Patents by Inventor Yung C. Yen

Yung C. Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to make a SOI wafer for IC manufacturing
    Patent number: 5597410
    Abstract: A method to eliminate the sharp edge problem in the bonded wafer technique of the SOI technology is achieved by employing a different dimension of the front surface between the bonding wafer and the holding substrate. A thin film layer with a predetermined thickness is formed to planarize the edge of the finished semiconductor film when the fabrication of the SOI wafer is completed.
    Type: Grant
    Filed: September 15, 1994
    Date of Patent: January 28, 1997
    Inventor: Yung C. Yen