Patents by Inventor Yunbin PU

Yunbin PU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pre-alignment device and method for wafer
    Patent number: 10276417
    Abstract: An apparatus for pre-aligning a wafer comprises: a wafer stage for carrying the wafer, wherein a first alignment mark (W1) and a second alignment mark (W2) are arranged on the wafer such that they are substantially symmetrical to each other with respect to a center of the wafer; a peripheral vision acquisition system (1), configured to perform a first positional compensation for the wafer based on a relative positional relationship of an edge or a notch of the wafer with respect to the wafer stage; and a mark detection system (4), configured to capture images of the first and second alignment marks (W1, W2) and perform a second positional compensation for the wafer by determining a relative positional relationship of the center of the wafer with respect to a center of the wafer stage based on the positions of the first and second alignment marks (W1, W2) in a coordinate system of the mark detection system, wherein the coordinate system of the mark detection system (4) has a horizontal axis (X) defined by a li
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: April 30, 2019
    Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    Inventors: Gang Wang, Yunbin Pu, Shaoyu Wang, Jiaozeng Zheng, Jie Jiang
  • PRE-ALIGNMENT DEVICE AND METHOD FOR WAFER
    Publication number: 20180151400
    Abstract: An apparatus for pre-aligning a wafer comprises: a wafer stage for carrying the wafer, wherein a first alignment mark (W1) and a second alignment mark (W2) are arranged on the wafer such that they are substantially symmetrical to each other with respect to a center of the wafer; a peripheral vision acquisition system (1), configured to perform a first positional compensation for the wafer based on a relative positional relationship of an edge or a notch of the wafer with respect to the wafer stage; and a mark detection system (4), configured to capture images of the first and second alignment marks (W1, W2) and perform a second positional compensation for the wafer by determining a relative positional relationship of the center of the wafer with respect to a center of the wafer stage based on the positions of the first and second alignment marks (W1, W2) in a coordinate system of the mark detection system, wherein the coordinate system of the mark detection system (4) has a horizontal axis (X) defined by a li
    Type: Application
    Filed: April 22, 2016
    Publication date: May 31, 2018
    Inventors: Gang WANG, Yunbin PU, Shaoyu WANG, Jiaozeng ZHENG, Jie JIANG