Patents by Inventor Yun-Tien Liu

Yun-Tien Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip and interface conversion device
    Patent number: 11176074
    Abstract: A chip and an interface conversion device are provided. The chip includes first, second, third, fourth, fifth and sixth pads. The first and second pads are coupled to first and second SBU pins of a USB connector respectively. The fourth and the sixth pads are coupled to first and second pins of an AUX channel of a DP connector respectively. When the chip operates in a first mode, first and second AUX channel signals generated by the chip are transmitted to the third and fifth pads respectively, a voltage of the fourth pad is weakly pulled down, and a voltage of the sixth pad is weakly pulled up. When the chip operates in a second mode, one of the first and second pads is connected to the fourth pad, and the other one of the first and second pads is connected to the sixth pad.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: November 16, 2021
    Assignee: VIA LABS, INC.
    Inventors: Yun-Tien Liu, Cheng-Chung Lin, Hsiao-Chyi Lin, Shao-Yu Chen
  • CHIP AND INTERFACE CONVERSION DEVICE
    Publication number: 20210117355
    Abstract: A chip and an interface conversion device are provided. The chip includes first, second, third, fourth, fifth and sixth pads. The first and second pads are coupled to first and second SBU pins of a USB connector respectively. The fourth and the sixth pads are coupled to first and second pins of an AUX channel of a DP connector respectively. When the chip operates in a first mode, first and second AUX channel signals generated by the chip are transmitted to the third and fifth pads respectively, a voltage of the fourth pad is weakly pulled down, and a voltage of the sixth pad is weakly pulled up. When the chip operates in a second mode, one of the first and second pads is connected to the fourth pad, and the other one of the first and second pads is connected to the sixth pad.
    Type: Application
    Filed: September 17, 2020
    Publication date: April 22, 2021
    Applicant: VIA LABS, INC.
    Inventors: Yun-Tien Liu, Cheng-Chung Lin, Hsiao-Chyi Lin, Shao-Yu Chen