Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer over a semiconductor fin. The method includes forming a second dielectric layer over the first dielectric layer. The method includes exposing a portion of the first dielectric layer. The method includes oxidizing a surface of the second dielectric layer while limiting oxidation on the exposed portion of the first dielectric layer.

Abstract: The present disclosure relates to a polishing pad including a polishing layer. The polishing layer defines a plurality of foaming pores, and a diameter of each of the foaming pores is 1 ?m to 10 ?m. The present disclosure also relates to a method for manufacturing a polishing pad and a polishing apparatus.

Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a second surface. The polishing layer is disposed on the first surface of the base layer and has a plurality of second fibers, a polymeric elastomer and a plurality of pores. The second fibers are arranged irregularly and cross each other to form the pores, and the polymeric elastomer is attached to the second fibers and does not fill the pores.

Abstract: The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.

Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a plurality of first trenches. The first trench has an opening at the first surface. The polishing layer is located on the first surface of the base layer and fills the first trenches. The polishing layer has a plurality of second trenches, the positions of the second trenches correspond to those of the first trenches, and the depth of the second trenches is less than that of the first trenches.

Abstract: The present invention relates to a polishing pad comprising a buffer sheet containing a pressure distribution sheet. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.

Abstract: The present invention relates to a polishing pad comprising a base sheet containing a restriction layer. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.

Abstract: The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.

Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a second surface. The polishing layer is disposed on the first surface of the base layer and has a plurality of second fibers, a polymeric elastomer and a plurality of pores. The second fibers are arranged irregularly and cross each other to form the pores, and the polymeric elastomer is attached to the second fibers and does not fill the pores.

Abstract: The present invention relates to a polishing pad comprising a buffer sheet containing a pressure distribution sheet. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.

Abstract: The present invention relates to a polishing pad with improved slurry retention capacity, which includes a polishing layer. The polishing layer includes an elastomer main body and a plurality of titanium dioxide nanowires. Each of the titanium dioxide nanowires is independent and is distributed evenly and randomly in the elastomer main body. The present invention further provides a polishing apparatus and a method for manufacturing the polishing pad.

Abstract: The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also.

Abstract: The present invention relates to a polishing pad comprising a polishing surface. The polishing surface comprises a first polishing area and a second polishing area. The first polishing area comprises a plurality of first foaming holes, and the second polishing area comprises a plurality of second foaming holes, and an average pore diameter of the first foaming holes is less than an average pore diameter of the second foaming holes. The polishing pad according to the present invention uses the polishing areas with the different pore diameters of the holes to avoid unevenly removing the edge and central part of a substrate when polishing, so that a thickness of the substrate becomes uniform.

Abstract: The present invention relates to a composite polishing pad and a method for making the same. The composite polishing pad includes a cushion layer and a polishing layer. The cushion layer includes a first polymeric elastomer with a hardness of 10 to 70 shore D, and is attached to the polishing layer directly. The polishing layer includes a second polymeric elastomer with a hardness of 30 to 90 shore D, and has a polishing surface for polishing a workpiece. Whereby, the polishing layer will not peel off from the cushion layer easily, so that the polishing quality is raised.

Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.

Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a second surface. The polishing layer is disposed on the first surface of the base layer and has a plurality of second fibers, a polymeric elastomer and a plurality of pores. The second fibers are arranged irregularly and cross each other to form the pores, and the polymeric elastomer is attached to the second fibers and does not fill the pores.

Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a base layer and a polishing layer. The base layer has a first surface and a plurality of first trenches. The first trench has an opening at the first surface. The polishing layer is located on the first surface of the base layer and fills the first trenches. The polishing layer has a plurality of second trenches, the positions of the second trenches correspond to those of the first trenches, and the depth of the second trenches is less than that of the first trenches.

Abstract: The present invention relates to a polishing pad comprising a base sheet containing a restriction layer. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.

Abstract: The present invention relates to a polishing pad comprising a buffer sheet containing a pressure distribution sheet. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.