Abstract: Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.

Abstract: The present invention relates to a thermosetting resin composition and application thereof, said thermosetting resin composition comprising: A: a styrene-butadiene-styrene triblock copolymer having a star-shaped structure; B: a linear olefin resin containing 1,2-ethylene, and a modifier thereof, C: at least one resin or small molecule compound substituted with an acrylic group; taking the total mass of component A, component B, and component C as 100%, the added amount of said component A is 3%-85%, the added amount of said component B is 10%-95%, and the added amount of said component C is 1%-70%. The resin composition provided by the present invention does not undergo phase separation under initiator conditions, and has high heat resistance and a relatively low dielectric constant and dielectric loss tangent value, and is capable of providing the desired dielectric properties and thermal reliability of a copper-clad plate.

Abstract: Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.

Abstract: The present invention relates to a flame-retardant polyphenylene ether resin composition, comprising, by weight percent: (A) 10-45% of a phosphorus-containing polyphenylene ether resin with a number-average molecular weight of 1000-6000; (B) 10-50% of an epoxy resin composition; (C) 10-50% of a cyanate ester resin; and (D) 10-30% of a soluble halogen flame retardant. The present invention adopts a phosphorus-containing polyphenylene ether resin with a low molecular weight that, when used in combination with an epoxy resin, a cyanate ester, and the like, improves the compatibility of the system and reduces a phase separation area of the system, and increases the adhesive force of a plate and enhances the toughness of the plate. The present invention adopts a soluble halogen flame retardant to further enhance the homogeneity of the resin system, and provides better uniformity, increased adhesion, and a lower dielectric constant and dielectric loss of the plate.

Abstract: The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying.

Abstract: Disclosed is a method for preparing a phosphorus-containing polyphenylene oxide resin with a low molecular weight, comprising the steps of: step 1: providing a phosphorus-containing phenolic compound and a raw polyphenylene oxide resin having a number-average molecular weight of more than 10000; step 2: dissolving the raw polyphenylene oxide resin into a solvent to make a solution of the raw polyphenylene oxide resin; step 3: adding the phosphorus-containing phenolic compound into the solution of the raw polyphenylene oxide resin; step 4: introducing an initiator, and carrying out a re-dispersing reaction at a reaction temperature of above 60° C. under the effect of the initiator; and step 5: after the reaction is finished, the product obtained being phosphorus-containing polyphenylene oxide resin with a low molecular weight, the number-average molecular weight thereof being 1000-6000.

Abstract: Disclosed is a method for preparing a phosphorus-containing polyphenylene oxide resin with a low molecular weight, comprising the steps of: step 1: providing a phosphorus-containing phenolic compound and a raw polyphenylene oxide resin having a number-average molecular weight of more than 10000; step 2: dissolving the raw polyphenylene oxide resin into a solvent to make a solution of the raw polyphenylene oxide resin; step 3: adding the phosphorus-containing phenolic compound to into the solution of the raw polyphenylene oxide resin; step 4: introducing an initiator, and carrying out a re-dispersing reaction at a reaction temperature of above 60° C. under the effect of the initiator; and step 5: after the reaction is finished, the product obtained being phosphorus-containing polyphenylene oxide resin with a low molecular weight, the number-average molecular weight thereof being 1000-6000.