Patents by Inventor Yung-Chang LIEN

Yung-Chang LIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package structure
    Patent number: 11942439
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring structure and is surrounded by a molding material. The frame is disposed in the molding material and surrounds the substrate. The redistribution layer is disposed over the substrate and electrically coupled to the wiring structure. The first semiconductor die is disposed over the redistribution layer.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: March 26, 2024
    Assignee: MediaTek Inc.
    Inventors: Tzu-Hung Lin, Yung-Chang Lien
  • SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20220278055
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring structure and is surrounded by a molding material. The frame is disposed in the molding material and surrounds the substrate. The redistribution layer is disposed over the substrate and electrically coupled to the wiring structure. The first semiconductor die is disposed over the redistribution layer.
    Type: Application
    Filed: May 13, 2022
    Publication date: September 1, 2022
    Applicant: MediaTek Inc.
    Inventors: Tzu-Hung Lin, Yung-Chang Lien
  • Semiconductor package structure
    Patent number: 11362044
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring structure and is surrounded by a molding material. The frame is disposed in the molding material and surrounds the substrate. The redistribution layer is disposed over the substrate and electrically coupled to the wiring structure. The first semiconductor die is disposed over the redistribution layer.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: June 14, 2022
    Assignee: MediaTek Inc.
    Inventors: Tzu-Hung Lin, Yung-Chang Lien
  • SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20200273812
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate has a wiring structure and is surrounded by a molding material. The frame is disposed in the molding material and surrounds the substrate. The redistribution layer is disposed over the substrate and electrically coupled to the wiring structure. The first semiconductor die is disposed over the redistribution layer.
    Type: Application
    Filed: May 13, 2020
    Publication date: August 27, 2020
    Inventors: Tzu-Hung LIN, Yung-Chang LIEN