Abstract: In a method for treating a cancer expressing secreted protein acidic and rich in cysteine (SPARC), a composition including an albumin and at least one cysteine bound thereto is administered to a subject in need thereof. The cancer expressing the SPARC may be at least one selected from the group consisting of a brain tumor, melanoma, breast cancer, rectal cancer and stomach cancer.

Abstract: Disclosed is a motor driving apparatus including: a motor; an inverter including a switching element for driving the motor; a controller for controlling the switching element; a resolver including an excitation winding and a detection winding; and a resolver chip applying an excitation signal to the excitation winding by inputting a periodic signal from the controller, and receiving a feedback signal from the detection winding, wherein the resolver chip determines the number of rotations of the motor based on a change in a pulse width of a detection signal resulting from a comparison between a voltage of the feedback signal and a preset voltage, and output a signal to the inverter for setting an inertial driving control mode according to the number of rotations of the motor in a failure state of the controller.

Abstract: A semiconductor device includes: a semiconductor device, comprising: a bit line structure including a bit line contact plug, a bit line, and a bit line hard mask that are sequentially stacked over a substrate; a storage node contact plug that is spaced apart from the bit line structure; a conformal spacer that is positioned between the bit line and the storage node contact plug and includes a low-k material; and a seed liner that is positioned between the conformal spacer and the bit line and thinner than the conformal spacer.

Abstract: A display device according to one or more embodiments of the disclosure includes a pixel circuit layer including a base layer and circuit elements on the base layer; and a display layer on the pixel circuit layer. The display layer includes a first electrode on the pixel circuit layer; an insulating layer on the first electrode; a second electrode on the insulating layer; a light emitting stacked structure on the second electrode and including a first insulating layer, a second insulating layer, and a light emitting layer between the first insulating layer and the second insulating layer; and a third electrode on the light emitting stacked structure. The light emitting layer includes a two-dimensional material, is separated from the second electrode by the first insulating layer, and is separated from the third electrode by the second insulating layer.

Abstract: Disclosed is an apparatus for excitation signal generation for a resolver. The apparatus includes a sine wave generator that generates a sine wave based on a square wave, an amplifier that amplifies the sine wave, a differential signal generator that converts, into a differential signal, the amplified sine wave, a driver that inputs the differential signal to a coil, and a processor that generates an excitation signal by increasing a voltage of the sine wave from a start voltage to a target voltage through at least one of the sine wave generator and the amplifier based on a transient current that flows into the coil in a transient response interval.

Abstract: Provided are a panel inspection method and apparatus, the panel inspection method including: (a) determining if a variance value of luminance of a captured image of a panel is greater than a reference value, and searching for an original image and at least one secondary reflective image of a defect of the panel if it is determined that the variance value is greater than the reference value; and (b) determining whether the defect is an actual defect or an impurity disposed on the panel based on at least one of a difference in a luminance characteristic between the original image and the secondary reflective image and a number of the searched secondary reflective image.

Abstract: Provided are a panel inspection method and apparatus, the panel inspection method including: (a) determining if a variance value of luminance of a captured image of a panel is greater than a reference value, and searching for an original image and at least one secondary reflective image of a defect of the panel if it is determined that the variance value is greater than the reference value; and (b) determining whether the defect is an actual defect or an impurity disposed on the panel based on at least one of a difference in a luminance characteristic between the original image and the secondary reflective image and a number of the searched secondary reflective image.

Abstract: Provided is a chip mounter for recognizing a Ball Grid Array (BGA) package through a chip mounter. The chip mounter includes a BGA package recognition apparatus which includes an image acquisition unit which acquires image information of a BGA package which includes a plurality of solder balls having n patterns (n?1), a pattern recognition unit which analyzes the image information and outputs information about the BGA package, and a storage unit which stores the information about the BGA package, wherein the pattern recognition unit recognizes the n patterns, selects n seeds respectively corresponding to the n patterns and performs a seed growing operation which groups solder balls which are continuously located adjacent to the seed and have the same pattern as the seed into the same group as the seed, with respect to each of the n seeds.

Abstract: Provided is a method of determining a similarity between a target image and a reference image. The method includes (a) obtaining related approximation pixel-values of the reference image pt having overall relationship between coordinates (x, y) and original pixel-values ft of pixels of the reference image; (b) obtaining related approximation pixel-values of the target image ps having overall relationship between coordinates (x, y) and original pixel-values fs of pixels of the target image; and (c) determining the similarity using the target related approximation pixel-values ps and the reference related approximation pixel-values pt.

Abstract: Provided are a chip mounter and a method for recognizing a Ball Grid Array (BGA) package through a chip mounter. The chip mounter includes a BGA package recognition apparatus which includes an image acquisition unit which acquires image information of a BGA package which includes a plurality of solder balls having n patterns (n?1), a pattern recognition unit which analyzes the image information and outputs information about the BGA package, and a storage unit which stores the information about the BGA package, wherein the pattern recognition unit recognizes the n patterns, selects n seeds respectively corresponding to the n patterns and performs a seed growing operation which groups solder balls which are continuously located adjacent to the seed and have the same pattern as the seed into the same group as the seed, with respect to each of the n seeds.

Abstract: Provided is a method of determining a similarity between a target image and a reference image. The method includes (a) obtaining related approximation pixel-values of the reference image pt having overall relationship between coordinates (x, y) and original pixel-values ft of pixels of the reference image; (b) obtaining related approximation pixel-values of the target image ps having overall relationship between coordinates (x, y) and original pixel-values fs of pixels of the target image; and (c) determining the similarity using the target related approximation pixel-values ps and the reference related approximation pixel-values pt.