Abstract: A display device includes a semiconductor substrate, an isolation layer, a light-emitting layer and a second electrode. The semiconductor substrate has a pixel region and a peripheral region located around the pixel region. The semiconductor substrate includes first electrodes and a driving element layer. The first electrodes are disposed in the pixel region and the first electrodes are electrically connected to the driving element layer. The isolation layer is disposed on the semiconductor substrate. The isolation layer includes a first isolation pattern disposed in the peripheral region, and the first isolation pattern has a first side surface and a second side surface opposite to the first side surface. The light-emitting layer is disposed on the isolation layer and the first electrodes, and covers the first side surface and the second side surface of the first isolation pattern. The second electrode is disposed on the light-emitting layer.

Abstract: A method includes: displaying an interaction interface of an application, and when a preset operation performed by a user on the interaction interface is detected, decoding to-be-displayed image data of the application into bitmap data, and encapsulating the bitmap data into texture data; storing the texture data in a memory partition accessible to a graphics processing unit GPU; triggering the GPU to read the texture data and perform drawing processing to obtain rendered data; and triggering a display to display an image based on the rendered data.

Abstract: A display device includes a semiconductor substrate, an isolation layer, a light-emitting layer and a second electrode. The semiconductor substrate has a pixel region and a peripheral region located around the pixel region. The semiconductor substrate includes first electrodes and a driving element layer. The first electrodes are disposed in the pixel region and the first electrodes are electrically connected to the driving element layer. The isolation layer is disposed on the semiconductor substrate. The isolation layer includes a first isolation pattern disposed in the peripheral region, and the first isolation pattern has a first side surface and a second side surface opposite to the first side surface. The light-emitting layer is disposed on the isolation layer and the first electrodes, and covers the first side surface and the second side surface of the first isolation pattern. The second electrode is disposed on the light-emitting layer.

Abstract: A display device includes a semiconductor substrate, an isolation layer, a light-emitting layer and a second electrode. The semiconductor substrate has a pixel region and a peripheral region located around the pixel region. The semiconductor substrate includes first electrodes and a driving element layer. The first electrodes are disposed in the pixel region and the first electrodes are electrically connected to the driving element layer. The isolation layer is disposed on the semiconductor substrate. The isolation layer includes a first isolation pattern disposed in the peripheral region, and the first isolation pattern has a first side surface and a second side surface opposite to the first side surface. The light-emitting layer is disposed on the isolation layer and the first electrodes, and covers the first side surface and the second side surface of the first isolation pattern. The second electrode is disposed on the light-emitting layer.

Abstract: Conductive structures and the redistribution circuit structures are disclosed. One of the conductive structures includes a first conductive layer and a second conductive layer. The first conductive layer is disposed in a lower portion of a dielectric layer, and the first conductive layer includes an upper surface with a protrusion at an edge. The second conductive layer is disposed in an upper portion of the dielectric layer and electrically connected to the first conductive layer. An upper surface of the second conductive layer is conformal with the upper surface of the first conductive layer.

Abstract: A display device includes a semiconductor substrate, an isolation layer, a light-emitting layer and a second electrode. The semiconductor substrate has a pixel region and a peripheral region located around the pixel region. The semiconductor substrate includes first electrodes and a driving element layer. The first electrodes are disposed in the pixel region and the first electrodes are electrically connected to the driving element layer. The isolation layer is disposed on the semiconductor substrate. The isolation layer includes a first isolation pattern disposed in the peripheral region, and the first isolation pattern has a first side surface and a second side surface opposite to the first side surface. The light-emitting layer is disposed on the isolation layer and the first electrodes, and covers the first side surface and the second side surface of the first isolation pattern. The second electrode is disposed on the light-emitting layer.

Abstract: Conductive structures and the redistribution circuit structures are disclosed. One of the conductive structures includes a first conductive layer and a second conductive layer. The first conductive layer is disposed in a lower portion of a dielectric layer, and the first conductive layer includes an upper surface with a protrusion at an edge. The second conductive layer is disposed in an upper portion of the dielectric layer and electrically connected to the first conductive layer. An upper surface of the second conductive layer is conformal with the upper surface of the first conductive layer.

