltage.
    Type: Application
    Filed: August 21, 2009
    Publication date: December 9, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shur-Fen Liu, Meng-Huei Chen, Bih-Yih Chen, Yun-Tien Chen
  • Patent number: 7683522
    Abstract: A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.
    Type: Grant
    Filed: February 11, 2008
    Date of Patent: March 23, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Syh-Yuh Cheng, Yun-Tien Chen, Ra-Min Tain, Shu-Jung Yang
  • Patent number: 7567015
    Abstract: A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: July 28, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Syh-Yuh Cheng, Yun-Tien Chen, Ra-Min Tain, Shu-Jung Yang
  • Publication number: 20080135213
    Abstract: A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.
    Type: Application
    Filed: February 11, 2008
    Publication date: June 12, 2008
    Inventors: Syh-Yuh Cheng, Yun-Tien Chen, Ra-Min Tain, Shu-Jung Yang
  • Publication number: 20070205690
    Abstract: A composite mode transducer for dissipating heat generated by a heat generating element is disclosed. The composite mode transducer includes a transducing module and connection elements. The transducing module includes first and second transducing elements connected in parallel. The connection elements are connected to resonance nodes of the first and second transducing elements. The first and second transducing elements are driven by a multiple-frequency resonance circuit, to produce resonance vibration of composite modes at resonance vibration frequencies of the system. The resulting advantages by using the composite mode transducer are: elimination of local stress concentration, and enhancement of efficiency, endurance and stability of the system. Accordingly, drawbacks of the prior art are overcome. The present invention further provides a cooling device with the composite mode transducer.
    Type: Application
    Filed: November 9, 2006
    Publication date: September 6, 2007
    Inventors: Syh-Yuh Cheng, Yun-Tien Chen, Ra-Min Tain, Shu-Jung Yang
  • Patent number: 6737282
    Abstract: A method for producing a single integrated device containing a plurality of passive elements. The method includes providing a semiconductive ferroelectric substrate, applying a diffusant onto the substrate, and thermally processing the substrate. The ferroelectric material is a substrate with polycrystalline structure or a thin film formed by Ba1-xSrxTiO3 or Sr1-xCaxTiO3 or combinations thereof. Thermal processing is performed by isothermal heating or pulse laser.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: May 18, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Syh-Yuh Cheng, Yun-Tien Chen
  • Publication number: 20030100135
    Abstract: A method for producing a single integrated device containing a plurality of passive elements. The method includes providing a semiconductive ferroelectric substrate, applying a diffusant onto the substrate, and thermally processing the substrate. The ferroelectric material is a substrate with polycrystalline structure or a thin film formed by Ba1-xSrxTiO3 or Sr1-xCaxTiO3 or combinations thereof. Thermal processing is performed by isothermal heating or pulse laser.
    Type: Application
    Filed: August 27, 2002
    Publication date: May 29, 2003
    Inventors: Syh-Yuh Cheng, Yun-Tien Chen
  • Patent number: 5504384
    Abstract: A type of piezoelectric transformer (PT) which vibrates in length extensional mode is provided. The piezoelectric transformer (PT) has a piezoelectric substrate which has a first dimension, a second dimension and a third dimension with the first dimension being longest and the third dimension being shortest. The substrate has two polarization directions parallel to the first dimension near two terminals of the first dimension and at least two opposite polarization directions on a central portion of the substrate transversely to the first dimension. The substrate further has at least two electrodes on a portion horizontal to the first dimension. Comparing with traditional piezoelectric transformers, the new one can solve the polarization difficulties and reduce audio noise output without sacrificing the electrical properties or even have better voltage transformation characteristics.
    Type: Grant
    Filed: November 21, 1994
    Date of Patent: April 2, 1996
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Lin Lee, Syh-Yuh Cheng, Yun-Tien Chen, Shu-Fen Liao, Wen-Chin Yeh
  • Patent number: 5263115
    Abstract: An improved PTC electric heating element assembly comprises a heating element of a ceramic material with positive temperature coefficient, two insulating elements with different thickness, and four metal sheets, which are arranged in a stack to firmly join together by a fastening means fixed on the bottom of a container. The opposite sides of the heating element are contacted by metal sheets having electrodes which are connected to electric wires to effectively conduct the heat produced to the container.
    Type: Grant
    Filed: September 25, 1991
    Date of Patent: November 16, 1993
    Assignee: Industrial Technology Research Institute
    Inventors: Pin-Win Kauo, Ching-Iuan Sheu, Yun-Tien Chen, Suh-Yuh Cheng
  • Patent number: 5045747
    Abstract: An apparatus for poling a piezoelectric ceramic includes a first and a second electrode which are connected to a DC power supply and spaced away from one another at a certain distance, and an insulated medium provided between the first and second electrodes. The second electrode is adapted to carry the piezoelectric ceramic which is spaced away from the first electrode. In this way, a piezoelectric ceramic can be poled by a poling field created between the first and second electrodes and prevented from being scraped by the first electrode or damaged by the ripples caused by an unstable voltage because of the separation of the piezoelectric ceramic to be poled from the first electrode and the buffering effect caused by the insulated medium between the first and second electrodes. In addition, the second electrode may be specifically in the form of a power-driven metal conveyor so that the piezoelectric ceramic to be poled can continuously pass through and be poled by the poling field.
    Type: Grant
    Filed: February 28, 1990
    Date of Patent: September 3, 1991
    Assignee: Industrial Technology Research Institute
    Inventors: Yun-Tien Chen, Syh-Yuh Cheng, Shu-Fen Liao