Patents by Inventor Yundan Wu

Yundan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper-containing conductive pastes and electrodes made therefrom
    Patent number: 10325693
    Abstract: Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: June 18, 2019
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Minfang Mu, Yundan Wu
  • COPPER-CONTAINING CONDUCTIVE PASTES AND ELECTRODES MADE THEREFROM
    Publication number: 20170287587
    Abstract: Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.
    Type: Application
    Filed: August 28, 2014
    Publication date: October 5, 2017
    Inventors: Minfang Mu, Yundan Wu