Abstract: Redistribution circuit structures and methods of forming the same are disclosed. One of the redistribution circuit structures includes a first conductive structure, a dielectric layer and a second conductive structure. The dielectric layer is disposed over and exposes a portion of the first conductive structure. The second conductive structure is disposed in the dielectric layer to electrically connect to the first conductive structure, and includes a first conductive layer and a second conductive layer disposed on and electrically connected to the first conductive layer. The first conductive layer includes a main portion and a conductive protrusion, the conductive protrusion is disposed on an entire edge of an upper surface of the main portion, and a top of the conductive protrusion is higher than the upper surface of the main portion.

Abstract: Semiconductor packages and methods of forming the same are disclosed. The semiconductor package includes a plurality of chips, a first molding compound, a first redistribution structure, a second molding compound and a second redistribution structure. The first molding compound encapsulates the chips. The first redistribution structure is disposed over the plurality of chips and the first molding compound. The second molding compound surrounds the first molding compound. The second redistribution structure is disposed over the first redistribution structure, the first molding compound and the second molding compound.

Abstract: A method for manufacturing a semiconductor package structure is provided. A semiconductor substrate comprising a conductive pad is provided, wherein the conductive pad is coupled with a circuitry of the semiconductor substrate. A patterned passivation layer exposing a portion of the conductive pad is formed. An uneven surface of the conductive pad is formed. A photoresist is formed on the semiconductor substrate. The photoresist is exposed under a light beam, wherein the light beam is scattered by the uneven surface. The photoresist is developed to form an opening in the photoresist so as to expose the conductive pad and form a plurality of cavities in the remaining photoresist. A conductive material is formed in the opening and the plurality of cavities.

Abstract: A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.

Abstract: A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.

Abstract: A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.

Abstract: A nonlinear diagnostic analysis apparatus includes at least one transducer connected to an examinee's head for transmitting a transmission frequency and feeding back a reflection frequency from the examinee's head through the transducer, a detection unit connected to the transducer to allow the transducer to transmit the transmission frequency and receive the reflection frequency, and a control unit connected to the detection unit. The control unit has a computing unit for computing the reflection frequency and comparing the transmission frequency and reflection frequency to obtain detected information, an essential oils database containing essential oils information and essential oils using methods, such that after the computing unit computes the reflection frequency, the detected information and essential oils database are compared to select suitable type and dosage of the essential oil, and a screen for displaying the detected information and the suggested type and using method of the essential oil.

Abstract: A manufacturing method for a high-temperature-resistant metal-packaged fiber Bragg grating sensor includes using a regenerated fiber Bragg grating obtained via high-temperature annealing as a sensitive element so that the grating will not be erased when used at high temperature. The method also includes using a magnetron sputtering method which makes an optical fiber and metal combine better to form on the surface of the optical fiber an adhesive layer and a conductive layer, thereby causing little damage to optical fiber because of the absence of the processes of coarsening, sensitization, etc. of electroless plating and the fact that the method is performed in an anhydrous environment. After magnetron sputtering, the method includes using an electroplating method to thicken and deposit a protective layer, and embedding the optical fiber in a flexible-structure metallic substrate through the electroplating method to achieve the all-metal package.

Abstract: A method for manufacturing a semiconductor package structure is provided. A semiconductor substrate comprising a conductive pad is provided, wherein the conductive pad is coupled with a circuitry of the semiconductor substrate. A patterned passivation layer exposing a portion of the conductive pad is formed. An uneven surface of the conductive pad is formed. A photoresist is formed on the semiconductor substrate. The photoresist is exposed under a light beam, wherein the light beam is scattered by the uneven surface. The photoresist is developed to form an opening in the photoresist so as to expose the conductive pad and form a plurality of cavities in the remaining photoresist. A conductive material is formed in the opening and the plurality of cavities.

Abstract: A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.

Abstract: A semiconductor package structure includes a first semiconductor substrate including a conductive pad; and a conductive pillar on the conductive pad and disposed between the first semiconductor substrate and a second semiconductor substrate. The conductive pad is coupled with a circuitry of the first semiconductor substrate. The conductive pillar extends along a longitudinal axis and toward the second semiconductor substrate. The conductive pillar includes a sidewall with a rough surface notching toward the longitudinal axis.

Abstract: A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.

Abstract: A semiconductor package structure includes a first semiconductor substrate including a conductive pad; and a conductive pillar on the conductive pad and disposed between the first semiconductor substrate and a second semiconductor substrate. The conductive pad is coupled with a circuitry of the first semiconductor substrate. The conductive pillar extends along a longitudinal axis and toward the second semiconductor substrate. The conductive pillar includes a sidewall with a rough surface notching toward the longitudinal axis.