Abstract: A high-frequency fast recovery diode that includes a diode chip set, solder lugs, lead wires, lead terminals, a silicone coating layer and a plastic package body. The diode chip set includes n-diode chips arranged in the same polarity order sequentially, a part of the n-diode chips can be fast recovery diode chips and others can be conventional. Solder lugs are placed on both sides of, and connected with, each diode chip. Lead wires are connected with the solder lugs on the ends of the diode chip set, respectively. The silicone coating layer is provided around the diode chip set and the lugs. The plastic package body is provided around the lead terminals and the silicone coating layer. The shape of the plastic package body can be a cylindrical or square column. The reverse recovery time of the high-frequency fast recovery diode can be shortened, and the voltage resistance performance improved.