Patents by Inventor Yun-Yao Chiu

Yun-Yao Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250142732
    Abstract: The present invention discloses a conductive line repairing method, which at least includes the following steps: a placing step, in which an object having at least one line breaking site is placed on a platform unit of a jet-coating module; a jetting step, in which the jet-coating module is operated to jet and coat a conductive material on the line breaking site; and a solidifying step, in which a solidifying module is operated to have the conductive material solidified, wherein the conductive material, after the solidification, makes the line breaking site conducting. In present invention, the conductive material is jetted and coated on the line breaking site of the object and then solidified to repair a circuit having the line breaking site and to resume the function of electrical conduction thereof to thereby reduce rejected products and restore production yield, achieving an effect of environmental protection.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 1, 2025
    Inventors: YUN-YAO CHIU, KUN-HENG LIN, CHIH-HSUAN CHUANG
  • Publication number: 20060065355
    Abstract: A waste removal laminate layering rapid prototyping machine that embodies mold-releasing paper positioned atop a platform, and a press unit press that binds the mold-releasing paper onto a previous layer of the mold-releasing paper. A protective membrane is torn away from a topmost layer of the mold-releasing paper, whereupon a slicing unit cuts the topmost layer of the mold-releasing paper after having the protective membrane torn away into a preset shape, thereafter the protective membrane is returned, and is press bound atop the topmost layer of the mold-releasing paper, thereby allowing the waste material to adhere to the protective membrane. An adhesive failure unit causes interior waste material of the topmost layer of the mold-releasing paper to lose adhesiveness, thereby disabling from adhering to the previous layer of the mold-releasing paper. By repeating the aforementioned step, manufacturing of products provided with internally complex shapes is achieved.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 30, 2006
    Inventors: Yun-Yao Chiu, Yunn-Shiuan Liao, Hsin-Chih Li